Micro-component transfer head, micro-component transfer device, and micro-component display

Patent metadata

Field	Value
Publication number	US-11600508-B2
Application number	US-202015931621-A
Country	US
Kind code	B2
Filing date	May 14, 2020
Priority date	Nov 18, 2019
Publication date	Mar 7, 2023
Grant date	Mar 7, 2023

Abstract

Herein disclosed are a micro-component transfer head, a micro-component transfer device, and a micro-component display. Said micro-component transfer head comprises a carrying surface that corresponds to a micro-component extraction area. Said extraction area conforms with a first geometric object, which comprises at least an acute angle. A second geometric object comprises at least a right angle and is constituted of n copies of the first geometric object, n being an integer greater than 1. The shape of the first geometric object differs from that of the second.

First claim

What is claimed is:

1. A micro-component transfer head, comprising:
a carrying surface corresponding to a micro-component extraction area; and
a side when looked from the outside of the micro-component transfer head and that is opposite to and farthest from the carrying surface, wherein the shape of the side differs from the shape of the first geometric object, and an area of said other side is greater than an area of the carrying surface;
wherein the micro-component extraction area conforms with a first geometric object, the first geometric object comprises at least an acute angle, and n copies of the first geometric object constitute a second geometric object, n being an integer greater than 1;
wherein the second geometric object comprises at least a right angle, the first geometric object is dissimilar in shape to the second geometric object, the carrying surface is configured to extract, when coming into contact with a surface of a wafer, a plurality of micro-components situated at the surface of the wafer and within the micro-component extraction area, the orthogonal projection of the micro-component extraction area on the surface of the wafer is the first geometric object, and the orthogonal proj ection of the carrying surface on the surface of the wafer defines the micro-component extraction area.

2. The micro-component transfer head according to claim 1 , wherein the first geometric object is triangular, and the second geometric object is rectangular.

3. The micro-component transfer head according to claim 2 , wherein the first geometric object further comprises a right angle, and n is an even number.

4. The micro-component transfer head according to claim 3 , wherein the first geometric object is a right triangle having a long cathetus and a short cathetus, the length of the long cathetus being 1.25 to 5 times the length of the short cathetus.

5. The micro-component transfer head according to claim 1 , wherein the first geometric object is a circular sector, and the second geometric object is circular.

6. The micro-component transfer head according to claim 1 , further configured to adjust, subject to a command, the micro-component extraction area into conforming with a third geometric object, the area of the third geometric object unequal to the area of the first geometric object.

7. A micro-component transfer device, configured to extract a plurality of micro-components in a wafer, and comprising:
a platform configured to hold the wafer; and
a micro-component transfer head positioned opposite the platform and comprising:
a carrying surface corresponding to a micro-component extraction area; and
a side when looked from the outside of the micro-component transfer head and that is opposite to and farthest from the carrying surface, wherein the shape of the side differs from the shape of the first geometric object, and an area of said other side is greater than an area of the carrying surface;

wherein the micro-component extraction area conforms with a first geometric object, the carrying surface is configured to extract, when coming into contact with a surface of the wafer, the micro-components situated at the surface of the wafer and within the micro-component extraction area, the orthogonal projection of the micro-component extraction area on the surface of the wafer is the first geometric object, and the orthogonal projection of the carrying surface on the surface of the wafer defines the micro-component extraction area, and a first end of the first geometric object is generally aligned with the center of the wafer.

8. The micro-component transfer device according to claim 7 , wherein the first end of the first geometric object is an acute angle.

9. The micro-component transfer device according to claim 8 , wherein the first geometric object is triangular or a circular sector.

10. The micro-component transfer device according to claim 9 , wherein the first geometric object is a right triangle having a long cathetus and a short cathetus, the length of the long cathetus being 1.25 to 5 times the length of the short cathetus.

11. The micro-component transfer device according to claim 8 , wherein the platform is further configured to rotate the wafer while generally keeping the center of the wafer stationary.

12. The micro-component transfer device according to claim 7 , wherein the micro-component transfer head is further configured to adjust, subject to a command, the micro-component extraction area into conforming with a third geometric object, the area of the third geometric object unequal to the area of the first geometric object.

13. The micro-component transfer device according to claim 12 , wherein the area of the third geometric object is less than the area of the first geometric object.

14. A micro-component display, comprising:
a receiving substrate having a display surface, the display surface comprising a plurality of micro-component carriage areas;
wherein each of the micro-component carriage areas conforms with a first geometric object;
wherein the first geometric object comprises at least an acute angle, and within each of the micro-component carriage areas there are a plurality of micro-components;
wherein every two adjacent micro-components within the same one of the micro-component carriage areas and arranged in a row/column direction are spaced a first distance apart, every two adjacent micro-components respectively within different ones of the micro-component carriage areas and arranged in the row/column direction are separated by at least a second distance, the first distance being unequal to the second distance, and the micro-component carriage areas fill up the display surface.

15. The micro-component display according to claim 14 , wherein:
the display surface contains a second geometric object;
n copies of the first geometric object constitute the second geometric object, n being an integer greater than 1;
the second geometric object comprises at least a right angle; and
the first geometric object is dissimilar in shape to the second geometric object.

16. The micro-component display according to claim 15 , wherein the shape of the display surface conforms with the second geometric object.

Assignees

• Playnitride Display Co Ltd

Inventors

• Li Yu-Chu
• Chen Pei-Hsin
• Shih Yi-Chun
• Chen Yi-Ching

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/0711

  Apparatus therefor · CPC title

• H10W72/07178

  Means for aligning · CPC title

• H10W72/90

  Bond pads, in general · CPC title