Method and apparatus for detecting defects on substrate

Patent metadata

Field	Value
Publication number	US-11587235-B2
Application number	US-202117141770-A
Country	US
Kind code	B2
Filing date	Jan 5, 2021
Priority date	Jun 29, 2020
Publication date	Feb 21, 2023
Grant date	Feb 21, 2023

Abstract

A method for detecting a defect on a substrate, including receiving a first image, generating a second image, by converting the first image to grayscale levels, calculating a first gray level value, having a maximum number of pixels in the second image, and second and third gray level values, having a number of pixels in the second image equal to a predetermined fraction of the first gray level value, from a histogram of the number of pixels respective to the grayscale levels of the second image, converting the second image into a third image having pixels at a level lower than that of the first gray level value and a fourth image having pixels at a level equal to or higher than the first gray level value, generating fifth and sixth images by detecting edges by applying a Canny algorithm to the third and fourth images, respectively.

First claim

What is claimed is:

1. A method for detecting a defect on a substrate, comprising:
receiving a first image of a subject that is generated by a measuring apparatus;
generating a second image, by converting the first image to grayscale levels;
calculating a first gray level value, having a maximum number of pixels in the second image, and second and third gray level values, having a number of pixels in the second image equal to a predetermined fraction of the first gray level value, from a histogram of the number of pixels respective to the grayscale levels of the second image;
converting the second image into a third image comprising pixels at a level lower than that of the first gray level value and converting the second image into a fourth image comprising pixels at a level equal to or higher than the first gray level value;
generating fifth and sixth images by detecting edges by applying a Canny algorithm to the third and fourth images, respectively, and overlapping the edges that are detected with the third and fourth images, wherein second and third gray level values are applied as respective low thresholds; and
overlapping and outputting the fifth and sixth images.

2. The method of claim 1 , wherein converting the second image into the third and fourth images comprises applying first and second activation functions to the second image.

3. The method of claim 2 , wherein the first and second activation functions respectively comprise a rectified linear unit (ReLU) function.

4. The method of claim 3 , wherein the first and second activation functions have the first gray level value as a threshold and satisfy Formula 1 and Formula 2 below:
ƒ( x )=0 for x<GV 1,ƒ( x )= x for x≥GV 1  (Formula 1)

ƒ( x )= x for x<GV 1,ƒ( x )=0 for x≥GV 1,  (Formula 2)

where GV1 is the first gray level value.

5. The method of claim 1 , further comprising blurring the first image before generating the second image.

6. The method of claim 5 , wherein blurring the first image comprises applying a Gaussian filter to the first image.

7. The method of claim 1 , wherein:
the subject is a wafer, and
the measuring apparatus is configured to scan a surface of the wafer.

8. The method of claim 1 , wherein the predetermined fraction is 1/10.

9. A method for detecting a defect on a substrate; comprising:
obtaining a grayscale image;
calculating a first gray level value corresponding to a maximum pixel number, and second and third gray level values that are a predetermined fraction of a maximum value associated with the maximum pixel number, from a histogram of the grayscale image;
generating a first image having a gray level lower than the first gray level value and a second image having a gray level equal to or higher than the first gray level value by converting the grayscale image; and
detecting edges by applying an edge detecting algorithm to the first and second images, wherein the second and third gray level values are applied as low and high thresholds of the edge detecting algorithm, respectively.

10. The method of claim 9 , wherein:
the grayscale image comprises a plurality of pixels,
the first image includes pixels having a level value below the first gray level value among the plurality of the pixels,
the second image includes pixels having a level value equal to or higher than the first gray level value among the plurality of the pixels.

11. The method of claim 9 , wherein the third gray level value is larger than the second gray level value.

12. The method of claim 9 , wherein the second and third gray level values in the histogram are symmetrically arranged with reference to the first gray level value.

13. The method of claim 9 , wherein the edge detecting algorithm is a Canny algorithm.

14. The method of claim 9 , further comprising detecting straight lines connecting the edges by applying a Hough algorithm after detecting the edges.

15. The method of claim 9 , further comprising generating third and fourth images by overlapping the edges detected in the first and second images with the first and second images.

16. An apparatus for detecting a defect on a substrate; comprising:
a measuring apparatus configured to image a subject to generate a first image; and
an image processing unit configured to perform operations comprising:
receiving the first image of the subject generated by the measuring apparatus;
generating a second image by converting the first image to grayscale levels;
calculating a first gray level value, having a maximum number of pixels in the second image, and second and third gray level values, having a number of pixels in the second image equal to a predetermined fraction of the first gray level value, from a histogram of the number of pixels respective to the grayscale levels of the second image;
converting the second image into a third image comprising pixels at a level lower than that of the first gray level value and converting the second image into a fourth image comprising pixels at a level equal to or higher than the first gray level value;
generating fifth and sixth images by detecting edges by applying a Canny algorithm to the third and fourth images, respectively, and overlapping the edges that are detected with the third and fourth images, wherein the second and third gray level values are applied as respective low thresholds; and
overlapping and outputting the fifth and sixth images.

17. The apparatus of claim 16 , wherein the image processing unit is configured to generate the third and fourth images by applying different first and second activation functions to the second image.

18. The apparatus of claim 17 , wherein the fifth and sixth images are overlapped to generate a seventh image in which the defect on the substrate is indicated.

19. The apparatus of claim 16 , wherein the measuring apparatus comprises an electron microscope, and
wherein the electron microscope is a critical dimension scanning electron microscope (CD-SEM), a cross-sectional SEM, or a transmission electron microscope (TEM).

20. The apparatus of claim 16 , wherein:
the subject is a wafer, and
the measuring apparatus is configured to scan a surface of the wafer.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Sunghee
• Chang Kyubaik

Classifications

• G06T2207/10061

  from scanning electron microscope · CPC title

• G06T7/0004 Primary

  Industrial image inspection · CPC title

• G06T7/155

  involving morphological operators · CPC title

• G06T7/97

  Determining parameters from multiple pictures (depth or shape recovery from multiple images G06T7/55; stereo camera calibration G06T7/85) · CPC title

• G06T7/136

  involving thresholding · CPC title