Sound damping system
US-2016153187-A1 · Jun 2, 2016 · US
US11598087B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11598087-B2 |
| Application number | US-201815995348-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 1, 2018 |
| Priority date | Jun 3, 2017 |
| Publication date | Mar 7, 2023 |
| Grant date | Mar 7, 2023 |
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A sound damping wallboard for installation on an installed wallboard, a sound damping wallboard system, and a method of constructing a sound damping wallboard on a building structure are disclosed. The sound damping wallboard includes a gypsum layer having a gypsum layer inner surface and a gypsum layer outer surface, a first sound damping layer disposed at the gypsum layer inner surface and having a first sound damping layer inner surface opposite the gypsum layer inner surface, a first encasing layer disposed at the gypsum layer outer surface, a second encasing layer disposed at the first sound damping layer inner surface, and a second sound damping layer disposed at the second encasing layer opposite the first sound damping layer inner surface.
Opening claim text (preview).
The invention claimed is: 1. A sound damping wallboard, comprising: a gypsum layer having a gypsum layer outer surface and a gypsum layer inner surface opposite the gypsum layer outer surface; a first encasing layer disposed at the gypsum layer outer surface wherein the first encasing layer includes paper; a first sound damping layer disposed at the gypsum layer inner surface and having a first sound damping layer surface opposite the gypsum layer; a second sound damping layer disposed at the first sound damping layer surface and having a second sound damping layer surface opposite the first sound damping layer; a second encasing layer disposed at the first sound damping layer surface; a third encasing layer disposed at the gypsum layer inner surface; a fourth encasing layer disposed at the second sound damping layer surface wherein the fourth encasing layer includes paper, fiberglass, foil, or a polymer; and a first edge encasing layer present on an edge of the sound damping wallboard, wherein the first edge encasing layer connects the first encasing layer and the fourth encasing layer, wherein the first edge encasing layer is formed of a material selected from the group consisting of paper, fiberglass, and foil. 2. The sound damping wallboard of claim 1 , wherein the first sound damping layer is positioned on the third encasing layer. 3. The sound damping wallboard of claim 1 , wherein the second sound damping layer is positioned on the second encasing layer. 4. The sound damping wallboard of claim 1 , wherein the first and second sound damping layers comprise different sound damping materials. 5. The sound damping wallboard of claim 1 , wherein the first and second sound damping layers have different thicknesses. 6. The sound damping wallboard of claim 1 , wherein the first and second sound damping layers include the same polymer wherein the first and second sound damping layers include different additives wherein the additive in the first sound damping layer has a different density than the additive in the second sound damping layer. 7. The sound damping wallboard of claim 1 , wherein the first sound damping layer, the second sound damping layer, or both include an acrylic polymer or copolymer. 8. The sound damping wallboard of claim 1 , wherein the second encasing layer includes paper. 9. The sound damping wallboard of claim 1 , wherein the sound damping wallboard exhibits a sound transmission loss of 20% or more in comparison to a wallboard without a sound damping layer. 10. The sound damping wallboard of claim 1 , wherein the first edge encasing layer further connects the first sound damping layer, the second sound damping layer, the second encasing layer, and the third encasing layer individually or in combination. 11. The sound damping wallboard of claim 10 , wherein the first edge encasing layer connects five or more layers. 12. The sound damping wallboard of claim 1 , wherein the first sound damping layer, the second sound damping layer, or both are a homogenous layer. 13. A sound damping wallboard, comprising: a gypsum layer having a gypsum layer outer surface and a gypsum layer inner surface opposite the gypsum layer outer surface; a first encasing layer disposed on the gypsum layer outer surface wherein the first encasing layer includes paper; a first sound damping layer having a first sound damping layer surface opposite the gypsum layer; a second encasing layer disposed on the first sound damping layer surface; a third encasing layer disposed on the gypsum layer inner surface wherein the first sound damping layer is positioned on the third encasing layer; a second sound damping layer positioned on the second encasing layer, and having a second sound damping layer surface opposite the first sound damping layer; a fourth encasing layer disposed on the second sound damping layer surface wherein the third encasing layer comprises paper, fiberglass, foil, or a polymer; and a first edge encasing layer present on an edge of the sound damping wallboard, wherein the first edge encasing layer connects the first encasing layer and the fourth encasing layer, wherein the first edge encasing layer is formed of a material selected from the group consisting of paper, fiberglass, and foil. 14. The sound damping wallboard of claim 13 , wherein the fourth encasing layer comprises a different material than the first and second encasing layers. 15. A method of installing the sound damping wallboard of claim 13 on installed wallboard, the method comprising: attaching the sound damping wallboard onto the installed wallboard wherein the first sound damping layer is positioned between the gypsum layer and the installed wallboard. 16. The method of claim 15 , wherein the gypsum layer of the sound damping wallboard has a density that is higher than a density of the installed wallboard. 17. A method of forming a sound damping wallboard, the method comprising: providing a first encasing layer; forming a gypsum layer on the first encasing layer, the gypsum layer having a gypsum layer outer surface on the first encasing layer and a gypsum layer inner surface opposite the gypsum layer outer surface; providing a third encasing layer at the gypsum layer inner surface wherein the third encasing layer comprises paper; providing a first sound damping layer on the third encasing layer wherein the first sound damping layer has a first sound damping layer inner surface opposite the gypsum layer inner surface; providing a second encasing layer at the first sound damping layer inner surface; providing a second sound damping layer on the second encasing layer wherein the second sound damping layer has a second sound damping layer inner surface opposite the first sound damping layer inner surface; providing a fourth encasing layer at the second sound damping layer inner surface wherein the fourth encasing layer includes paper, fiberglass, foil, or a polymer; and providing a first edge encasing layer, wherein the first edge encasing layer is present on an edge of the sound damping wallboard, wherein the first edge encasing layer connects the first encasing layer and the fourth encasing layer, wherein the first edge encasing layer is formed of a material selected from the group consisting of paper, fiberglass, and foil. 18. The method of claim 17 , wherein the providing the first sound damping layer includes applying a precursor solution containing a polymer. 19. The method of claim 18 , wherein the method further comprises drying the precursor solution to provide the first sound damping layer.
Physical, chemical or physicochemical properties · CPC title
comprising natural stone or artificial stone · CPC title
comprising polyolefins · CPC title
comprising such {particular} substance as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a glass layer B32B17/06; layered products with at least two ceramic layers composed mainly of ceramic B32B18/00)} · CPC title
next to a fibrous or filamentary layer · CPC title
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