Ultrasonic method and device for indirectly measuring cavity pressure of injection molding machine

US11573146B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11573146-B2
Application numberUS-201917256524-A
CountryUS
Kind codeB2
Filing dateSep 19, 2019
Priority dateSep 21, 2018
Publication dateFeb 7, 2023
Grant dateFeb 7, 2023

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Abstract

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The present invention discloses a ultrasonic method for indirectly measuring a pressure of a cavity of an injection molding machine, comprising: emitting ultrasonic wave to each pull rod along an axial direction of the pull rod respectively at the same time, detecting an ultrasonic wave echo time difference of each pull rod, and obtaining an average pressure inside a cavity of the injection molding machine. By the detection method and detection device of the present invention, the pressure inside the cavity may be detected in a certain state, the pressure inside the cavity in the injection molding process may be detected in real time, and the detection process is simple and the accuracy is high.

First claim

Opening claim text (preview).

The invention claimed is: 1. An ultrasonic method for indirectly measuring a pressure of a cavity of an injection molding machine, comprising: emitting ultrasonic wave to each pull rod along an axial direction of the pull rod respectively at the same time, detecting a time difference between an ultrasonic wave echo on each pull rod in an injection molding process and an ultrasonic wave echo when the pull rod is under minimal strain, and obtaining an average pressure P inside the cavity of the injection molding machine according to the following formula: P ⁢ = π ⁢ R 2 · W · Δ ⁢ t total / A wherein R is the section radius of the pull rod; Δt total is the sum of echo time differences of all the pull rods; W is a constant at least partially determined based on one or more Murnaghan constants and one or more Lamé constants of the material of the pull rod; and A is the projection area of the cavity on a plane perpendicular to the axial direction of the pull rod; wherein there are four pull rods; wherein an ultrasonic probe is arranged at the tail end of each pull rod; wherein the W is acquired by the following method: before detection, for the pull rod with the same material, conducting detection by a mold locking force sensor under different mold locking forces to acquire multiple groups of σ−Δt data, and fitting a straight line passing through the origin of σ−Δt data, and evaluating the slope of the straight line to acquire the W, where the σ is a stress on the pull rod as a y-coordinate and the Δt is a time difference of ultrasonic wave echoes, as an x-coordinate. 2. The ultrasonic method for indirectly measuring a pressure of a cavity of an injection molding machine according to claim 1 , wherein the ultrasonic wave is emitted to each pull rod continuously in the injection molding process, and the average pressure in the cavity of the injection molding machine in the injection molding process is displayed in real time. 3. The ultrasonic method for indirectly measuring a pressure of a cavity of an injection molding machine according to claim 1 , wherein a curve of time and average pressure inside the cavity of the injection molding machine is output in real time. 4. The ultrasonic method for indirectly measuring a pressure of a cavity of an injection molding machine according to claim 1 , wherein a recording frequency of an ultrasonic wave echo signal is higher than or equal to 20 Hz.

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What does patent US11573146B2 cover?
The present invention discloses a ultrasonic method for indirectly measuring a pressure of a cavity of an injection molding machine, comprising: emitting ultrasonic wave to each pull rod along an axial direction of the pull rod respectively at the same time, detecting an ultrasonic wave echo time difference of each pull rod, and obtaining an average pressure inside a cavity of the injection mol…
Who is the assignee on this patent?
Univ Zhejiang
What technology area does this patent fall under?
Primary CPC classification G01L11/06. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 07 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).