Gold sputtering target

Patent metadata

Field	Value
Publication number	US-11569074-B2
Application number	US-201816205471-A
Country	US
Kind code	B2
Filing date	Nov 30, 2018
Priority date	Jun 2, 2016
Publication date	Jan 31, 2023
Grant date	Jan 31, 2023

Abstract

A gold sputtering target is made of gold and inevitable impurities, and has a surface to be sputtered. In the gold sputtering target, an average value of Vickers hardness is 40 or more and 60 or less, and an average crystal grain size is 15 μm or more and 200 μm or less. A {110} plane of gold is preferentially oriented at the surface to be sputtered.

First claim

What is claimed is:

1. A gold sputtering target which is made of gold and inevitable impurities, has a gold purity of 99.99% or more, is plate-shaped or cylindrical and has a surface to be sputtered, wherein
an average value of Vickers hardness is 40 or more and 60 or less,
an average crystal grain size is 15 μm or more and 200 μm or less,
a {110} plane of gold is preferentially oriented at the surface to be sputtered, and wherein the surface to be sputtered is subjected to X-ray diffraction, and an orientation index N of each crystal plane is found from the following expression (1) by using a diffraction intensity ratio of each crystal plane of gold, the orientation index N of the {110} plane of gold is larger than 1, and the largest among the orientation indexes N of all crystal planes,

N
=

(

I
/

I

(
hkl
)

∑

(

I
/

I

(
hkl
)

)

JCPDS
·

I
/

I

(
hkl
)

∑

(

JCPDS
·

I
/

I

(
hkl
)

)

)

(
1
)

wherein I/I (hkl) is the diffraction intensity ratio of an (hkl) plane in the X-ray diffraction, JCPDS·I/I (hkl) is the diffraction intensity ratio of the (hkl) plane at a JCPDS card, Σ(I/I (hkl) ) is a sum of the diffraction intensity ratios of all crystal planes in the X-ray diffraction, and Σ(JCPDS·I/I( hkl ) is a sum of the diffraction intensity ratios of all crystal planes at the JCPDS card.

2. The gold sputtering target according to claim 1 , wherein the Vickers hardness of the gold sputtering target as a whole falls within ±20%.

3. The gold sputtering target according to claim 1 , wherein the average crystal grain size of the gold sputtering target as a whole falls within ±20%.

4. The gold sputtering target according to claim 1 , wherein the gold sputtering target has a plate shape.

5. The gold sputtering target according to claim 1 , wherein the gold sputtering target has a cylindrical shape.

6. The gold sputtering target according to claim 1 , wherein
an average value of the Vickers hardness (HV tav ) of the plate-shaped gold sputtering target is an average value of: an average value of the Vickers hardness (HV av1 ) of the surface to be sputtered; an average value of the Vickers hardness (HV av2 ) on the first cross-section orthogonal to the surface to be sputtered; and an average value of the Vickers hardness (HV av3 ) on a second cross-section perpendicular to the first cross-section, and
an average value of the Vickers hardness (HV tav ) of the cylindrical gold sputtering target is an average value of: an average value of the Vickers hardness (HV av1 ) on an arbitrary first straight line parallel to a cylinder axis of the surface to be sputtered; an average value of the Vickers hardness (HV av2 ) on a second straight line rotated by 90° from the first straight line; and an average value of the Vickers hardness (HV av3 ) of the cross section orthogonal to the cylinder axis.

7. The gold sputtering target according to claim 1 , wherein
an average value of the average crystal grain size (AD tav ) of the plate-shaped gold sputtering target is an average value of: an average value of the average crystal grain size (AD av1 ) on the surface to be sputtered; an average value of the average crystal grain size (AD Av2 ) on a first cross-section orthogonal to the surface to be sputtered; and an average value of the surface to be sputtered; and the average value of the average crystal grain size (AD Av3 ) on a second cross-section at right angle to the surface to be sputtered and the first cross-section, and
the average value of the average crystal grain size (AD tav ) of the cylindrical gold sputtering target is an average value of: the average value of the average crystal grain size (AD av1 ) on an arbitrary first straight line parallel to a cylinder axis on the surface to be sputtered; the average value of the average crystal grain size (AD av2 ) on a second straight line rotated by 90° from the first straight line; and the average value of the average crystal grain size (AD Av3 ) on a cross-section orthogonal to the cylinder axis.

Assignees

• Tanaka Precious Metal Ind

Inventors

• Kato Tetsuya
• Mizuno Yohei
• Ishikura Chiharu

Classifications

• C23C14/3414 Primary

  Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy · CPC title

• C22F1/00

  Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working (apparatus for mechanical working of metal B21, B23, B24) · CPC title

• C22F1/14

  of noble metals or alloys based thereon · CPC title

• H01J37/3426 Primary

  Material · CPC title

• C23C14/34

  Sputtering · CPC title