Circuit board including insulating layer having a plurality of dielectrics with different dielectric loss, and electronic device including the circuit board

Patent metadata

Field	Value
Publication number	US-11605891-B2
Application number	US-201916460937-A
Country	US
Kind code	B2
Filing date	Jul 2, 2019
Priority date	Jul 2, 2018
Publication date	Mar 14, 2023
Grant date	Mar 14, 2023

Abstract

An electronic device includes a communication circuit electrically connected with a circuit board. The circuit board includes a first portion comprising a first layered structure in which a wiring layer and a first insulating layer are alternately positioned, and a second portion comprising a second layered structure in which the wiring layer and the first insulating layer are alternately positioned and a second insulating layer. At least one antenna patch is positioned on or within the second insulating layer. A conductive line penetrates the second layered structure and the second insulating layer and electrically connects the at least one antenna patch and the communication circuit. The first insulating layer has a first loss tangent value, and the second insulating layer has a second loss tangent value smaller than the first loss tangent value.

First claim

What is claimed is:

1. An electronic device comprising:
a communication circuit; and
a circuit board including a first surface and a second surface facing away from the first surface, wherein the circuit board includes:
a first portion including a first layered structure in which part of a plurality of wiring layers and part of a plurality of first insulating layers are alternately positioned from the first surface to the second surface;
a second portion including:
a second layered structure in which another part of the plurality of wiring layers and another part of the plurality of first insulating layers are alternately positioned from the first surface to a first layer provided between the first surface and the second surface, and
a second insulating layer positioned on the first layer up to the second surface and forming a portion of the second surface;

at least one antenna patch positioned on the second insulating layer or within the second insulating layer; and
a conductive line penetrating the second layered structure and at least a portion of the second insulating layer and electrically connecting the at least one antenna patch and the communication circuit,

wherein the communication circuit is disposed on the first surface, and
wherein the plurality of first insulating layers have a first loss tangent value, and the second insulating layer has a second loss tangent value smaller than the first loss tangent value.

2. The electronic device of claim 1 , wherein:
the first loss tangent value is 0.02 or more and 0.03 or less; and
the second loss tangent value is 0.001 or more and 0.01 or less.

3. The electronic device of claim 1 , wherein a structure of the first layered structure from the first surface to the first layer and the second layered structure have a same stacked structure.

4. The electronic device of claim 1 , wherein the conductive line penetrates the plurality of first insulating layers of the second layered structure and is connected with the plurality of wiring layers of the second layered structure.

5. The electronic device of claim 1 , wherein the second insulating layer is formed with a single layer from an upper surface of the second layered structure to a lower surface of the at least one antenna patch.

6. The electronic device of claim 5 , wherein the conductive line is connected with the lower surface of the at least one antenna patch.

7. The electronic device of claim 1 , wherein the at least one antenna patch includes:
a first antenna patch positioned on at least a portion of a surface of the second insulating layer; and
a second antenna patch positioned within the second insulating layer.

8. The electronic device of claim 7 , wherein the conductive line is connected with a lower surface of the second antenna patch.

9. The electronic device of claim 1 , further comprising:
a reinforcement member positioned on a boundary line of the second surface between the first portion and the second portion.

10. An antenna structure comprising:
a communication circuit; and
a circuit board including a first surface and a second surface facing away from the first surface, wherein the circuit board includes:
a plurality of first conductive layers,
a second conductive layer positioned below the first conductive layer,
a plurality of first insulating layers, wherein each of the plurality of first conductive layers and the plurality of first insulating layers are alternatively positioned from the first surface to a first layer provided between the first surface and the second surface, wherein the first insulating layer forms a first dielectric having a first dielectric loss,
at least one antenna electrically connected to the communication circuit through at least one wiring, wherein the at least one antenna is positioned in a specified area,
a third conductive layer positioned below the second conductive layer, and
a second insulating layer positioned between the second conductive layer and the third conductive layer and in the specified area, wherein the second insulating layer forms a second dielectric having a second dielectric loss smaller than the first dielectric loss,

wherein the communication circuit is disposed on the first surface.

11. The antenna structure of claim 10 , wherein the first dielectric is formed in an area other than the specified area.

12. The antenna structure of claim 10 , wherein the at least one wiring penetrates at least a portion of the plurality of first insulating layers and at least a portion of the second insulating layer by using at least one via hole.

13. The antenna structure of claim 10 , wherein the second insulating layer is formed in the specified area in a stacked structure.

14. The antenna structure of claim 10 , wherein the second insulating layer is formed with a single layer in a whole area between the second conductive layer and the third conductive layer.

15. The antenna structure of claim 10 , wherein a height of an upper surface of the second insulating layer is equal to or less than a height of an upper surface of a first layered structure.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Sungwon
• Son Dongil
• Ha Sangwon

Classifications

• H01Q21/065 Primary

  Patch antenna array · CPC title

• H05K1/024

  Dielectric details, e.g. changing the dielectric material around a transmission line · CPC title

• H01Q21/28

  Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} · CPC title

• H05K1/0298

  Multilayer circuits · CPC title

• H01Q1/243

  with built-in antennas · CPC title