Three-dimensional shaping apparatus

US11577470B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11577470-B2
Application numberUS-202017104050-A
CountryUS
Kind codeB2
Filing dateNov 25, 2020
Priority dateNov 27, 2019
Publication dateFeb 14, 2023
Grant dateFeb 14, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is a three-dimensional shaping apparatus in which surface of a three-dimensional shaped object can be prevented from being roughened. The three-dimensional shaping apparatus that shapes a three-dimensional shaped object by stacking layers of a material includes: a stage; a discharge unit that has a nozzle surface in which a nozzle hole is formed; a moving unit that is configured to change a relative position between the stage and the nozzle surface; and a control unit that is configured to control the moving unit. The control unit drives the moving unit such that a relation between a gap G between the nozzle surface and the stage or the layer of the material when the material is discharged from the discharge unit and an outer diameter Dp of the nozzle surface satisfies a following relation (1). Dp ≤20× G +0.20[mm]  (1)

First claim

Opening claim text (preview).

What is claimed is: 1. A three-dimensional shaping apparatus configured to shape a three-dimensional shaped object by stacking a plurality of layers of a material, the three-dimensional shaping apparatus comprising: a stage; a discharge unit that has a nozzle surface in which a nozzle hole is formed; a moving unit configured to change a relative position between the stage and the nozzle surface; and a control unit configured to control the moving unit, wherein the control unit is configured to drive the moving unit such that a relation between a gap G between the nozzle surface and the stage or a top layer of the plurality of layers of the material when the material is discharged from the discharge unit and an outer diameter Dp of the nozzle surface satisfies a following relation, Dp≤ 20× G+ 0.20mm, the nozzle surface is non-parallel to a top surface of the top layer of the plurality of layers of the material on the stage, an inner diameter Dh of the nozzle hole is 0.20 mm, a line width of each layer of the plurality of layers is 0.30 mm, a relation between the inner diameter Dh of the nozzle hole and the gap G satisfies a following relation, 0<G≤Dh, the gap G satisfies a following relation, 0.05 mm≤G≤0.20 mm, and the outer diameter Dp of the nozzle surface satisfies a following relation, 0.50 mm≤Dp≤2.20 mm.

Assignees

Inventors

Classifications

  • Process efficiency · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • B29C64/118Primary

    using filamentary material being melted, e.g. fused deposition modelling [FDM] · CPC title

  • Heads; Nozzles · CPC title

  • B29C64/393Primary

    for controlling or regulating additive manufacturing processes · CPC title

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What does patent US11577470B2 cover?
Provided is a three-dimensional shaping apparatus in which surface of a three-dimensional shaped object can be prevented from being roughened. The three-dimensional shaping apparatus that shapes a three-dimensional shaped object by stacking layers of a material includes: a stage; a discharge unit that has a nozzle surface in which a nozzle hole is formed; a moving unit that is configured to cha…
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification B29C64/118. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 14 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).