Electronic component handling apparatus and electronic component testing apparatus

Patent metadata

Field	Value
Publication number	US-11573267-B1
Application number	US-202117454669-A
Country	US
Kind code	B1
Filing date	Nov 12, 2021
Priority date	Nov 12, 2021
Publication date	Feb 7, 2023
Grant date	Feb 7, 2023

Abstract

An electronic component handling apparatus handles a DUT and includes: an acquiring device that acquires current three-dimensional shape data of a DUT container having a plurality of accommodating portions each capable of accommodating the DUT; and a computer device that: calculates a first correction amount from the current three-dimensional shape data and corrects the current three-dimensional shape data based on the first correction amount; extracts, from the corrected three-dimensional shape data, at least one of a height and a slope of each of predetermined regions of the DUT container; and determines an accommodation state of the DUT based on an extraction result. The first correction amount represents at least one of a movement amount and a rotation amount in a planar direction of the current three-dimensional shape data with respect to an initial state of the DUT container set in advance.

First claim

The invention claimed is:

1. An electronic component handling apparatus that handles a device under test (DUT), the electronic component handling apparatus comprising:
an acquiring device that acquires current three-dimensional shape data of a DUT container having a plurality of accommodating portions each capable of accommodating the DUT; and
a computer device that:
calculates a first correction amount from the current three-dimensional shape data and corrects the current three-dimensional shape data based on the first correction amount;
extracts, from the corrected three-dimensional shape data, at least one of a height and a slope of each of predetermined regions of the DUT container, wherein each of the predetermined regions corresponds to the DUT in each of the accommodating portions; and
determines an accommodation state of the DUT based on an extraction result of the at least one of the height and the slope, wherein

the first correction amount represents at least one of a movement amount and a rotation amount in a planar direction of the current three-dimensional shape data with respect to an initial state of the DUT container set in advance.

2. The electronic component handling apparatus according to claim 1 , wherein
the computer device further calculates a second correction amount from the current three-dimensional shape data and corrects a relative positional relationship among the predetermined regions based on the second correction amount, and
the second correction amount is a change amount of a relative positional relationship of each of the accommodating portions with respect to the initial state.

3. The electronic component handling apparatus according to claim 1 , wherein
the DUT container has a plurality of first reference points,
the acquiring device acquires initial three-dimensional shape data of the initial state at room temperature, and
the computer device calculates the first correction amount based on, among the first reference points, first reference points both in the current three-dimensional shape data and the initial three-dimensional shape data.

4. The electronic component handling apparatus according to claim 1 , further comprising:
a holding device that holds the DUT container, wherein
the acquiring device acquires a specific position of a jig held by the holding device or a specific position of the holding device, and
the initial three-dimensional shape data include a coordinate system set based on the specific position.

5. The electronic component handling apparatus according to claim 2 , wherein
the DUT container has a plurality of first reference points, and
the computer device calculates the second correction amount based on the number of the accommodating portions, and among the first reference points, a first reference point of the current three-dimensional shape data.

6. The electronic component handling apparatus according to claim 5 , further comprising:
a holding device that holds the DUT container, wherein
the computer device sets the predetermined regions;
the acquiring device acquires a specific position of a jig held by the holding device or a specific position of the holding device;
the computer device:
corrects a positional relationship among the predetermined regions in design data of the predetermined regions, and
sets the predetermined regions by applying the design data of the corrected predetermined regions to the current three-dimensional shape data based on a coordinate system set from the specific position.

7. The electronic component handling apparatus according to claim 1 , wherein
the DUT container has a plurality of second reference points corresponding to the accommodating portions, and
the computer device sets the predetermined regions with respect to the current three-dimensional shape data based on the second reference points.

8. The electronic component handling apparatus according to claim 1 , wherein
the computer device:
determines that the DUT is not accommodated in each of the accommodating portions when the height of each of the predetermined regions is less than a first threshold,
determines that the DUT is accommodated in each of the accommodating portions when the height of each of the predetermined regions is greater than a second threshold that is greater than the first threshold,
determines that the DUT is tilted in each of the accommodating portions when the incline of each of the predetermined regions is less than a third threshold, or greater than a fourth threshold that is greater than the third threshold, and
determines that the DUT is normally accommodated in each of the accommodating portions when the height of each of the predetermined regions is greater than or equal to the first threshold, less than or equal to the second threshold, and the tilt of each of the predetermined regions is greater than or equal to the third threshold, and less than or less than the fourth threshold.

9. The electronic component handling apparatus of claim 1 , further comprising:
a chamber that applies a thermal stress to the DUT, and
the DUT container is a buffer plate that has a plurality of concave pockets as the accommodating portions and that is disposed or accessible within the chamber.

10. The electronic component testing apparatus that tests a device under test (DUT), comprising:
a test head having a socket to which the DUT is electrically connected;
an electronic component handling apparatus according to claim 1 that moves the DUT to be pressed against the socket; and
a tester electrically connected to the test head.

Assignees

• Advantest Corp

Inventors

• Onozawa Masataka
• Koba Yuki

Classifications

• G01R31/2893 Primary

  Handling, conveying or loading, e.g. belts, boats, vacuum fingers (G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H10P72/00) · CPC title

• G01R31/2891 Primary

  related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05) · CPC title

• G01R31/287

  Procedures; Software aspects · CPC title