Plasticizing device
US-11465347-B2 · Oct 11, 2022 · US
Method for manufacturing mold and mold
US11602877B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11602877-B2 |
| Application number | US-202117445771-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 24, 2021 |
| Priority date | Aug 27, 2020 |
| Publication date | Mar 14, 2023 |
| Grant date | Mar 14, 2023 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
Provided is a method for manufacturing a mold used in an injection molding device. The manufacturing method includes: a first step of shaping a stacked body as a part of the mold by discharging a shaping material to stack layers on a base plate; and a second step of manufacturing the mold including a mold base, the base plate, and the stacked body by incorporating the base plate on which the stacked body is shaped inside an opening provided in the mold base.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing a mold used in an injection molding device, the method for manufacturing a mold comprising: a first step of shaping a stacked body as a part of the mold by discharging a shaping material from a three-dimensional shaping device to stack layers on a base plate having a plurality of through holes, wherein communication holes communicating with at least one of the through holes are formed in the stacked body after the layers are stacked; and a second step of manufacturing the mold to include a mold base, the base plate, and the stacked body by incorporating the base plate on which the stacked body is shaped inside an opening provided in the mold base. 2. The method for manufacturing a mold according to claim 1 , wherein the stacked body shaped in the first step has a cavity. 3. The method for manufacturing a mold according to claim 2 , wherein in the first step, the stacked body having the cavity is shaped by cutting after the layers are stacked. 4. The method for manufacturing a mold according to claim 2 , wherein the plurality of through holes are defined in a surface on which the layers are stacked, and the stacked body shaped in the first step is formed with the communication holes communicating with the at least one through hole through the cavity. 5. The method for manufacturing a mold according to claim 1 , wherein the base plate on which the stacked body is shaped in the first step is further provided with a concave portion in a surface on which the layers are stacked. 6. The method for manufacturing a mold according to claim 1 , wherein the base plate on which the stacked body is shaped in the first step has a shape that fits into the opening of the mold base. 7. The method for manufacturing a mold according to claim 1 , wherein the shaping material used in the first step for shaping the stacked body has a resin as a main component. 8. The method for manufacturing a mold according to claim 1 , wherein a part of the shaping material enters the through holes, the through holes in turn exerting an anchoring effect to the stacked body. 9. The method for manufacturing a mold according to claim 1 , wherein the mold is configured to be attached to the injection molding device such that an ejector pin is inserted into the communication holes.
Assignees
Inventors
Classifications
Handling of additively manufactured objects, e.g. using robots · CPC title
- B29C33/3842Primary
Manufacturing moulds, e.g. shaping the mould surface by machining · CPC title
Moulds · CPC title
Post-treatment, e.g. curing, coating or polishing · CPC title
Modular mould systems [MMS], i.e. moulds built up by stacking mould elements, e.g. plates, blocks, rods (B29C33/0088 takes precedence) · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11602877B2 cover?
- Provided is a method for manufacturing a mold used in an injection molding device. The manufacturing method includes: a first step of shaping a stacked body as a part of the mold by discharging a shaping material to stack layers on a base plate; and a second step of manufacturing the mold including a mold base, the base plate, and the stacked body by incorporating the base plate on which the st…
- Who is the assignee on this patent?
- Seiko Epson Corp
- What technology area does this patent fall under?
- Primary CPC classification B29C33/3842. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Mar 14 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).