Multilayer coil component and mounted structure of the multilayer coil component

Patent metadata

Field	Value
Publication number	US-11594366-B2
Application number	US-202117514020-A
Country	US
Kind code	B2
Filing date	Oct 29, 2021
Priority date	Nov 2, 2020
Publication date	Feb 28, 2023
Grant date	Feb 28, 2023

Abstract

A multilayer coil component 1 includes an element body 2, a pair of terminal electrodes 3, and a glass layer G provided on the terminal electrode 3. Each of the pair of terminal electrodes 3 is provided with a plurality of first projecting portions 33 tapered toward the other facing terminal electrode 3 side in an end portion 31b facing the side in the facing direction of a pair of end surfaces 2a and 2b. The glass layer G is provided along the edge of the terminal electrode 3 including at least the first projecting portion 33 in the end portion 31b of the terminal electrode 3.

First claim

What is claimed is:

1. A multilayer coil component comprising:
an element body formed by laminating a plurality of insulator layers and having a pair of end surfaces facing each other, a pair of main surfaces facing each other, and a pair of side surfaces facing each other, one of the main surfaces being a mounting surface;
a pair of terminal electrodes disposed in recessed portions formed on the mounting surface on the respective end surface sides of the element body; and
a glass layer provided on the terminal electrode, wherein
each of the pair of terminal electrodes is provided with a plurality of first projecting portions tapered toward the other facing terminal electrode side in a first end portion facing the side in a facing direction of the pair of end surfaces, and
the glass layer is provided along an edge of the terminal electrode including at least the first projecting portion in the first end portion of the terminal electrode.

2. The multilayer coil component according to claim 1 , wherein the glass layer covers 60% or more of an area of the projecting portion.

3. The multilayer coil component according to claim 1 , wherein an edge of the glass layer on the end surface side has a wave shape corresponding to the plurality of first projecting portions.

4. The multilayer coil component according to claim 1 , wherein
the pair of terminal electrodes are also disposed in recessed portions respectively formed on the pair of end surfaces,
a second end portion of the terminal electrode disposed on the end surface on the other main surface side is provided with a plurality of second projecting portions tapered toward the main surface side, and
the glass layer is provided along an edge of the terminal electrode including at least the second projecting portion in the second end portion of the terminal electrode.

5. The multilayer coil component according to claim 1 , wherein
each of the pair of terminal electrodes is provided with a plurality of third projecting portions tapered toward the end surface side in a third end portion on the end surface side, and
the glass layer is provided along an edge of the terminal electrode including at least the third projecting portion in the third end portion of the terminal electrode.

6. A mounted structure of a multilayer coil component comprising:
the multilayer coil component according to claim 1 ;
a circuit board provided with a land electrode where the multilayer coil component is mounted; and
solder disposed between the terminal electrode of the coil component and the land electrode, wherein
the solder is not formed on the glass layer, and
ends of the land electrode and the solder do not overlap the first end portion of the terminal electrode when viewed from a facing direction of the pair of main surfaces of the element body.

Assignees

• Tdk Corp

Inventors

• Kazuta Youichi
• Takubo Yuichi
• Shiga Yuto
• Urabe Junichiro
• Hamachi Noriaki
• TOBITA Kazuya
• Matsuura Toshinori

Classifications

• H01F27/292 Primary

  Surface mounted devices · CPC title

• H05K3/3442

  having edge contacts, e.g. leadless chip capacitors, chip carriers · CPC title

• H05K2201/1003

  Non-printed inductor · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H01F2027/065

  Mounting on printed circuit boards · CPC title