Printed circuit board for transmitting signal in high-frequency band and electronic device including same

Patent metadata

Field	Value
Publication number	US-11617257-B2
Application number	US-202117298810-A
Country	US
Kind code	B2
Filing date	May 17, 2021
Priority date	Jun 2, 2020
Publication date	Mar 28, 2023
Grant date	Mar 28, 2023

Abstract

Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band. The first multiple layers may include a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed, the second multiple layers may include a second punched region in which at least a portion overlapping the power line is removed, and at least a portion of the second punched region and the first punched region overlap each other forming a slit penetrating the flexible circuit board in the first direction.

First claim

The invention claimed is:

1. An electronic device comprising:
a flexible circuit board configured to transmit a signal in a high-frequency band,
wherein the flexible circuit board includes: first multiple layers including a power line configured to transmit power, and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band,
the first multiple layers including a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed,
the second multiple layers including a second punched region in which at least a portion overlapping the power line is removed, and
at least a portion of the second punched region and the first punched region overlap each other forming a slit penetrating the flexible circuit board in the first direction.

2. The electronic device of claim 1 , wherein the first multiple layers include:
a first insulating layer;
a first upper conductive layer disposed in the first direction from the first insulating layer and including the power line; and
a first lower conductive layer disposed in a second direction opposite the first direction from the first insulating layer and including a first lower ground.

3. The electronic device of claim 2 , wherein the second multiple layers include:
a second insulating layer;
a second upper conductive layer disposed in the first direction from the second insulating layer and including the first signal line and the second signal line; and
a second lower conductive layer disposed in the second direction from the second insulating layer and including a second lower ground.

4. The electronic device of claim 3 , wherein a thickness of the first upper conductive layer is greater than a thickness of the second upper conductive layer such that a thickness of the power line is greater than the thicknesses of the first signal line and the second signal line.

5. The electronic device of claim 3 , wherein a thickness of the first lower conductive layer including the first lower ground is greater than a thickness of the second lower conductive layer including the second lower ground.

6. The electronic device of claim 3 , wherein a thickness of the first insulating layer is less than a thickness of the second insulating layer such that an entire thickness of the first multiple layers is equal to an entire thickness of the second multiple layers.

7. The electronic device of claim 3 , wherein the second upper conductive layer further includes:
a plurality of first ground patterns provided at intervals on opposite sides of the first signal line, and
a plurality of second ground patterns provided at intervals on opposite sides of the second signal line.

8. The electronic device of claim 7 , wherein the second multiple layers further include:
a plurality of first vias penetrating the second insulating layer and electrically connecting the plurality of first ground patterns and the second lower ground; and
a plurality of second vias penetrating the second insulating layer and electrically connecting the plurality of second ground patterns and the second lower ground.

9. The electronic device of claim 7 , wherein the second multiple layers further include:
a cover layer disposed in the first direction from the second upper conductive layer and covering the first signal line and the second signal line; and
a shield film disposed in the first direction from the cover layer and electrically connected to the plurality of first ground patterns and the plurality of second ground patterns by the conductive member.

10. The electronic device of claim 1 , wherein the flexible circuit board includes a first surface facing the first direction and a second surface facing away from the first surface, and
the slit is provided between the power line and the first signal line and/or between the power line and the second signal line when the first surface is viewed from above.

11. The electronic device of claim 10 , wherein the power line is disposed between the first signal line and the second signal line when the first surface is viewed from above.

12. The electronic device of claim 10 , wherein the second signal line is disposed between the first signal line and the power line when the first surface is viewed from above.

13. A flexible circuit board configured to transmit a signal in a high-frequency band, the flexible circuit board comprising:
first multiple layers including a power line configured to transmit power; and
second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band,
wherein the first multiple layers include a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed,
the second multiple layers include a second punched region in which at least a portion overlapping the power line is removed, and
at least a portion of the second punched region and the first punched region overlap each other to provide a slit penetrating the flexible circuit board in the first direction.

14. The flexible circuit board of claim 13 , wherein the first multiple layers include:
a first insulating layer;
a first upper conductive layer disposed in the first direction from the first insulating layer and including the power line; and
a first lower conductive layer disposed in a second direction opposite the first direction from the first insulating layer and including a first lower ground.

15. The flexible circuit board of claim 14 , wherein the second multiple layers include:
a second insulating layer;
a second upper conductive layer disposed in the first direction from the second insulating layer and including the first signal line and the second signal line; and
a second lower conductive layer disposed in the second direction from the second insulating layer and including a second lower ground.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Youngsun
• Hong Eunseok
• Kim Byeongkeol
• Jeon Jongmin

Classifications

• H05K2201/09618

  Via fence, i.e. one-dimensional array of vias · CPC title

• H05K3/4679

  Aligning added circuit layers or via connections relative to previous circuit layers · CPC title

• H05K1/0219

  Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors · CPC title

• H05K1/0245

  Lay-out of balanced signal pairs, e.g. differential lines or twisted lines · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title