Surface treatment method of wafer and composition used for said method

Patent metadata

Field	Value
Publication number	US-11603485-B2
Application number	US-201917040902-A
Country	US
Kind code	B2
Filing date	Mar 19, 2019
Priority date	Apr 5, 2018
Publication date	Mar 14, 2023
Grant date	Mar 14, 2023

Abstract

A surface treatment method of a Si element-containing wafer including, during a cleaning process of the wafer, forming a water-repellent protective film on at least the recess portion of the uneven pattern by supplying a vapor of a composition containing a water-repellent protective film-forming component and a solvent in a state that a liquid is retained in at least the recess portion of the uneven pattern, changing the vapor of the composition into a liquid and replacing the liquid retained in the recess portion with the liquid of the composition. The water-repellent protective film-forming component consists of a compound of formula [1], and the solvent contains at least an acyclic carbonate.R1x(CH3)3-xSiN(R2)2  [1]R1 is selected from the group consisting of a H and a C1-C10 hydrocarbon group; x is an integer of 1 to 3; and R2 is each independently a group selected from the group consisting of methyl, ethyl and acetyl.

First claim

The invention claimed is:

1. A surface treatment method of a wafer, the wafer having an uneven pattern at a surface thereof and containing a Si element in at least a recess portion of the uneven pattern, the surface treatment method comprising:
a cleaning process of the wafer, wherein the cleaning process of the wafer comprises:
forming a water-repellent protective film on at least the recess portion of the uneven pattern by heating a composition containing a water-repellent protective film-forming component and a solvent to generate a vapor of the composition,
supplying the vapor of the composition to the uneven pattern in a state that a liquid is retained in at least the recess portion,
changing the vapor of the composition into a liquid and replacing the liquid retained in the recess portion with the liquid of the composition,

wherein, in the composition containing the water-repellent protective film-forming component and the solvent, the water-repellent protective film-forming component consists of a compound of the following general formula [1], and
the solvent contains at least an acyclic carbonate in an amount of 50 to 100 mass % based on the total amount of the solvent,
R 1 x (CH 3 ) 3-x SiN(R 2 ) 2   [1]

where R 1 is each independently a group selected from the group consisting of a H atom, a C 1 -C 10 hydrocarbon group and a C 1 -C 10 hydrocarbon group in which a part or all of hydrogen atoms are substituted with a fluorine atom; x is an integer of 1 to 3; and R 2 is each independently a group selected from the group consisting of methyl, ethyl and acetyl, in which at least a part or all of hydrogen atoms may be substituted with a fluorine atom.

2. The surface treatment method of the wafer according to claim 1 , wherein the compound of the general formula [1] is at least one kind selected from the group consisting of dimethylaminosilanes represented by (CH 3 ) 3 SiN(CH 3 ) 2 , C 2 H 5 Si(CH 3 ) 2 N(CH 3 ) 2 , (C 2 H 5 ) 2 Si(CH 3 )N(CH 3 ) 2 , (C 2 H 5 ) 3 SiN(CH 3 ) 2 , C 3 H 7 Si(CH 3 ) 2 N(CH 3 ) 2 , (C 3 H 7 ) 2 Si(CH 3 )N(CH 3 ) 2 , (C 3 H 7 ) 3 SiN(CH 3 ) 2 , C 4 H 9 Si(CH 3 ) 2 N(CH 3 ) 2 , (C 4 H 9 ) 3 SiN(CH 3 ) 2 , C 5 H 17 Si(CH 3 ) 2 N(CH 3 ) 2 , C 6 H 13 Si(CH 3 ) 2 N(CH 3 ) 2 , C 7 H 15 Si(CH 3 ) 2 N(CH 3 ) 2 , C 8 H 17 Si(CH 3 ) 2 N(CH 3 ) 2 , C 9 H 19 Si(CH 3 ) 2 N(CH 3 ) 2 , C 10 H 21 Si(CH 3 ) 2 N(CH 3 ) 2 , (CH 3 ) 2 Si(H)N(CH 3 ) 2 , CH 3 Si(H) 2 N(CH 3 ) 2 , (C 2 H 5 ) 2 Si(H)N(CH 3 ) 2 , C 2 H 5 Si(H) 2 N(CH 3 ) 2 , C 2 H 5 Si(CH 3 )(H)N(CH 3 ) 2 , (C 3 H 7 ) 2 Si(H)N(CH 3 ) 2 , C 3 H 7 Si(H) 2 N(CH 3 ) 2 , CF 3 CH 2 CH 2 Si(CH 3 ) 2 N(CH 3 ) 2 , C 2 F 5 CH 2 CH 2 Si(CH 3 ) 2 N(CH 3 ) 2 , C 3 F 7 CH 2 CH 2 Si(CH 3 ) 2 N(CH 3 ) 2 , C 4 F 9 CH 2 CH 2 Si(CH 3 ) 2 N(CH 3 ) 2 , C 5 F 11 CH 2 CH 2 Si(CH 3 ) 2 N(CH 3 ) 2 , C 6 F 13 CH 2 CH 2 Si(CH 3 ) 2 N(CH 3 ) 2 , C 7 F 15 CH 2 CH 2 Si(CH 3 ) 2 N(CH 3 ) 2 , C 8 F 17 CH 2 CH 2 Si(CH 3 ) 2 N(CH 3 ) 2 and CF 3 CH 2 CH 2 Si(CH 3 )(H)N(CH 3 ) 2 , and compounds obtained by replacing dimethylamino groups (—N(CH 3 ) 2 ) of the respective dimethylaminosilanes with a —N(C 2 H 5 ) 2 group, a —N(CH 3 )C(O)CH 3 group or a —N(CH 3 )C(O)CF 3 group.

3. The surface treatment method of the wafer according to claim 1 , wherein the compound of the general formula [1] is at least one kind selected from the group consisting of trimethylsilyldimethylamine and trimethylsilyldiethylamine.

4. The surface treatment method of the wafer according to claim 1 , wherein the acyclic carbonate is at least one kind selected from the group consisting of dimethyl carbonate, diethyl carbonate and ethyl methyl carbonate.

5. The surface treatment method of the wafer according to claim 1 , wherein the compound of the general formula [1] is contained in an amount of 0.3 to 30 mass % based on the total amount of the composition.

6. The surface treatment method of the wafer according to claim 1 , wherein the solvent of the composition contains a cyclic carbonate in an amount of 10 mass % or less.

7. The surface treatment method of the wafer according to claim 1 , wherein the composition consists of the compound of the general formula [1] and the acyclic carbonate.

8. The surface treatment method of the wafer according to claim 1 , wherein the liquid retained in the recess portion is a nonaqueous solvent.

9. The surface treatment method of the wafer according to claim 1 , wherein a difference in boiling point between the compound of the general formula [1] and the acyclic carbonate is 50° C. or less.

10. The surface treatment method of the wafer according to claim 1 , wherein a temperature of the vapor is lower than a boiling point of the liquid retained in at least the recess portion.

11. The surface treatment method of the wafer according to claim 1 , comprising, after forming the water-repellent protective film on at least the recess portion, removing the composition retained in the recess portion by drying.

12. The surface treatment method of the wafer according to claim 11 , further comprising removing the water-repellent protective film by performing at least one selected from the group consisting of heating treatment, light irradiation treatment, ozone exposure treatment, plasma irradiation treatment and corona discharge treatment on the surface of the wafer after the drying.

13. The surface treatment method of the wafer according to claim 1 , comprising, after forming the water-repellent protective film on at least the recess portion, replacing the liquid of the composition retained in the recess portion with a cleaning liquid different from the liquid of the composition and then removing the cleaning liquid by drying.

14. The surface treatment method of the wafer according to claim 13 , further comprising removing the water-repellent protective film by performing at least one selected from the group consisting of heating treatment, light irradiation treatment, ozone exposure treatment, plasma irradiation treatment and corona discharge treatment on the surface of the wafer after the drying.

15. A composition used, in a cleaning process of a wafer having an uneven pattern at a surface thereof and containing a Si element in at least a recess portion of the uneven pattern, by being supplied as a vapor to the uneven pattern in a state that a liquid is retained in at least the recess portion of the uneven pattern,
wherein the composition consists essentially of a water-repellent protective film-forming component and an acyclic carbonate as a solvent, and
wherein the water-repellent protective film-forming component consists of a compound of the following general formula [1]
R 1 x (CH 3 ) 3-x SiN(R 2 ) 2   [1]

where R 1 is each independently a group selected from the group consisting of a H atom, a C 1 -C 10 hydrocarbon group and a C 1 -C 10 hydrocarbon group in which a part or all of hydrogen atoms are substituted with a fluorine atom; x is an integer of 1 to 3; and R 2 is each independently a group selected from the group consisting of methyl, ethyl and acetyl, in which at least a part or all of hydrogen atoms may be substituted with a fluorine atom.

16. The composition according to claim 15 , wherein a difference in boiling point between the compound of the general formula [1] and the acyclic carbonate is 50° C. or less.

Assignees

• Central Glass Co Ltd

Inventors

• Terui Yoshiharu

Classifications

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title

• H10P70/234 Primary

  the processing being the formation of vias or contact holes · CPC title

• C09K3/18 Primary

  for application to surfaces to minimize adherence of ice, mist or water thereto (rendering particulate materials free flowing, in general, e.g. making them hydrophobic B01J2/30); Thawing or antifreeze materials for application to surfaces (used in liquids for heat-transfer, heat-exchange or heat-storage or for the production of heat or cold other than by combustion, e.g. radiator liquids, C09K5/00) · CPC title

• C09D7/63

  organic · CPC title

• B08B7/0014

  by incorporation in a layer which is removed with the contaminants · CPC title