Molded solder and molded solder production method

Patent metadata

Field	Value
Publication number	US-11618108-B2
Application number	US-201916576700-A
Country	US
Kind code	B2
Filing date	Sep 19, 2019
Priority date	Sep 28, 2018
Publication date	Apr 4, 2023
Grant date	Apr 4, 2023

Abstract

Molded solder includes first metal powder and second metal powder. The first metal powder has a first solidus temperature and a first liquidus temperature and includes an alloy containing metal elements. The second metal powder has a melting temperature or a second solidus temperature and a second liquidus temperature and includes single metal element or an alloy containing metal elements. The melting temperature and the second liquidus temperature are higher than the first liquidus temperature. The molded solder is so constructed that a mixture of the first metal powder and the second metal powder are press-molded. The molded solder is so constructed that a first solidus temperature of a solder becomes higher when the molded solder becomes the solder after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature.

First claim

What is claimed is:

1. A molded solder consisting of:
a first metal powder having a first solidus temperature and a first liquidus temperature, the first metal powder is a metal powder made of Sn-50In solder alloy;
a second metal powder having a second solidus temperature and a second liquidus temperature, the second metal powder is a metal powder made of Sn-3.0Ag-0.5Cu solder alloy, the second liquidus temperature being higher than the first liquidus temperature;
the first metal powder and the second metal powder are contained in a mass ratio of 20:80 to 50:50;
the molded solder being constructed so that a mixture of the first metal powder and the second metal powder are press-molded;
the molded solder being constructed so that a solidus temperature of the molded solder becomes higher after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature; and
an absolute value (H1′) of a heat flow (H1) at a temperature (T) indicating an initial endothermic peak of a differential scanning calorimetry before heating the molded solder at a temperature equal to or higher than the first liquidus temperature and an absolute value (H2′) of a heat flow (H2) at the temperature (T) of a differential scanning calorimetry after heating the molded solder satisfy the following formula (1):
( H 2′)/( H 1′)≤0.2  (1).

2. The molded solder according to claim 1 , wherein
a temperature difference between the first liquidus temperature and the second liquidus temperature is 50° C. or higher.

3. A molded solder consisting of:
a first metal powder having a first solidus temperature and a first liquidus temperature, the first metal powder is a metal powder made of Sn-3.0Ag-0.5Cu solder alloy;
a second metal powder having a melting temperature, the second metal powder is a metal powder of Cu, the melting temperature being higher than the first liquidus temperature;
the first metal powder and the second metal powder are contained in a mass ratio of 20:80 to 50:50;
the molded solder being constructed so that a mixture of the first metal powder and the second metal powder are press-molded; and
the molded solder being constructed so that a solidus temperature of the molded solder becomes higher after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature.

4. The molded solder according to claim 3 , wherein
a temperature difference between the first liquidus temperature and the melting temperature is 50° C. or higher.

5. The molded solder according to claim 3 , wherein
an absolute value (H1′) of a heat flow (H1) at a temperature (T) indicating an initial endothermic peak of a differential scanning calorimetry before heating the molded solder at a temperature equal to or higher than the first liquidus temperature and an absolute value (H2′) of a heat flow (H2) at the temperature (T) of a differential scanning calorimetry after heating the molded solder satisfy the following formula (1):
( H 2′)/( H 1′)≤0.2  (1).

6. A molded solder consisting of:
a first metal powder having a first solidus temperature and a first liquidus temperature, the first metal powder is a metal powder made of Sn-50In solder alloy;
a second metal powder having a melting temperature, the second metal powder is a metal powder of Cu, the melting temperature being higher than the first liquidus temperature;
the first metal powder and the second metal powder are contained in a mass ratio of 30:70 to 60:40;
the molded solder being constructed so that a mixture of the first metal powder and the second metal powder are press-molded; and
the molded solder being constructed so that a solidus temperature of the molded solder becomes higher after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature.

7. The molded solder according to claim 6 , wherein
a temperature difference between the first liquidus temperature and the melting temperature is 50° C. or higher.

8. The molded solder according to claim 6 , wherein
an absolute value (H1′) of a heat flow (H1) at a temperature (T) indicating an initial endothermic peak of a differential scanning calorimetry before heating the molded solder at a temperature equal to or higher than the first liquidus temperature and an absolute value (H2′) of a heat flow (H2) at the temperature (T) of a differential scanning calorimetry after heating the molded solder satisfy the following formula (1):
( H 2′)/( H 1′)≤0.2  (1).

Assignees

• Tamura Seisakusho Kk

Inventors

• Sakamoto Isao
• Kitamura Akira
• Taniguchi Hiroaki

Classifications

• B22F1/05

  Metallic powder characterised by the size or surface area of the particles · CPC title

• B22F3/02

  Compacting only · CPC title

• B23K35/262

  Sn as the principal constituent · CPC title

• B23K35/0244

  Powders, particles or spheres; Preforms made therefrom · CPC title

• B23K35/40 Primary

  Making wire or rods for soldering or welding · CPC title