Heatsink for co-packaged optical switch rack package

Patent metadata

Field	Value
Publication number	US-11612079-B2
Application number	US-202117398877-A
Country	US
Kind code	B2
Filing date	Aug 10, 2021
Priority date	Jun 5, 2020
Publication date	Mar 21, 2023
Grant date	Mar 21, 2023

Abstract

An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.

First claim

What is claimed is:

1. An optical communication system comprising:
a co-packaged optical module comprising a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate, the processor and the light engines generating different amounts of heat during operation; and
a heatsink mounted to the co-packaged optical module, the heatsink comprising a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of the heat generated at a location of the processor and respective locations of each of the light engines.

2. The optical communication system of claim 1 further comprising a chassis including the co-packaged optical module and a fan providing convective cooling to the co-packaged optical module, the heatsink and the fan collectively removing the heat from the co-packaged optical module irrespective of locations and non-uniform heat generated by the processor and the light engines.

3. The optical communication system of claim 1 wherein the heat pipes are disposed in trenches formed in the heatsink and wherein the trenches extend through the heatsink to regions proximate to the processor and the light engines to allow the heat pipes to conduct the heat from the processor and the light engines.

4. The optical communication system of claim 1 wherein the heat pipes are formed of a solid metallic material to allow the heat pipes to conduct the heat from the processor and the light engines.

5. The optical communication system of claim 1 wherein the heat pipes are formed of a metallic material and are hollow to conduct the heat from the processor and the light engines.

6. The optical communication system of claim 1 wherein to conduct the heat from the processor and the light engines, the heat pipes are formed of a solid metallic material.

7. The optical communication system of claim 1 wherein to conduct the heat from the processor and the light engines, the heat pipes are formed of a metallic material and are hollow.

8. The optical communication system of claim 1 wherein to conduct the heat from the processor and the light engines, first ones of the heat pipes are formed of a solid metallic material and second ones of the heat pipes are formed of a metallic material and are hollow.

9. The optical communication system of claim 1 wherein a first set of the heat pipes is disposed in a first direction to conduct the heat from the processor and from a first set of the light engines, and wherein a second set of the heat pipes is disposed in the first direction and in a second direction to conduct the heat only from a second set of the light engines.

10. The optical communication system of claim 9 wherein the first and second directions are perpendicular to each other.

11. The optical communication system of claim 1 wherein the heat pipes include first end portions, center portions, and second end portions; and wherein:
the first and second end portions of first and second sets of the heat pipes are disposed in a first direction to conduct the heat from a first set of the light engines;
the center portions of the first set of the heat pipes are disposed in the first direction to conduct the heat from the processor;
the center portions of the second set of the heat pipes are disposed in a second direction to conduct the heat from a second set of light engines; and
the first and second end portions and the center portions of a third set of the heat pipes are disposed in the first direction to conduct the heat from a second set of the light engines.

12. The optical communication system of claim 1 wherein the heatsink comprises:
a baseplate;
a plurality of fins disposed on the baseplate; and
a plurality of trenches formed in the baseplate between the fins;
wherein a first set of the trenches extends in a first direction, includes first and second end portions having a first depth, and includes center portions having a second depth that is greater than the first depth; and
wherein a second set of the trenches includes first and second end portions extending in the first direction and having the first depth and includes center portions extending in a second direction and having the second depth.

13. The optical communication system of claim 12 wherein:
a first set of the heat pipes is disposed in first set of the trenches to conduct the heat from the processor and a first set of the light engines; and
a second set of the heat pipes is disposed in the second set of the trenches to conduct the heat only from a second set of the light engines.

14. The optical communication system of claim 13 wherein at least one heat pipe from the first set of the heat pipes has a different heat dissipation capacity than the second set of the heat pipes.

15. The optical communication system of claim 13 wherein at least one heat pipe from the first set of the heat pipes has a same heat dissipation capacity as the second set of the heat pipes.

16. The optical communication system of claim 13 further comprising a chassis including the co-packaged optical module and a fan providing convective cooling to the co-packaged optical module, wherein the heat pipes, the fins, and the fan collectively remove the heat from the co-packaged optical module irrespective of locations and non-uniform heat generated by the processor and the light engines.

Assignees

• Marvell Asia Pte Ltd

Inventors

• Nagarajan Radhakrishnan L
• Ding Liang
• Patterson Mark
• Coccioli Roberto
• Aboagye Steve

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/611

  Bolts or screws · CPC title

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• G02B6/428

  containing printed circuit boards [PCB] · CPC title