Electrolytic copper foil

Patent metadata

Field	Value
Publication number	US-11588175-B2
Application number	US-202016844050-A
Country	US
Kind code	B2
Filing date	Apr 9, 2020
Priority date	Apr 30, 2019
Publication date	Feb 21, 2023
Grant date	Feb 21, 2023

Abstract

An electrolytic copper foil includes a raw foil layer having a first surface and a second surface opposite to the first surface. In the X-ray diffraction spectrum of the first surface, a ratio of the diffraction peak intensity I(200) of the (200) crystal face of the first surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the first surface is between 0.5 and 2.0. In the X-ray diffraction spectrum of the second surface, a ratio of the diffraction peak intensity I(200) of the (200) crystal face of the second surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the second surface is also between 0.5 and 2.0. A method for producing the electrolytic copper foil, and a lithium ion secondary battery is also provided.

First claim

What is claimed is:

1. An electrolytic copper foil, comprising:
a raw foil layer having a first surface and a second surface opposite to the first surface;
wherein in an X-ray diffraction spectrum of the first surface, a ratio of a diffraction peak intensity I(200) of a (200) crystal face of the first surface relative to a diffraction peak intensity I(111) of a (111) crystal face of the first surface is between 0.5 and 2.0;
wherein in an X-ray diffraction spectrum of the second surface, a ratio of a diffraction peak intensity I(200) of a (200) crystal face of the second surface relative to a diffraction peak intensity I(111) of a (111) crystal face of the second surface is between 0.5 and 2.0;
wherein the first surface is a surface that is in contact with a rotating electrode drum during a plating process and is defined as an S surface; and the second surface is a surface that is opposite to the S surface and is defined as an M surface; wherein in an X-ray diffraction spectrum of the S surface, a ratio of a diffraction peak intensity I(200) of a (200) crystal face of the S surface relative to a diffraction peak intensity I(111) of a (111) crystal face of the S surface is defined as a first diffraction peak intensity ratio; and in an X-ray diffraction spectrum of the M surface, a ratio of a diffraction peak intensity I(200) of a (200) crystal face of the M surface relative to a diffraction peak intensity I(111) of a (111) crystal face of the M surface is defined as a second diffraction peak intensity ratio; wherein the first diffraction peak intensity ratio is less than the second diffraction peak intensity ratio; and
wherein an absolute value of a difference between the first diffraction peak intensity ratio and the second diffraction peak intensity ratio is not less than 0.01 and not more than 0.30.

2. The electrolytic copper foil according to claim 1 , wherein a distance between the first surface and the second surface is defined as a thickness of the electrolytic copper foil, and the thickness is between 2 μm and 20 μm.

3. The electrolytic copper foil according to claim 1 , wherein the electrolytic copper foil has a tensile strength between 28 kgf/mm 2 and 40 kgf/mm 2 and an elongation not less than 7% before a heat treatment.

4. The electrolytic copper foil according to claim 3 , wherein the electrolytic copper foil has a tensile strength between 25 kgf/mm 2 and 35 kgf/mm 2 and an elongation not less than 9.5% after the heat treatment; wherein the heat treatment includes: baking the electrolytic copper foil at a temperature between 130° C. and 250° C. for 0.5 hours to 1.5 hours.

5. The electrolytic copper foil according to claim 1 , wherein a tensile strength of the electrolytic copper foil that is treated by a heat treatment is between 65% and 95% of a tensile strength of the electrolytic copper foil that is not treated by the heat treatment, and an elongation of the electrolytic copper foil that is treated by the heat treatment is between 100% and 140% of an elongation of the electrolytic copper foil that is not treated by the heat treatment.

6. The electrolytic copper foil according to claim 1 , further comprising:
a first oxidation resistant layer disposed on the first surface; and
a second oxidation resistant layer disposed on the second surface;
wherein based on a total weight of the electrolytic copper foil, each of the first oxidation resistant layer and the second oxidation resistant layer includes a non-copper metal element in an amount ranging from 1 ppm to 1,000 ppm; wherein the non-copper metal element is at least one element selected from the group consisting of chromium, zinc, nickel, molybdenum, manganese, phosphorus, and combinations thereof.

7. The electrolytic copper foil according to claim 1 , further comprising a plurality of crystal grains distributed between the first surface and the second surface; wherein without heat treatment, each crystal grain has a grain size between 20 nm and 45 nm; wherein a grain size of each crystal grain that is treated by the heat treatment is between 90% and 130% of a grain size of each crystal grain that is not treated by the heat treatment.

Assignees

• Nanya Plastics Corp

Inventors

• Chen Chia-Ling
• Tzou Ming-Jen

Classifications

• H01M4/045

  Electrochemical coating; Electrochemical impregnation · CPC title

• H01M4/667

  in the form of layers, e.g. coatings · CPC title

• C25D5/50

  by heat-treatment · CPC title

• H01M2300/0025

  Organic electrolyte · CPC title

• C25D3/54

  of metals not provided for in groups C25D3/04 - C25D3/50 · CPC title