Emitter structure and production method

US11617232B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11617232-B2
Application numberUS-202217817155-A
CountryUS
Kind codeB2
Filing dateAug 3, 2022
Priority dateFeb 8, 2018
Publication dateMar 28, 2023
Grant dateMar 28, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An emitter structure includes a substrate with a membrane arrangement. The membrane arrangement includes at least one first membrane, a first heating path and a second heating path in different substrate planes. The first heating path and the second heating path are positioned with respect to one another such that a projection of the first heating path and a projection of the second heating path onto a common plane lie at least partly next to one another in the common plane.

First claim

Opening claim text (preview).

What is claimed is: 1. An emitter structure comprising: a substrate having a membrane arrangement comprising at least one first membrane, a first heating path and a second heating path, wherein the first heating path and the second heating path are arranged in different substrate planes, wherein the membrane arrangement comprises the first membrane with the first heating path and a second membrane with a second heating path, wherein the first membrane and the second membrane are arranged in different substrate planes in order to arrange the first heating path and the second heating path in different substrate planes, wherein the first membrane and the second membrane are spaced apart from one another, such that an interspace is shaped between the first membrane and the second membrane, wherein at least one of the first and the second membrane comprise a ventilation opening, such that a gas volume enclosed in the interspace can escape toward the outside in an event of its expansion; and/or wherein the substrate comprises a ventilation opening for the interspace, such that an enclosed gas volume can escape toward the outside in the event of its expansion. 2. The emitter structure as claimed in claim 1 , wherein the first heating path and the second heating path are positioned with respect to one another such that a projection of the first heating path and a projection of the second heating path onto a common plane lie at least partly next to one another in the common plane. 3. The emitter structure as claimed in claim 2 , wherein the projection of the first heating path relative to the projection of the second heating path is spaced apart from one another at least in a region along the first and the second heating path. 4. The emitter structure as claimed in claim 2 , wherein the projection of the first heating path and the projection of the second heating path are arranged in a manner adjoining or overlapping one another at least in a region along the first and the second heating path. 5. The emitter structure as claimed in claim 1 , wherein the first membrane forms an emission region configured to emit infrared radiation. 6. The emitter structure as claimed in claim 1 , wherein a projection area of the first heating path together with a projection area of the second heating path forms a larger projection area than the projection area of the first or the second heating path alone. 7. The emitter structure as claimed in claim 6 , wherein a projection area of the first and the second heating path onto a common plane together is at least 1.3 times a magnitude of a projection area of the first heating path or a projection area of the second heating path. 8. The emitter structure as claimed in claim 1 , wherein the substrate comprises an opening, in which the membrane arrangement is arranged. 9. The emitter structure as claimed in claim 1 , wherein the substrate comprises a trench, in which the membrane arrangement is arranged, wherein the second membrane together with a trench form a cavity. 10. The emitter structure as claimed in claim 1 , wherein the interspace is filled with a gas. 11. The emitter structure as claimed in claim 1 , wherein the emitter structure comprises a third membrane with a third heating path, wherein the third heating path is arranged relative to at least one of the first and the second heating path such that a projection of the third heating path onto a common plane lies next to the projection of the second heating path and/or next to the projection of the first heating path. 12. The emitter structure as claimed in claim 1 , wherein the first heating path and the second heating path have a ring shape; or wherein the first heating path and the second heating path have a meander shape. 13. The emitter structure as claimed in claim 1 , wherein the membrane arrangement comprises a further membrane configured to distribute a thermal energy induced by the first and/or the second heating path over a lateral area of the further membrane and to emit infrared radiation. 14. The emitter structure as claimed in claim 1 , wherein the first and/or the second heating path comprise(s) a doping. 15. The emitter structure as claimed in claim 1 , wherein the emitter structure comprises an Application-Specific Integrated Circuit (ASIC) configured to drive the first and the second heating path. 16. A method for producing an emitter structure, the method comprising: forming a membrane arrangement in a substrate comprising at least one first membrane, a first heating path and a second heating path, wherein the first heating path and the second heating path are arranged in different substrate planes; introducing a trench or an opening before forming the membrane arrangement, wherein the forming the membrane arrangement comprises forming the membrane arrangement arranged in the opening or the trench. 17. The method of claim 16 , wherein the first heating path and the second heating path are positioned with respect to one another such that a projection of the first heating path and a projection of the second heating path onto a common plane lie at least partly next to one another in the common plane. 18. An emitter structure comprising: a substrate having a membrane arrangement comprising a first membrane comprising a first heating path and a second membrane comprising a second heating path, wherein the first heating path and the second heating path are arranged in different substrate planes, wherein the first membrane and the second membrane are spaced apart from one another by an interspace, wherein at least one of the first and the second membrane comprise a ventilation opening, such that a gas volume enclosed in the interspace can escape toward the outside in an event of its expansion; and/or wherein the substrate comprises a ventilation opening for the interspace, such that an enclosed gas volume can escape toward the outside in the event of its expansion. 19. The emitter structure of claim 18 , wherein the first membrane and the second membrane each comprise a quadrilateral shape. 20. The emitter structure of claim 18 , wherein the first membrane and the second membrane each comprise a ring shape, a ring meander shape, or a meander shape.

Assignees

Inventors

Classifications

  • Non-dispersive gas analysers {(G01N21/3504 takes precedence)} · CPC title

  • Electrodes · CPC title

  • for analysing gases, e.g. multi-gas analysis · CPC title

  • H05B3/20Primary

    Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater (H05B3/62, H05B3/68, H05B3/78, H05B3/84 take precedence) · CPC title

  • with opto-acoustic detection, e.g. for gases or analysing solids · CPC title

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What does patent US11617232B2 cover?
An emitter structure includes a substrate with a membrane arrangement. The membrane arrangement includes at least one first membrane, a first heating path and a second heating path in different substrate planes. The first heating path and the second heating path are positioned with respect to one another such that a projection of the first heating path and a projection of the second heating pat…
Who is the assignee on this patent?
Infineon Technologies Ag
What technology area does this patent fall under?
Primary CPC classification H05B3/20. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 28 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).