Epitaxial structure

US11588015B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11588015-B2
Application numberUS-202217689997-A
CountryUS
Kind codeB2
Filing dateMar 9, 2022
Priority dateAug 1, 2018
Publication dateFeb 21, 2023
Grant dateFeb 21, 2023

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Abstract

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An epitaxial structure includes a substrate, a nucleation layer on the substrate, a buffer layer on the nucleation layer, and a nitride layer on the buffer layer. The nucleation layer consists of regions in a thickness direction, wherein a chemical composition of the regions is Al(1-x)InxN, where 0≤x≤1. A maximum value of the x value in the plurality of regions is the same, a minimum value of the x value in the plurality of regions is the same, and an absolute value of a gradient slope of each of the regions is 0.1%/nm to 50%/nm. A thickness of the nucleation layer is less than a thickness of the buffer layer. A roughness of a surface of the nucleation layer in contact with the buffer layer is greater than a roughness of a surface of the buffer layer in contact with the nitride layer.

First claim

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What is claimed is: 1. An epitaxial structure comprising: a substrate; a nucleation layer disposed on the substrate, wherein the nucleation layer consists of a plurality of regions in a thickness direction, and a chemical composition of the plurality of regions is Al (1-x) In x N, where 0≤x≤1, wherein a maximum value of the x value in the plurality of regions is the same, a minimum value of the x value in the plurality of regions is the same, and an absolute value of a gradient slope of each of the regions is 0.1%/nm to 50%/nm; a buffer layer disposed on the nucleation layer, wherein a thickness of the nucleation layer is less than a thickness of the buffer layer; and a nitride layer disposed on the buffer layer, wherein a roughness of a surface of the nucleation layer in contact with the buffer layer is greater than a roughness of a surface of the buffer layer in contact with the nitride layer. 2. The epitaxial structure according to claim 1 , wherein the absolute value of the gradient slope of each of the regions is 0.5%/nm to 10%/nm. 3. The epitaxial structure according to claim 1 , wherein an initial content of the x value of the nucleation layer is 10% to 100%, an end content of the x value is 0% to 90%, and an initial content of the (1-x) value is 0% to 90%, and an end content of the (1-x) value is 10% to 100%, wherein the initial content of the x value is located on a bottom portion of the nucleation layer close to the substrate, and the end content of the x value is located on a top portion of the nucleation layer close to the buffer layer. 4. The epitaxial structure according to claim 3 , wherein the initial content of the x value of the nucleation layer is 50% to 100%, the end content of the x value is 0% to 50%, the initial content of the (1-x) value is 0% to 50%, and the end content of the (1-x) value is 50% to 100%. 5. The epitaxial structure according to claim 1 , wherein the thickness of the nucleation layer is 1 nm to 500 nm. 6. The epitaxial structure according to claim 5 , wherein the thickness of the nucleation layer is 1 nm to 50 nm. 7. The epitaxial structure according to claim 1 , wherein a number of the plurality of regions of the nucleation layer is 2 to 100. 8. The epitaxial structure according to claim 7 , wherein the number of the plurality of regions of the nucleation layer is 2 to 20. 9. The epitaxial structure according to claim 1 , wherein the roughness of the surface of the nucleation layer in contact with the buffer layer is 1 nm to 10 nm. 10. The epitaxial structure according to claim 9 , wherein the roughness of the surface of the nucleation layer in contact with the buffer layer is 1 nm to 3 nm.

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What does patent US11588015B2 cover?
An epitaxial structure includes a substrate, a nucleation layer on the substrate, a buffer layer on the nucleation layer, and a nitride layer on the buffer layer. The nucleation layer consists of regions in a thickness direction, wherein a chemical composition of the regions is Al(1-x)InxN, where 0≤x≤1. A maximum value of the x value in the plurality of regions is the same, a minimum value of t…
Who is the assignee on this patent?
Globalwafers Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P14/3216. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 21 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).