Pattern formation method, laminate, and method of producing touch panel

Patent metadata

Field	Value
Publication number	US-11567410-B2
Application number	US-202016752080-A
Country	US
Kind code	B2
Filing date	Jan 24, 2020
Priority date	Jul 28, 2017
Publication date	Jan 31, 2023
Grant date	Jan 31, 2023

Abstract

Provided are a pattern formation method including a step of preparing a base material which has an etching layer transparent to an exposure wavelength on each of two surfaces thereof and is transparent to the exposure wavelength, a step of forming a photosensitive resin layer, in which an optical density to the exposure wavelength is in a range of 0.50 to 2.50, on the etching layer on each of the two surfaces of the base material, a step of pattern-exposing the photosensitive resin layer, a step of developing the photosensitive resin layer to form a resist pattern on two surfaces, a step of removing the etching layer on a portion that is not coated with the resist pattern, and a step of peeling the resist pattern off, in this order, a laminate, and a method of producing a touch panel.

First claim

What is claimed is:

1. A pattern formation method comprising:
a step of preparing a base material which has an etching layer transparent to an exposure wavelength on each of two surfaces thereof and is transparent to the exposure wavelength;
a step of forming a photosensitive resin layer, in which an optical density to the exposure wavelength is in a range of 0.50 to 2.50, on the etching layer on each of the two surfaces of the base material;
a step of pattern-exposing the photosensitive resin layer;
a step of developing the photosensitive resin layer to form a resist pattern on each of the two surfaces;
a step of removing the etching layer on a portion that is not coated with the resist pattern; and
a step of peeling the resist pattern off, in this order.

2. The pattern formation method according to claim 1 ,
wherein an exposure amount in the step of exposure is in a range of 10 (n−0.5) mJ/cm 2 to 10 (n+1.5) mJ/cm 2 , and
n represents the optical density of the photosensitive resin layer to the exposure wavelength.

3. The pattern formation method according to claim 2 ,
wherein the exposure amount in the step of exposure is in a range of 10 n mJ/cm 2 to 10 (n+1.0) mJ/cm 2 .

4. The pattern formation method according to claim 1 ,
wherein a film thickness of the photosensitive resin layer is 8.0 μm or less.

5. The pattern formation method according to claim 1 ,
wherein exposure light in the step of exposure has a maximum wavelength at a wavelength of 365 nm.

6. The pattern formation method according to claim 1 ,
wherein the step of forming the photosensitive resin layer is a step of laminating a transfer film, which includes a temporary support and a photosensitive resin layer with an optical density of 0.50 to 2.50 on the temporary support, on the etching layer.

7. The pattern formation method according to claim 6 ,
wherein an optical density of the entire transfer film having been laminated in the step of laminating the transfer film is in a range of 0.50 to 2.50.

8. The pattern formation method according to claim 1 ,
wherein the optical density of the formed photosensitive resin layer in the step of forming the photosensitive resin layer is in a range of 1.00 to 2.00.

9. The pattern formation method according to claim 1 ,
wherein the photosensitive resin layers on the two surfaces of the base material are simultaneously exposed in the step of exposure.

10. The pattern formation method according to claim 1 ,
wherein the etching layer is a conductive layer.

11. The pattern formation method according to claim 1 ,
wherein the photosensitive resin layer contains a polymerizable compound and a polymerization initiator.

12. The pattern formation method according to claim 1 ,
wherein the photosensitive resin layer contains an ultraviolet absorbing material.

13. The pattern formation method according to claim 12 ,
wherein the ultraviolet absorbing material contains carbon black.

14. A method of producing a touch panel, comprising:
the pattern formation method according to claim 1 .

15. A laminate comprising:
a base material which is transparent to an exposure wavelength;
two etching layers which are respectively disposed on two surfaces of the base material and are transparent to the exposure wavelength; and
two photosensitive resin layers which are respectively disposed on the two etching layers and in which an optical density to the exposure wavelength is in a range of 0.50 to 2.50.

Assignees

• Fujifilm Corp

Inventors

• Kanna Shinichi
• Aridomi Takashi

Classifications

• Y10T29/49155

  Manufacturing circuit on or in base · CPC title

• G06F3/041

  Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

• G03F7/09

  characterised by structural details, e.g. supports, auxiliary layers (supports for printing plates in general B41N) · CPC title

• H05K3/0023

  by exposure and development of a photosensitive insulating layer · CPC title

• H05K3/064

  Photoresists · CPC title