Method for manufacturing polyimide-based film and polyimide-based film manufactured thereby

US11577449B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11577449-B2
Application numberUS-201816762376-A
CountryUS
Kind codeB2
Filing dateDec 4, 2018
Priority dateDec 4, 2017
Publication dateFeb 14, 2023
Grant dateFeb 14, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby and, particularly, to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of manufacturing a polyimide-based film in a roll-to-roll manner comprising: conducting first heat treatment (S1) on a polyimide-based film obtained as a gel state formed by being cast on a support while elongating the polyimide-based film at an elongation percentage of more than 100% and less than 135% in a machine direction (MID) and shrinking the polyimide-based film at a shrinkage percentage of more than 75% and less than 100% in a transverse direction (TD); and conducting second heat treatment (S2) on the first heat-treated polyimide-based film while further elongating the polyimide-based film in the machine direction (MD) at a tension not less than 30 N/mm 2 and less than 160 N/mm 2 , wherein a maximum heating temperature during the first heat treatment is 250° C. to 330° C., and the second heat treatment is performed for 200 seconds or longer at a temperature within −10° C. to +30° C. of the maximum heating temperature reached during the first heat treatment. 2. The method according to claim 1 , wherein, in step (S1), the elongation percentage in the machine direction is 105% to 130%. 3. The method according to claim 1 , wherein, in step (S1), the elongation percentage in the machine direction is 115% to 130%. 4. The method according to claim 1 , wherein, in step (S1), the shrinkage percentage in the traverse direction is 80% to 100%. 5. The method according to claim 4 , wherein, in step (S1), the shrinkage percentage in the transverse direction is 80% to 95%. 6. The method according to claim 1 , wherein, in step (S2), the time for second heat treatment is not less than 200 seconds and less than 1,500 seconds. 7. The method according to claim 1 , wherein, in step (S2), the tension is 30 N/mm 2 to 150 N/mm 2 .

Assignees

Inventors

Classifications

  • Organic PV cells · CPC title

  • bi-axially · CPC title

  • Thermal after-treatment {(B29C71/0063 and B29C71/0072 take precedence)} · CPC title

  • Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds · CPC title

  • B29C55/005Primary

    characterised by the choice of materials · CPC title

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What does patent US11577449B2 cover?
The present invention relates to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby and, particularly, to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represent…
Who is the assignee on this patent?
Kolon Inc
What technology area does this patent fall under?
Primary CPC classification B29C55/005. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 14 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).