Drive backboard, manufacturing method thereof, display panel and display device

Patent metadata

Field	Value
Publication number	US-11569270-B2
Application number	US-202016824062-A
Country	US
Kind code	B2
Filing date	Mar 19, 2020
Priority date	Nov 21, 2019
Publication date	Jan 31, 2023
Grant date	Jan 31, 2023

Abstract

A drive backboard, a manufacturing method thereof, a display panel and a display device are provided. The drive backboard includes a plurality of pixel units and a plurality of spare electrode groups. Each pixel unit includes m subpixel units, and m is a positive integer greater than or equal to 2. Each spare electrode group includes two first spare electrodes and one second spare electrode; two adjacent i th subpixel units respectively use one first spare electrode in each spare electrode group and share one second spare electrode in each spare electrode group, where i is a positive integer from 1 to m.

First claim

What is claimed is:

1. A drive backboard, comprising:
a plurality of pixel units, wherein each pixel unit includes m subpixel units, m is a positive integer greater than or equal to 2, and each subpixel unit includes a light-emitting element;
a plurality of anode leads;
a plurality of cathode leads;
a plurality of spare pad groups provided in a region between two adjacent anode leads of the plurality of anode leads and two adjacent cathode leads of the plurality of cathode leads;
wherein each one of the plurality of spare pad groups includes two first spare pads and one second spare pad, and only one second spare pad is present between the two first spare pads;
each one of the plurality of spare pad groups is provided between a first main pad group and a second main pad group;
each of the first main pad group and the second main pad group includes a first pad and a second pad;
wherein the first pad of the first main pad group and one of the two first spare pads are each protruded from one of the two adjacent anode leads, the first pad of the second main pad group and the other of the two first spare pads are each protruded from the other one of the two adjacent anode leads, the second pads of the first and second main pad groups and the one second spare pad are each protruded from one of the two adjacent cathode leads;
wherein the one second spare pad protruded from the one of the two adjacent cathode leads is disposed directly between the two first spare pads protruded from the two adjacent anode leads along a direction parallel to the two adjacent cathode leads; and
wherein for each one of the plurality of spare pad groups, one of the following conditions is satisfied based upon detection of a dead subpixel unit:
a) subpixel units of two adjacent pixel units correspond to the first main pad group and the second main pad group, and no light-emitting element is provided corresponding to the spare pad group,
b) subpixel units of two adjacent pixel units correspond to the second main pad group and the spare pad group, and no light-emitting element is provided corresponding to the first main pad group, wherein the light-emitting element of the spare pad group is connected with the one second spare pad and the one of the two first spare pads, and
c) subpixel units of two adjacent pixel units correspond to the first main pad group and the spare pad group, and no light-emitting element is provided corresponding to the second main pad group, wherein the light-emitting element of the spare pad group is connected with the one second spare pad and the other of the two first spare pads.

2. The drive backboard according to claim 1 , wherein each of the two first spare pads is an anode and the one second spare pad is a cathode.

3. The drive backboard according to claim 1 , wherein the light-emitting element is a mini light-emitting diode (Mini LED) chip or a micro light-emitting diode (Micro LED) chip.

4. The drive backboard according to claim 3 , wherein the LEDs of a same color are provided corresponding to the subpixel units of the two adjacent pixel units.

5. The drive backboard according to claim 1 , wherein the m subpixel units of each pixel unit are arranged in a same column.

6. The drive backboard according to claim 1 , wherein the m subpixel units of each pixel unit are arranged in a same row.

7. The drive backboard according to claim 1 , wherein m is 3 or 4.

8. A display panel, comprising the drive backboard according to claim 1 .

9. A display device, comprising the display panel according to claim 8 .

10. The drive backboard according to claim 1 , wherein, for each of the spare pad groups, a number of the first spare pads is greater than a number of the second spare pads.

11. The drive backboard according to claim 10 , wherein, for each of the spare pad groups, the number of the first spare pads is two times of the number of the second spare pads.

12. A method of manufacturing a drive backboard, comprising:
forming a plurality of pixel units, wherein each pixel unit includes m subpixel units, m is a positive integer greater than or equal to 2, and each subpixel unit includes a light-emitting element;
forming a plurality of anode leads;
forming a plurality of cathode leads;
forming a plurality of spare pad groups provided in a region between two adjacent anode leads of the plurality of anode leads and two adjacent cathode leads of the plurality of cathode leads;
wherein each one of the plurality of spare pad groups includes two first spare pads and one second spare pad, and only one second spare pad is present between the two first spare pads;
each one of the plurality of spare pad groups is provided between a first main pad group and a second main pad group;
each of the first main pad group and the second main pad group includes a first pad and a second pad;
wherein the first pad of the first main pad group and one of the two first spare pads are each protruded from one of the two adjacent anode leads, the first pad of the second main pad group and the other of the two first spare pads are each protruded from the other one of the two adjacent anode leads, the second pads of the first and second main pad groups and the one second spare pad are each protruded from one of the two adjacent cathode leads;
wherein the one second spare pad protruded from the one of the two adjacent cathode leads is disposed directly between the two first spare pads protruded from the two adjacent anode leads along a direction parallel to the two adjacent cathode leads; and
wherein for each one of the plurality of spare pad groups, one of the following conditions is satisfied based upon detection of a dead subpixel unit:
a) subpixel units of two adjacent pixel units correspond to the first main pad group and the second main pad group, and no light-emitting element is provided corresponding to the spare pad group,
b) subpixel units of two adjacent pixel units correspond to the second main pad group and the spare pad group, and no light-emitting element is provided corresponding to the first main pad group, wherein the light-emitting element of the spare pad group is connected with the one second spare pad and the one of the two first spare pads, and
c) subpixel units of two adjacent pixel units correspond to the first main pad group and the spare pad group, and no light-emitting element is provided corresponding to the second main pad group, wherein the light-emitting element of the spare pad group is connected with the one second spare pad and the other of the two first spare pads.

13. The manufacturing method according to claim 12 , further comprising:
forming a base substrate;
forming the plurality of anode leads, the first spare pads, and the first pads by performing coating and etching on the base substrate;
forming an insulating layer on the plurality of anode leads; and
forming the plurality of cathode leads, the second spare pads, and the second pads by performing coating and etching on the insulating layer.

14. The manufacturing method according to claim 12 , wherein m is 3 or 4.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Xu Sheng
• Wu Huili
• Zhang Lizhen
• He Wei
• Zhao Xuefei
• Li Shipei
• He Fang
• Yin Dongsheng
• Gu Renquan
• Li Wusheng
• Yao Qi

Classifications

• H01L27/124 Primary

  Electricity · mapped topic

• H01L2933/0066

  Electricity · mapped topic

• H01L33/62

  Electricity · mapped topic

• H01L25/0753

  Electricity · mapped topic

• H10W90/00

  Package configurations · CPC title