Analyzing a buried layer of a sample

Patent metadata

Field	Value
Publication number	US-11598633-B2
Application number	US-202117378999-A
Country	US
Kind code	B2
Filing date	Jul 19, 2021
Priority date	Jul 19, 2021
Publication date	Mar 7, 2023
Grant date	Mar 7, 2023

Abstract

Analyzing a buried layer on a sample includes milling a spot on the sample using a charged particle beam of a focused ion beam (FIB) column to expose the buried layer along a sidewall of the spot. From a first perspective a first distance is measured between a first point on the sidewall corresponding to an upper surface of the buried layer and a second point on the sidewall corresponding to a lower surface of the buried layer. From a second perspective a second distance is measured between the first point on the sidewall corresponding to the upper surface of the buried layer and the second point on the sidewall corresponding to the lower surface of the buried layer. A thickness of the buried layer is determined using the first distance and the second distance.

First claim

What is claimed is:

1. An inspection system for analyzing a buried layer of a sample, comprising:
a focused ion beam (FIB) column;
a scanning electron microscopy (SEM) column; and
a computer readable medium comprising instructions that when executed cause the inspection system to perform steps comprising:
milling a spot on the sample using a charged particle beam of the FIB column to expose the buried layer along a sidewall of the spot, wherein after the milling the sidewall of the spot is sloped;
obtaining a first image of the sidewall of the spot using the SEM column, the first image obtained from a first perspective associated with a first angle relative to a surface of the sample;
measuring, using the SEM column, a first distance between a first point on the sidewall corresponding to an upper surface of the buried layer and a second point on the sidewall corresponding to a lower surface of the buried layer, wherein the first distance is projected onto a horizontal plane or a vertical plane;
obtaining a second image of the sidewall of the spot using the SEM column, the second image obtained from a second perspective associated with a second angle relative to the surface of the sample;
measuring, using the SEM column, a second distance between the first point on the sidewall corresponding to the upper surface of the buried layer and the second point on the sidewall corresponding to the lower surface of the buried layer, wherein the second distance is projected onto the horizontal plane or the vertical plane, and the first point and the second point fall approximately on a line extending vertically through the buried layer; and
determining a thickness of the buried layer using the first angle, the first distance, the second angle, and the second distance.

2. The inspection system of claim 1 wherein the thickness of the buried layer is a vertical distance between the upper surface of the buried layer and the lower surface of the buried layer.

3. The inspection system of claim 1 wherein the first angle is approximately normal to the surface of the sample, and the second angle is approximately 45° to the surface of the sample.

4. The inspection system of claim 1 wherein the line extending vertically through the buried layer is approximately normal to the upper surface of the buried layer or the lower surface of the buried layer.

5. The inspection system of claim 1 wherein the computer readable medium further comprises instructions that when executed cause the inspection system to mill the spot with the charged particle beam in a focused mode.

6. The inspection system of claim 1 wherein the computer readable medium further comprises instructions that when executed cause the inspection system to mill the spot with the charged particle beam in a de-focused mode.

7. The inspection system of claim 1 wherein the computer readable medium further comprises instructions that when executed cause the inspection system to mill the spot without scanning the charged particle beam.

8. The inspection system of claim 1 wherein the charged particle beam of the FIB column is generated using a plasma xenon source.

9. A method of analyzing a buried layer on a sample, the method comprising:
milling a spot on the sample using a charged particle beam of a focused ion beam (FIB) column to expose the buried layer along a sidewall of the spot, wherein the spot is milled without scanning the charged particle beam, and after the milling, the sidewall of the spot is sloped;
obtaining a first image of the sidewall of the spot, the first image obtained from a first perspective associated with a first angle relative to the sample;
measuring, using the first image, a first distance between a first point on the sidewall corresponding to an upper surface of the buried layer and a second point on the sidewall corresponding to a lower surface of the buried layer;
obtaining a second image of the sidewall of the spot, the second image obtained from a second perspective associated with a second angle relative to the sample, wherein the first angle and first perspective are different from the second angle and the second perspective;
measuring, using the second image, a second distance between the first point on the sidewall corresponding to the upper surface of the buried layer and the second point on the sidewall corresponding to the lower surface of the buried layer, wherein the first point and the second point fall approximately on a line extending vertically through the buried layer; and
determining a thickness of the buried layer using the first distance, the first angle associated with the first perspective, the second distance, and the second angle associated with the second perspective.

10. The method of claim 9 wherein the first angle associated with the first perspective and the second angle associated with the second perspective are relative to a surface of the sample.

11. The method of claim 9 wherein the thickness of the buried layer is a vertical distance between the upper surface of the buried layer and the lower surface of the buried layer.

12. The method of claim 9 wherein the line extending vertically through the buried layer is approximately normal to the upper surface of the buried layer or the lower surface of the buried layer.

13. The method of claim 9 wherein the spot is milled with the charged particle beam in a focused mode.

14. The method of claim 9 wherein the spot is milled with the charged particle beam in a de-focused mode.

15. The method of claim 9 wherein the charged particle beam is generated using a plasma xenon source.

16. The method of claim 9 wherein the buried layer on the sample underlies an overlying layer on the sample.

17. The method of claim 9 wherein the sample is a semiconductor wafer.

18. The method of claim 9 wherein the first image and the second image are obtained using a scanning electron microscopy (SEM) technique.

19. The method of claim 9 wherein the first distance and the second distance are projected onto a horizontal plane or a vertical plane.

20. The method of claim 9 further comprising monitoring a fabrication process using the thickness of the buried layer.

Assignees

• Applied Materials Israel Ltd

Inventors

• Mairov Alexander
• Bruner Gal
• Zur Yehuda

Classifications

• H01J2237/24578

  Spatial variables, e.g. position, distance · CPC title

• G01B2210/56

  Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth · CPC title

• G01B15/02 Primary

  for measuring thickness · CPC title

• H01J2237/3174

  Etching microareas · CPC title

• H01J37/3045

  Object or beam position registration · CPC title