Micro-electromechanical (MEM) power relay

Patent metadata

Field	Value
Publication number	US-11584643-B2
Application number	US-202017098107-A
Country	US
Kind code	B2
Filing date	Nov 13, 2020
Priority date	Nov 13, 2019
Publication date	Feb 21, 2023
Grant date	Feb 21, 2023

Abstract

A micro-electromechanical (MEM) relay and its fabrication process. The MEM relay includes a movable actuator electrode anchored to a substrate with two cantilever beams. Below the actuator electrode, there are three fixed electrodes. These three electrodes are the gate, the input, and the output contacts. The square base of the actuator electrode, and the square gate electrode below it, form an electrostatic parallel-plate actuator. When a voltage is applied between the actuator electrode and the gate electrode, the actuator electrode is pulled-down due to electrostatic attraction closing the relay. When the voltage is removed, the cantilever beams act as springs opening the relay.

First claim

We claim:

1. A micro-electromechanical (MEM) relay comprising:
a movable actuator electrode in the shape of a square attached to a substrate by two straight cantilever beams each extending between the substrate and the movable actuator electrode parallel to opposing sides of the square;
three separated fixed electrodes also attached to the substrate located below the actuator electrode, the three separated fixed electrodes including a gate electrode, an input electrode and an output electrode;
a conductive contact bar attached to the actuator electrode; the contact bar on an opposite side of the square actuator electrode from the side which extends cantilever beams to the substrate, the contact bar electrically isolated from the actuator electrode;
the actuator electrode and the gate electrode constructed such that application of an applied voltage greater than a particular threshold voltage applied between the actuator electrode and the gate electrode causes the actuator electrode to be pulled toward the gate electrode by electrostatic force causing the contact bar to make contact with both the input electrode and the output electrode shorting the input electrode to the output electrode.

2. The MEM relay of claim 1 , wherein the two cantilever beams act as springs causing the actuator electrode to separate from the gate electrode when the applied voltage is removed.

3. The MEM relay of claim 1 , wherein, the contact bar is electrically isolated from the actuator electrode by a dielectric layer.

4. The MEM relay of claim 3 , wherein the dielectric layer is a polyamide and is approximately 12 μm thick.

5. The MEM relay of claim 1 , wherein the actuator electrode is approximately 18 μm thick copper sheet.

6. The MEM relay of claim 1 , wherein the substrate is a portion of an FR4 copper-clad printed circuit board.

7. The MEM relay of claim 6 , wherein the FR4 copper-clad circuit board has a copper layer approximately 35 μm thick, and a support layer approximately 0.7 mm thick.

8. The MEM relay of claim 1 , wherein the actuator electrode comprises three separate layers.

9. The MEM relay of claim 8 , wherein the three layers include a top layer of approximately 18 μm thick copper sheet; a middle layer of approximately 12 μm thick polyimide; and a bottom layer of approximately 18 μm thick copper, said bottom layer forming the contact bar.

10. The MEM relay of claim 1 , wherein the particular threshold voltage is approximately 240 volts.

Assignees

• Massachusetts Inst Technology

Inventors

• Patil Prashant
• Gershenfeld Neil

Classifications

• B81C2203/051

  Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors · CPC title

• B81C3/004 Primary

  Active alignment, i.e. moving the elements in response to the detected position of the elements using internal or external actuators · CPC title

• H01H59/0009

  making use of micromechanics · CPC title

• B81C1/00166

  Electrodes · CPC title

• B81C2201/0101

  Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning · CPC title