Laser processing method and laser processing system

Patent metadata

Field	Value
Publication number	US-11604416-B2
Application number	US-202117511128-A
Country	US
Kind code	B2
Filing date	Oct 26, 2021
Priority date	Oct 4, 2017
Publication date	Mar 14, 2023
Grant date	Mar 14, 2023

Abstract

A laser processing method of performing laser processing on a transparent material that is transparent to ultraviolet light by using a laser processing system includes: performing relative positioning of a transfer position of a transfer image and the transparent material in an optical axis direction of a pulse laser beam so that the transfer position is set at a position inside the transparent material at a predetermined depth ΔZsf from a surface of the transparent material in the optical axis direction; and irradiating the transparent material with the pulse laser beam having a pulse width of 1 ns to 100 ns inclusive and a beam diameter of 10 μm to 150 μm inclusive at the transfer position.

First claim

What is claimed is:

1. A laser processing method of performing laser processing on a transparent material that is transparent to ultraviolet light by using a laser processing system including a laser apparatus configured to output a pulse laser beam that is the ultraviolet light, a transfer mask provided with a transfer pattern through which the pulse laser beam passes, and a transfer optical system configured to transfer a transfer image formed when the pulse laser beam passes through the transfer pattern and having a shape in accordance with the transfer pattern, the laser processing method comprising:
A. a positioning step of performing relative positioning of a transfer position of the transfer image transferred by the transfer optical system and the transparent material in an optical axis direction of the pulse laser beam so that the transfer position is set at a position inside the transparent material at a predetermined depth ΔZsf from a surface of the transparent material in the optical axis direction; and
B. an irradiation step of irradiating the transparent material with the pulse laser beam having a pulse width of 1 ns to 100 ns inclusive and a beam diameter of 10 μm to 150 μm inclusive at the transfer position, wherein:
the transparent material is synthetic quartz glass, and the pulse laser beam has a wavelength of 157.6 nm to 248.7 nm,
the pulse laser beam is an ArF laser beam, and
the depth ΔZsf is within a range from 0.5 mm to 4 mm inclusive.

2. The laser processing method according to claim 1 , wherein the pulse laser beam has a fluence of 3 J/cm 2 to 15 J/cm 2 inclusive at the transfer position.

3. The laser processing method according to claim 1 , wherein a number of irradiation pulses of the pulse laser beam is 3,000 or larger.

4. The laser processing method according to claim 3 , wherein the number of irradiation pulses is 35,000 or smaller.

5. The laser processing method according to claim 1 , wherein the laser apparatus includes:
a master oscillator; and
an amplifier configured to amplify the pulse laser beam output from the master oscillator.

6. The laser processing method according to claim 5 , wherein the master oscillator includes a solid-state laser device.

7. The laser processing method according to claim 6 , wherein the solid-state laser device includes a wavelength conversion system including a plurality of crystals.

8. The laser processing method according to claim 6 , wherein the solid-state laser device includes a wavelength variable laser device that can change wavelength.

9. A laser processing system configured to perform laser processing by irradiating a transparent material that is transparent to ultraviolet light with a pulse laser beam that is the ultraviolet light, the laser processing system comprising:
A. a laser apparatus configured to output the pulse laser beam having a pulse width of 1 ns to 100 ns;
B. a transfer mask provided with a transfer pattern through which the pulse laser beam output from the laser apparatus passes;
C. a transfer optical system configured to transfer, onto the transparent material, a transfer image formed when the pulse laser beam passes through the transfer pattern and having a shape in accordance with the transfer pattern;
D. a positioning mechanism configured to perform relative positioning of a transfer position of the transfer image transferred by the transfer optical system and the transparent material in an optical axis direction of the pulse laser beam; and
E. a positioning control unit configured to control the positioning mechanism to perform the positioning so that the transfer position is set at a position inside the transparent material at a predetermined depth ΔZsf from a surface of the transparent material in the optical axis direction,
the pulse laser beam having a beam diameter of 10 μm to 150 μm inclusive at the transfer position, wherein:
the transparent material is synthetic quartz glass, and the pulse laser beam has a wavelength of 157 nm to 248 nm,
the pulse laser beam is an ArF laser beam,
the depth ΔZsf is within a range from 0.5 mm to 4 mm inclusive.

10. The laser processing system according to claim 9 , wherein the pulse laser beam has a fluence of 3 J/cm 2 to 15 J/cm 2 inclusive at the transfer position.

11. The laser processing system according to claim 9 , wherein the number of irradiation pulses of the pulse laser beam is 3,000 or larger.

12. The laser processing system according to claim 9 , wherein:
the laser apparatus includes:
a master oscillator including a solid-state laser device; and
an amplifier configured to amplify the pulse laser beam output from the master oscillator, and
the solid-state laser device includes a wavelength conversion system including a plurality of crystals.

13. A laser processing method of performing laser processing on a transparent material that is transparent to ultraviolet light by using a laser processing system including a laser apparatus configured to output a pulse laser beam that is the ultraviolet light, a transfer mask provided with a transfer pattern through which the pulse laser beam passes, and a transfer optical system configured to transfer a transfer image formed when the pulse laser beam passes through the transfer pattern and having a shape in accordance with the transfer pattern, the laser processing method comprising:
A. a positioning step of performing relative positioning of a transfer position of the transfer image transferred by the transfer optical system and the transparent material in an optical axis direction of the pulse laser beam so that the transfer position is set at a position inside the transparent material at a predetermined depth ΔZsf from a surface of the transparent material in the optical axis direction; and
B. an irradiation step of irradiating the transparent material with the pulse laser beam having a pulse width of 1 ns to 100 ns inclusive and a beam diameter of 10 μm to 150 μm inclusive at the transfer position, wherein:
the transparent material is synthetic quartz glass, and the pulse laser beam has a wavelength of 248.1 nm to 248.7 nm,
the pulse laser beam is a KrF laser beam, and
the depth ΔZsf is within a range from 0.5 mm to 4 mm inclusive.

14. The laser processing method according to claim 13 , wherein the pulse laser beam has a fluence of 3 J/cm 2 to 15 J/cm 2 inclusive at the transfer position.

15. The laser processing method according to claim 13 , wherein a number of irradiation pulses of the pulse laser beam is 3,000 or larger.

16. The laser processing method according to claim 15 , wherein the number of irradiation pulses is 35,000 or smaller.

17. The laser processing method according to claim 13 , wherein the laser apparatus includes:
a master oscillator; and
an amplifier configured to amplify the pulse laser beam output from the master oscillator.

18. The laser processing method according to claim 17 , wherein the master oscillator includes a solid-state laser device.

19. The laser processing method according to claim 18 , wherein the solid-state laser device includes a wavelength conversion system including a plurality of crystals.

20. The laser processing method according to claim 18 , wherein the solid-state laser device includes a wavelength variable laser device that can change wavelength.

Assignees

• Gigaphoton Inc

Inventors

• Kakizaki Koji
• Kobayashi Masakazu
• Suwa Akira
• Wakabayashi Osamu

Classifications

• H01S5/0612

  controlled by temperature · CPC title

• G03F7/70041

  by pulsed sources, e.g. multiplexing, pulse duration, interval control or intensity control · CPC title

• H01S3/2375

  Hybrid lasers (H01S3/07 takes precedence) · CPC title

• B23K26/50

  Working by transmitting the laser beam through or within the workpiece · CPC title

• H01S3/0071

  Beam steering, e.g. whereby a mirror outside the cavity is present to change the beam direction · CPC title