Polishing pad conditioning apparatus

Patent metadata

Field	Value
Publication number	US-11618126-B2
Application number	US-202016921092-A
Country	US
Kind code	B2
Filing date	Jul 6, 2020
Priority date	Aug 30, 2019
Publication date	Apr 4, 2023
Grant date	Apr 4, 2023

Abstract

A polishing pad conditioning apparatus includes a base, a fiber, and a polymer protruding from a surface of the base and encompassing the fiber.

First claim

What is claimed is:

1. An apparatus for conditioning a semiconductor wafer polishing pad, comprising:
a base;
a first fiber;
a second fiber; and
a first polymer structure protruding from a surface of the base and encompassing the first fiber such that the first fiber protrudes from and over the first polymer structure and a bottommost surface of the first fiber is below a topmost surface of the first polymer structure, and
a second polymer structure protruding from the surface of the base and encompassing the second fiber such that the second fiber protrudes from and over the second polymer structure and a bottommost surface of the second fiber is below a topmost surface of the second polymer structure, wherein the first polymer structure is separated from the second polymer structure.

2. The apparatus of claim 1 , wherein the first fiber is a carbon fiber.

3. The apparatus of claim 1 , wherein the first polymer structure encircles the first fiber.

4. The apparatus of claim 1 , wherein the first fiber protrudes from the surface of the base.

5. The apparatus of claim 1 , wherein:
the first polymer structure protrudes a first distance from the surface of the base,
the first fiber protrudes a second distance from the surface of the base, and
the first distance is less than the second distance.

6. An apparatus for conditioning a semiconductor wafer polishing pad, comprising:
a base; and
a first protrusion protruding from a surface of the base, wherein:
a first portion of the first protrusion comprises a polymer,
a second portion of the first protrusion comprises carbon,
the first portion comprises a tip portion having a tapered sidewall, and
the first portion has a different material composition than the second portion.

7. The apparatus of claim 6 , wherein the polymer comprises polyetheretherketone.

8. The apparatus of claim 6 , wherein the first portion of the first protrusion surrounds the second portion of the first protrusion.

9. The apparatus of claim 6 , wherein:
the first portion of the first protrusion protrudes a first distance from the surface of the base,
the second portion of the first protrusion protrudes a second distance from the surface of the base, and
the second distance is different than the first distance.

10. The apparatus of claim 6 , comprising:
a second protrusion protruding from the surface of the base, wherein:
the first protrusion protrudes a first distance from the surface of the base,
the second protrusion protrudes a second distance from the surface of the base, and
the second distance is greater than the first distance.

11. An apparatus for conditioning a semiconductor wafer polishing pad, comprising:
a base;
a first cluster of protrusions protruding from a surface of the base at a first location on the base, wherein:
within the first cluster of protrusions, a first protrusion protrudes a first distance from the surface of the base and a second protrusion protrudes a second distance from the surface of the base,
the second distance is different than the first distance, and
the first protrusion and the second protrusion comprise a same composition of materials; and

a second cluster of protrusions protruding from the surface of the base at a second location on the base, different than the first location on the base.

12. The apparatus of claim 11 , wherein the first protrusion comprises a polymer encompassing a carbon fiber.

13. The apparatus of claim 12 , wherein the polymer comprises polyetheretherketone.

14. The apparatus of claim 12 , wherein:
the polymer protrudes a third distance from the surface of the base,
the carbon fiber protrudes the first distance from the surface of the base, and
the first distance is greater than the third distance.

15. The apparatus of claim 11 , wherein:
the base is disk shaped such that a perimeter of the base defines a circle,
the first cluster of protrusions is located a first radial distance from a center of the circle,
the second cluster of protrusions is located a second radial distance from the center of the circle, and
the first radial distance is greater than the second radial distance.

16. The apparatus of claim 11 , comprising:
a first plurality of clusters of protrusions, including the first cluster of protrusions; and
a second plurality of clusters of protrusions, including the second cluster of protrusions, wherein:
the base is disk shaped such that a perimeter of the base defines a circle,
the first plurality of clusters of protrusions forms a first circle a first radial distance from the perimeter of the base,
the second plurality of clusters of protrusions forms a second circle a second radial distance from the perimeter of the base, and
the first radial distance is greater than the second radial distance.

17. The apparatus of claim 11 , wherein:
the first protrusion comprises a first polymer encompassing a first carbon fiber, and
the second protrusion comprises a second polymer encompassing a second carbon fiber.

18. The apparatus of claim 17 , wherein at least one of:
a first end of the first protrusion distal from the surface of the base is not covered by the first polymer, or
a second end of the second protrusion distal from the surface of the base is not covered by the second polymer.

19. The apparatus of claim 11 , wherein:
the first protrusion comprises a first portion comprising a polymer and a second portion comprising carbon, and
the first portion comprises a tip portion having a tapered sidewall.

20. The apparatus of claim 1 , wherein the first fiber and the first polymer structure are both in contact with the base.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Cheng-Ping
• Chen Shih-Chung
• Peng Sheng-Tai
• Chen Hung-Lin

Classifications

• B24D13/145

  having a brush-like working surface · CPC title

• B24D13/10

  comprising assemblies of brushes · CPC title

• B24B37/20 Primary

  Lapping pads for working plane surfaces · CPC title

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title