Method for producing chain-like particle dispersion, and dispersion of chain-like particles

Patent metadata

Field	Value
Publication number	US-11613683-B2
Application number	US-201816955290-A
Country	US
Kind code	B2
Filing date	Dec 27, 2018
Priority date	Dec 27, 2017
Publication date	Mar 28, 2023
Grant date	Mar 28, 2023

Abstract

There is provided a production method of a chain silica particle dispersion. This production method includes a dispersion preparation step of hydrolyzing alkoxysilane in the presence of ammonia to prepare a silica particle dispersion, an ammonia removal step of removing the ammonia from the silica particle dispersion such that an ammonia amount relative to silica contained in the silica particle dispersion is 0.3% by mass or less, and a hydrothermal treatment step of hydrothermally treating the silica particle dispersion having a silica concentration of 12% by mass or more, from which the ammonia has been removed, at a temperature of not lower than 150° C. and lower than 250° C. An abrasive including such chain silica particles is high in polishing rate and excellent in polishing properties.

First claim

What is claimed is:

1. A production method of an abrasive comprising a chain silica particle dispersion, comprising:
a dispersion preparation step of hydrolyzing alkoxysilane in the presence of ammonia and an organic solvent to prepare a dispersion containing obtain silica particles, wherein an added amount of the ammonia used for hydrolysis is 0.005 to 1 mol per 1 mol of alkoxysilane, and an amount of water used for hydrolysis is 0.5 to 10 mol per 1 mol of Si—OR groups constituting alkoxysilane;
an ammonia removal step of removing the ammonia in the dispersion such that an ammonia amount, including an amount of ammonia in the chain silica particles, relative to silica contained in the dispersion is 0.08% by mass or less;
and a hydrothermal treatment step of, after the ammonia removal step, hydrothermally treating the dispersion at not lower than 150° C. and lower than 250° C. in a state in which a silica concentration is 12% by mass or more,
wherein the chain silica particles prepared by the hydrothermal treatment step have an average linked number of 7 or more of silica particles.

2. The production method of an abrasive comprising a chain silica particle dispersion according to claim 1 , wherein
the ammonia removal step includes removing the ammonia from the dispersion by at least one of a heat treatment and a decompression treatment.

3. The production method of an abrasive comprising a chain silica particle dispersion according to claim 1 ,
wherein
each silica particle in the chain silica particles has an average particle size of 5 to 300 nm.

4. The production method of an abrasive comprising a chain silica particle dispersion according to claim 1 , wherein
the ammonia removal step removes the ammonia in the dispersion such that the ammonia amount is 0.01% by mass or more and 0.08% by mass or less.

5. The production method of an abrasive comprising a chain silica particle dispersion according to claim 1 , wherein
primary particles obtained by the dispersion preparation step has an average particle size of 5 to 300 nm, an aspect ratio of 1.00 to 1.20, and coefficient of variance of 30% or less.

Assignees

• Jgc Catalysts & Chemicals Ltd

Inventors

• Egami Miki
• Taniguchi Masanobu
• Kumazawa Mitsuaki
• Muraguchi Ryo

Classifications

• H10P52/403

  of conductive or resistive materials · CPC title

• H10W20/062

  by smoothing of conductive parts, e.g. by planarisation · CPC title

• C01P2004/62

  Submicrometer sized, i.e. from 0.1-1 micrometer · CPC title

• C01P2004/64

  Nanometer sized, i.e. from 1-100 nanometer · CPC title

• B24B37/042 Primary

  operating processes therefor · CPC title