Camera module and electronic device including the same

Patent metadata

Field	Value
Publication number	US-11570344-B2
Application number	US-202016867109-A
Country	US
Kind code	B2
Filing date	May 5, 2020
Priority date	Sep 27, 2019
Publication date	Jan 31, 2023
Grant date	Jan 31, 2023

Abstract

An electronic device includes a camera module and an external structure. The camera module includes an image sensor and a shielding structure that shields components of the camera module from electromagnetic interference (EMI). The external structure two-dimensionally surrounds the camera module, and a portion of the external structure is conductive. The shielding structure includes an accommodating portion that accommodates the image sensor, and a protruding portion that protrudes from the accommodating portion to contact the external structure.

First claim

What is claimed is:

1. An electronic device comprising:
a camera module that includes an image sensor and a shielding structure configured to shield components of the camera module from electromagnetic interference (EMI); and
an external structure that two-dimensionally surrounds the camera module, at least a portion of the external structure being conductive,
wherein the shielding structure comprises an accommodating portion configured to accommodate the image sensor, and a protruding portion that protrudes from the accommodating portion, and
wherein the protruding portion of the shielding structure directly contacts the external structure.

2. The electronic device of claim 1 , wherein the protruding portion protrudes outward from a side wall of the accommodating portion.

3. The electronic device of claim 1 , wherein the protruding portion is configured to maintain contact with the external structure by elasticity.

4. The electronic device of claim 1 , wherein the external structure forms at least a portion of an external form of the electronic device.

5. The electronic device of claim 4 , wherein the external structure forms at least a portion of a side surface of the electronic device.

6. The electronic device of claim 1 , wherein the external structure is not exposed to the outside of the electronic device.

7. The electronic device of claim 1 , wherein the external structure comprises a conductive body and an insulating coating provided on the conductive body.

8. The electronic device of claim 1 , wherein the shielding structure further comprises an adhesive configured to attach the protruding portion to the accommodating portion.

9. The electronic device of claim 1 , wherein the protruding portion of the shielding structure physically contacts the external structure.

10. An electronic device comprising:
a main circuit board;
an electronic component connected to the main circuit board;
a first camera module connected to the main circuit board;
a device housing including a side wall that surrounds a space in which the main circuit board, the electronic component, and the first camera module are positioned; and
a front panel configured to cover the space in which the main circuit board, the electronic component, and the first camera module are positioned,
wherein at least a portion of the device housing is conductive,
wherein the first camera module comprises a first image sensor, and a first shielding structure that surrounds the first image sensor,
wherein the first shielding structure of the first camera module comprises a first protruding portion that protrudes from the first shielding structure and physically contacts the device housing.

11. The electronic device of claim 10 , wherein the first protruding portion contacts the side wall of the device housing.

12. The electronic device of claim 10 , wherein the device housing further comprises a bottom configured to cover the space in which the main circuit board and the first camera module are positioned.

13. The electronic device of claim 12 , wherein the device housing further comprises an internal wall that is positioned in the space surrounded by the side wall of the device housing and that extends from the bottom of the device housing, and
wherein the first protruding portion contacts the internal wall.

14. The electronic device of claim 10 , wherein the first camera module includes a front camera module that faces the front panel, and
wherein the first protruding portion of the first shielding structure of the front camera module contacts the side wall of the device housing.

15. The electronic device of claim 14 , further comprising a second camera module including a second image sensor and a second shielding structure, the second shielding structure surrounding the second image sensor and including a second protruding portion,
wherein the second camera module includes a rear camera module positioned in the space surrounded by the side wall of the device housing and facing a direction away from the front panel, and
wherein the second protruding portion of the second shielding structure of the rear camera module contacts the first shielding structure of the front camera module.

16. The electronic device of claim 14 , further comprising a second camera module including a second image sensor and a second shielding structure surrounding the second image sensor,
wherein the second camera module includes a rear camera module positioned in the space surrounded by the side wall of the device housing and facing a direction away from the front panel,
wherein the first shielding structure of the front camera module further comprises a second protruding portion that contacts the second shielding structure of the rear camera module.

17. The electronic device of claim 10 , wherein the electronic component is directly connected to the main circuit board, and the first camera module is directly connected to the main circuit board.

18. The electronic device of claim 10 , wherein the first shielding structure includes a plurality of side walls and a top connected to each of the plurality of side walls,
the plurality of side walls are formed on the main circuit board to surround the first image sensor, and
the first protruding portion protrudes from one of the plurality of side walls at a position that is spaced apart from the top and spaced apart from the main circuit board.

19. An electronic device comprising:
a camera module that includes an image sensor and a shielding structure configured to shield components of the camera module from electromagnetic interference (EMI), the shielding structure comprising a plurality of side walls and a top connected to each of the plurality of side walls, the image sensor being accommodated in a space formed by the plurality of side walls and the top; and
an external structure that two-dimensionally surrounds the camera module, at least a portion of the external structure being conductive,
wherein the shielding structure comprises a protruding portion that protrudes from a side wall of the plurality of side walls at a position on the side wall that is spaced away from the top and spaced away from an edge of the side wall opposite from the top,
wherein the protruding portion of the shielding structure contacts the at least portion of the external structure that is conductive.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kwon Kihyun
• Lee Seunghak
• Lim Jihyung

Classifications

• H04N5/2253

  Electricity · mapped topic

• H04N5/2252

  Electricity · mapped topic

• H05K9/0064

  Earth or grounding circuit · CPC title

• G03B17/02

  Bodies · CPC title

• H04N5/2257 Primary

  Electricity · mapped topic