Power semiconductor apparatus and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-11600546-B2
Application number	US-201917621249-A
Country	US
Kind code	B2
Filing date	Aug 29, 2019
Priority date	Aug 29, 2019
Publication date	Mar 7, 2023
Grant date	Mar 7, 2023

Abstract

A power semiconductor apparatus includes a mold portion, a panel that is conductive and in a flat plate shape, and a plurality of fins. The mold portion includes a power semiconductor element and a base plate that are molded. An opening is formed in the panel into which the base plate is inserted. The plurality of fins is fixed in grooves of the base plate. The panel has a plurality of protrusions on side surfaces forming the opening. Each protrusion has a fifth surface a cross section of which has a shape that tapers down toward an end of the protrusion, the cross section being parallel to a plane extending in the Z direction and a direction in which the protrusion protrudes. The base plate has cover portions covering the fifth surfaces, and is plastically deformed to allow the panel to be fitted in the base plate to fill gaps.

First claim

The invention claimed is:

1. A power semiconductor apparatus comprising:
a mold portion that includes a power semiconductor element and a base plate which are molded in molding resin, the base plate having a first surface and a second surface, a plurality of grooves being arranged on the first surface, the second surface being on a side opposite to the first surface in a Z direction perpendicular to the first surface;
a panel that is conductive and has a flat plate shape, and has an opening into which the first surface of the base plate is inserted, the panel having a third surface and a fourth surface that is on a side opposite to the third surface; and
a plurality of fins fixed in the grooves of the base plate, wherein
the panel has a plurality of protrusions on side surfaces forming the opening, each protrusion protruding, from one of the side surfaces on which the protrusion is provided, toward another of the side surfaces facing the one side surface,
each protrusion has a fifth surface, a cross section of which has a shape that tapers down toward an end of the protrusion, the cross section being parallel to a plane extending in the Z direction and a direction in which the protrusion protrudes, and
the base plate has cover portions covering the fifth surfaces of the plurality of protrusions including the ends of the protrusions, and is plastically deformed to allow the panel to be fitted in the base plate to fill gaps between side surfaces of the plurality of protrusions and the base plate,
upper surfaces of the cover portions are located at same levels as or lower than highest positions of the fifth surfaces of the protrusions in the Z direction.

2. The power semiconductor apparatus according to claim 1 , wherein an end portion of the fifth surface of each of the plurality of protrusions is a curved surface.

3. The power semiconductor apparatus according to claim 1 , wherein an end portion of the fifth surface of at least one of the plurality of protrusions has a step portion.

4. The power semiconductor apparatus according to claim 1 , wherein an end portion of the fifth surface of at least one of the plurality of protrusions is an inclined surface having a linear gradient.

5. The power semiconductor apparatus according to claim 1 , wherein
the base plate has a panel installation surface on which the panel is placed, at a position where the panel is fixed, and
each of the plurality of protrusions is placed such that a sixth surface is in contact with the panel installation surface, the sixth surface being on a side opposite to the fifth surface.

6. The power semiconductor apparatus according to claim 1 , wherein
the base plate has a panel installation surface on which the panel is placed, at a position where the panel is fixed,
the plurality of protrusions includes a first protrusion and a second protrusion, a sixth surface of the first protrusion being located at a same level as the fourth surface of the panel in the Z direction, an end of the sixth surface of the second protrusion being located on a side opposite to the third surface with respect to the fourth surface of the panel, the sixth surface being on a side opposite to the fifth surface,
the first protrusion is placed such that the sixth surface is in contact with the panel installation surface, and
at least a part of the second protrusion digs into the panel installation surface.

7. The power semiconductor apparatus according to claim 1 , wherein
the base plate has a recess between the cover portion and the first surface in the Z direction, and
a side surface of the recess has a tapered shape.

8. The power semiconductor apparatus according to claim 5 , wherein the base plate has a groove between the panel installation surface and the second surface in the Z direction.

9. The power semiconductor apparatus according to claim 1 , wherein a material that forms the base plate is softer than a material that forms the panel.

10. A method for manufacturing a power semiconductor apparatus, comprising:
forming a mold portion that includes a power semiconductor element and a base plate which are molded in molding resin, the base plate having a first surface and a second surface, a plurality of fins being fixed on the first surface, the second surface being on a side opposite to the first surface in a Z direction perpendicular to the first surface;
inserting the first surface of the base plate into an opening in a panel having a plurality of protrusions such that the plurality of protrusions of the panel is placed on the base plate, the panel being conductive and in a flat plate shape, each of the protrusions protruding from one of side surfaces on which the protrusion is provided toward another of the side surfaces facing the one side surface, the side surfaces forming the opening, the panel having a third surface and a fourth surface that is on a side opposite to the third surface; and
first pressing the plurality of protrusions with respect to the first surface of the base plate in the Z direction by using a jig, and pressing the plurality of protrusions and the first surface of the base plate in the Z direction after the jig comes into contact with the protrusions and the base plate, wherein
each protrusion has a fifth surface a cross section of which has a shape that tapers down toward an end of the protrusion, the cross section being parallel to a plane extending in the Z direction and a direction in which the protrusion protrudes.

11. The method for manufacturing a power semiconductor apparatus, according to claim 10 , wherein
the jig has a pressing surface and a side surface, the pressing surface coming into contact with the protrusion and the base plate, the pressing surface being parallel to the first surface of the base plate, the side surface being adjacent to the pressing surface, and
a part of the side surface is tapered such that an area of the jig parallel to the pressing surface decreases toward the pressing surface, the part of the side surface coming into contact with the base plate at a time of pressing.

12. A power semiconductor apparatus comprising:
a mold portion that includes a power semiconductor element and a base plate which are molded in molding resin, the base plate having a first surface and a second surface, a plurality of grooves being arranged on the first surface, the second surface being on a side opposite to the first surface in a Z direction perpendicular to the first surface;
a panel that is conductive and has a flat plate shape, and has an opening into which the first surface of the base plate is inserted, the panel having a third surface and a fourth surface that is on a side opposite to the third surface; and
a plurality of fins fixed in the grooves of the base plate, wherein
the panel has a plurality of protrusions on side surfaces forming the opening, each protrusion protruding, from one of the side surfaces on which the protrusion is provided, toward another of the side surfaces facing the one side surface,
each protrusion has a fifth surface, a cross section of which has a shape that tapers down toward an end of the protrusion, the cross section being parallel to a plane extending in the Z direction and a direction in which the protrusion protrudes, and
the base plate has cover portions covering the fifth surfaces of the plurality of protrusions including the ends of the protrusions, and has recesses formed between the cover portions and the first surface in the Z direction, and is plastically deformed to allow the panel to be fitted in the base plate to fill gaps between side surfaces of the plurality of protrusions and the base plate, and
a side surf

Assignees

• Mitsubishi Electric Corp

Inventors

• Yoshihara Hiroyuki
• Masumori Shunji
• Hayashi Kenichi
• Goto Masaki

Classifications

• H10W76/60

  Seals · CPC title

• H10W70/461

  specially adapted for cooling · CPC title

• H10W70/027

  Mechanical treatments, e.g. deforming, punching or cutting · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title