Component carrier with a solid body protecting a component carrier hole from foreign material ingression

Patent metadata

Field	Value
Publication number	US-11612064-B2
Application number	US-202117302599-A
Country	US
Kind code	B2
Filing date	May 7, 2021
Priority date	May 12, 2020
Publication date	Mar 21, 2023
Grant date	Mar 21, 2023

Abstract

A component carrier includes (a) a first stack with at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure; (b) a hole formed within the first stack; and (c) a non-deformable solid body closing a portion of the hole and being spaced with respect to side walls of the hole by a gap. A component carrier assembly includes (a) a component carrier as described above; (b) a second stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure; and (c) a connection piece connecting the first stack with the second stack. Further described are methods for manufacturing such a component carrier and such a component carrier assembly.

First claim

The invention claimed is:

1. A component carrier, comprising:
a first stack comprising at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure;
a hole formed within the first stack, the hole comprising a first hole portion and a second hole portion; and
a non-deformable solid body closing the second hole portion and being spaced with respect to side walls of the hole by a gap,
wherein the second hole portion comprises an electrically conductive side wall and the first hole portion is free from an electrically conductive side wall.

2. The component carrier as set forth in claim 1 , wherein the non-deformable solid body is a ball.

3. The component carrier as set forth in claim 1 , wherein the non-deformable solid body comprises glass.

4. The component carrier as set forth in claim 1 , wherein the non-deformable solid body comprises resin.

5. The component carrier as set forth in claim 1 , wherein the non-deformable solid body comprises copper.

6. The component carrier as set forth in claim 1 , further comprising:
a fixing medium located at least partially within the hole, wherein the fixing medium is in contact with the non-deformable solid body.

7. The component carrier as set forth in claim 6 , wherein the fixing medium comprises a curable or cured paste.

8. The component carrier as set forth in claim 1 , wherein at least a portion of the hole comprises an electrically conductive inner side wall.

9. The component carrier as set forth in claim 8 , further comprising:
an electric connector, wherein the electrically conductive inner side wall is electrically contacted with a contact terminal of the connector.

10. The component carrier as set forth in claim 9 , wherein the hole has a first hole portion and a second hole portion being directly connected to each other, and
the first hole portion has a first diameter larger than a diameter of the non-deformable solid body and the second hole portion has a second diameter smaller than the diameter of the non-deformable solid body.

11. The component carrier as set forth in claim 1 , further comprising:
at least one further hole formed in the first stack; and
at least one further non-deformable solid body closing a portion of the at least one further hole and being spaced with respect to side walls of the at least one further hole by a gap.

12. The component carrier as set forth in claim 11 , wherein the non-deformable solid body comprises a first spatial dimension and at least one of the at least one further non-deformable solid body comprises a second spatial dimension being different from the first spatial dimension.

13. The component carrier as set forth in claim 6 , wherein the fixing medium is a paste.

14. The component carrier as set forth in claim 13 , wherein a characteristic of the paste changes upon being exposed to ultraviolet radiation.

15. A method for manufacturing a component carrier, the method comprising:
forming a first stack comprising at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure;
forming a hole within the first stack, the hole comprising a first hole portion and a second hole portion; and
closing the second hole portion by inserting a non-deformable solid body in the hole, wherein the non-deformable solid body is spaced with respect to side walls of the hole by a gap,
wherein the second hole portion comprises an electrically conductive side wall and the first hole portion is free from an electrically conductive side wall.

16. The method as set forth in claim 15 , further comprising:
forming a further hole within the first stack; and
closing at least a portion of the further hole by inserting a further non-deformable solid body in the further hole, wherein the further non-deformable solid body is spaced with respect to side walls of the further hole by a gap.

17. The method as set forth in claim 15 , wherein forming the first stack is carried out on a tape and wherein the method further comprises:
forming, next to the first stack, an additional first stack on the tape, the additional first stack comprising at least one additional first electrically conductive layer structure and/or at least one additional first electrically insulating layer structure;
forming an additional hole within the additional first stack; and
closing at least a portion of the additional hole by inserting an additional non-deformable solid body in the additional hole, wherein the additional non-deformable solid body is spaced with respect to side walls of the additional hole by a gap.

18. The method of claim 13 , further comprising:
introducing a fixing medium in the hole before the step of closing.

19. The method of claim 18 , further comprising:
exposing the fixing medium to ultraviolet radiation.

Assignees

• At & S Austria Tech & Systemtechnik Ag
• At&Saustria Tech & Systemtechnik Ag

Inventors

• Schlaffer Erich
• Steinkellner Markus

Classifications

• H05K2201/09845

  Stepped hole, via, edge, bump or conductor · CPC title

• H05K2201/10234

  Metallic balls · CPC title

• H05K3/3431 Primary

  Leadless components · CPC title

• H05K2203/1394

  Covering open PTHs, e.g. by dry film resist or by metal disc · CPC title

• H05K3/429

  Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers · CPC title