Additive layer manufacturing method and articles

US11577458B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11577458-B2
Application numberUS-201916973150-A
CountryUS
Kind codeB2
Filing dateJun 27, 2019
Priority dateJun 29, 2018
Publication dateFeb 14, 2023
Grant dateFeb 14, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An additive layer manufacturing method, preferably using selective laser sintering, for manufacturing a solid article, the method including applying a layer of a powder, the powder including at least one powdered (co)polymer, onto a solid substrate in a processing chamber; fusing the powder layer onto the solid substrate; subsequently depositing successive layers of the powder, wherein each successive layer is selectively fused prior to deposition of the subsequent layer of powder so as to form the article. In some embodiments, the powder further includes abrasive particles having a hardness greater than or equal to that of aluminum oxide.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for additive layer manufacturing in an additive manufacturing device configured for processing a powder, the method comprising: (i) providing at least one substrate that is not a powder and has a surface adapted for receiving one or more powders to a container of the additive manufacturing device, the container being configured for receiving a powder for processing; (ii) depositing onto at least a part of the substrate, at a predetermined location on the surface of the substrate, at least a first layer of a first powder comprising a first plurality of particles including at least a first (co)polymer having a melting point between 95° C. and 280° C., the surface of the substrate being composed of a material different from the first (co) polymer; (iii) fusing, by applying energy generated by at least one energy source of the additive manufacturing device, and according to selective laser sintering, the deposited first layer of the first (co)polymer onto the predetermined location on the surface of the substrate, thereby forming a first fused (co)polymer layer, and optionally sequentially repeating steps (i)-(iii), wherein at least one of the container configured for receiving the powder, the substrate, or the first layer of the first powder is at a temperature ranging from 10 to 35° C. prior to performance of step (iii). 2. The method of claim 1 , wherein the temperature is a temperature ranging from 15 to 30° C. 3. The method of claim 1 , further comprising; (iv) depositing, at the predetermined location on the surface of the substrate, at least one layer of a second powder comprising a second plurality of particles including at least a second (co)polymer onto at least a part of the first fused (co)polymer layer from step (iii); (v) fusing the second (co)polymer onto at least a part of the first fused (co)polymer layer generated in step (iii) by applying energy generated from at least one energy source of the additive manufacturing device to the predetermined location according to the selective laser sintering, wherein the second powder and the first powder are of a same material; and (vi) sequentially repeating steps (iv) and (v) to create an article. 4. The method of claim 1 , further comprising (iv) depositing at least one layer of a second powder comprising a second plurality of particles including at least a second (co)polymer different from the first (co)polymer onto at least a part of first fused (co)polymer layer formed at step (iii); (v) fusing the second (co)polymer onto the part of the first fused (co)polymer layer generated in step (iii) by applying energy generated from at least one energy source of the additive manufacturing device according to the selective laser sintering; and (vi) sequentially repeating steps (iv) and (v) to create an article. 5. The method of claim 4 , wherein at least one of the first (co)polymer or the second (co)polymer is selected from the group consisting of polyamides, polypropylenes and combinations thereof. 6. The method of claim 4 , wherein at least one of the first powder or the second powder further comprises inorganic particles comprising one or more aluminum oxide, one or more silicon carbide, one or more boron carbide, one or more boron nitride, one or more diamonds and combinations thereof. 7. The method of claim 1 , wherein the energy source comprises a laser configured to scan an emitted laser beam over the deposited layer of first powder at the predetermined location on the surface of substrate. 8. The method of claim 1 , wherein the first layer of the first powder has a thickness that is equal to or approximately equal to an average diameter of a respective powder particle the plurality of powder particles. 9. The method of claim 8 , wherein the thickness of the first layer of the first powder is 300 μm or less. 10. The method of claim 9 , wherein the diameter of the respective powder particle of the first plurality of powder particles ranges from 3 μm to a diameter less than 300 μm. 11. The method of claim 1 , wherein the first (co)polymer is selected from the group consisting of thermoplastic (co)polymers, thermoplastic elastomeric (co)polymers, and cross-linkable (co)polymers. 12. The method of claim 1 , wherein the first (co)polymer is a thermoplastic (co)polymer selected from the group consisting of polyurethanes, fluoropolymers and combinations thereof. 13. The method of claim 1 , wherein the first (co)polymer is a thermoplastic (co)polymer exhibiting an elongation at break of at least 200%. 14. The method of claim 1 , wherein the first (co)polymer is a partially fluorinated thermoplastic fluoropolymer. 15. The method of claim 1 , wherein the first (co)polymer is a thermoplastic or cross-linkable (co)polymer including units derived from TFE and HFP monomers, and at least one comonomer selected from vinyl fluoride (VF), vinylidene fluoride (VDF), ethene (E), propene (P), or a combination thereof. 16. The method of claim 1 , wherein the surface of the substrate comprises a material selected from metals, organic fibers, inorganic fibers, ceramics, and combinations thereof. 17. The method of claim 1 , wherein the surface of the substrate comprises a plurality of alternately raised areas and lowered areas having at least one longest dimension of from about 1/10 up to about 3 times an average diameter of the first plurality of powder particles. 18. The method of claim 17 , wherein the plurality of alternately raised areas comprises a plurality of ridges, and the plurality of lowered areas comprises a plurality of grooves, optionally wherein the first plurality of powder particles includes particles of the first (co)polymer having a diameter of from 3 μm to less than 300 μm. 19. An article produced using the method of claim 1 , optionally wherein the article is an abrasive article.

Assignees

Inventors

Classifications

  • Use of {PA, i.e.} polyamides, e.g. polyesteramides {or derivatives thereof}, as moulding material · CPC title

  • Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material (selective deposition modelling of metallic powder B22F10/00; rapid manufacturing of 3D objects in general and in particular of plastics B29C64/00) · CPC title

  • from polyesters · CPC title

  • Platforms or substrates · CPC title

  • B29C64/245Primary

    Platforms or substrates (support structures intended to be sacrificed after manufacture B29C64/40) · CPC title

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What does patent US11577458B2 cover?
An additive layer manufacturing method, preferably using selective laser sintering, for manufacturing a solid article, the method including applying a layer of a powder, the powder including at least one powdered (co)polymer, onto a solid substrate in a processing chamber; fusing the powder layer onto the solid substrate; subsequently depositing successive layers of the powder, wherein each suc…
Who is the assignee on this patent?
3M Innovative Properties Company
What technology area does this patent fall under?
Primary CPC classification B29C64/245. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 14 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).