High heat-resistant composition and method of manufacturing three-dimensional substrate using the same

Patent metadata

Field	Value
Publication number	US-11613651-B2
Application number	US-201916425120-A
Country	US
Kind code	B2
Filing date	May 29, 2019
Priority date	May 30, 2018
Publication date	Mar 28, 2023
Grant date	Mar 28, 2023

Abstract

A heat-resistant composition including: a binder resin including at least two of a silicone-modified polyester resin, a siloxane compound, or a silanol compound; a pigment including at least two of iron cobalt chromite black spinel (ICCB), copper chromite black spinel (CCB), iron chromite manganese (ICM), or carbon black; and a catalyst.

First claim

What is claimed is:

1. A heat-resistant composition comprising:
a binder resin comprising at least two of: of a silicone-modified polyester resin, a siloxane compound, or a silanol compound;
a pigment; and
a catalyst;
wherein the pigment consists of a mixture of one of iron cobalt chromite black spinel, copper chromite black spinel or iron chromite manganese, and carbon black in a weight ratio of 1:1 to 9:1, or
wherein the pigment includes a mixture of iron cobalt chromite black spinel and iron chromite manganese in a weight ratio of 1:1 to 9:1.

2. The heat-resistant composition of claim 1 , wherein the siloxane compound is represented by Formula 1:
(R 1 3 SiO 1/2 ) 2 (R 1 R 2 SiO) a (R 2 2 SiO) b ,  Formula 1

wherein,
R 1 is a hydrogen atom, a C 1 -C 10 alkyl group, a C 2 -C 6 alkenyl group, a C 6 -C 12 aryl group, or a C 1 -C 6 alkoxy group,
R 2 is a hydrogen atom, a C 1 -C 10 alkyl group, or a C 6 -C 12 aryl group,
a and b are each independently 0 or an integer of 1 to 10,000, and a+b is 5 to 10,000.

3. The heat-resistant composition of claim 1 , wherein the silanol compound includes at least one of trimethylsilanol or dimethylsilanol.

4. The heat-resistant composition of claim 1 , wherein the binder resin comprises a mixture of the silicone-modified polyester resin and the siloxane compound in a weight ratio of 1:1 to 1:9.

5. The heat-resistant composition of claim 1 , wherein the binder resin comprises a mixture of the silicone-modified polyester resin, the siloxane compound, and the silanol compound in a weight ratio of 1:1-5:0.1-3.

6. The heat-resistant composition of claim 1 , wherein the catalyst comprises a chelated titanate compound, and wherein the catalyst is present in an amount of about 1 weight percent to about 3 weight percent, based on the total weight of the composition.

7. The heat-resistant composition of claim 1 , further comprising a substrate, and wherein the composition is printed on the substrate in a thickness of about 10 micrometers to about 20 micrometers, and wherein the substrate comprises glass, polycarbonate, poly(methyl methacrylate), polyimide, polypropylene, polyethylene, polyethylene terephthalate, polystyrene, a copolyester thermoplastic elastomer, or a combination thereof.

8. A method of manufacturing a three-dimensional substrate comprising a pattern on a surface thereof, the method comprising:
applying the heat-resistant composition of claim 1 on a surface of a planar substrate to form a surface-treated planar substrate; and
three-dimensionally thermoforming the surface-treated planar substrate to provide the three-dimensional substrate.

Assignees

• Samsung Display Co Ltd
• Kcc Corp

Inventors

• Heo Jin Nyoung
• Kang Hyuck
• Kim Dae Hwan
• Oh Jeong Su
• Jo Jong Kap
• Jeon Yu Sik
• Jeon Jae Seung

Classifications

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• C09D7/61

  inorganic · CPC title

• C08G63/695

  containing silicon · CPC title

• C08L83/04 Primary

  Polysiloxanes · CPC title

• C09D11/324

  containing carbon black · CPC title