Additively manufactured heater

US11565463B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11565463-B2
Application numberUS-202017075327-A
CountryUS
Kind codeB2
Filing dateOct 20, 2020
Priority dateOct 20, 2020
Publication dateJan 31, 2023
Grant dateJan 31, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for forming a heater on a substrate includes feeding a heater wire into a heating zone, the heater wire being in contact with a dielectric material within the heating zone, and coaxially co-extruding the heater wire and the dielectric material from the heating zone through a nozzle and onto a substrate such that the heater wire and the dielectric material form a heater for heating the substrate.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for forming a heater on an air data probe, the method comprising: feeding a heater wire into a heating zone, the heater wire being in contact with a dielectric material within the heating zone; and coaxially co-extruding the heater wire and the dielectric material from the heating zone through a single nozzle and onto a body of the air data probe such that the heater wire and the dielectric material form a heater for heating the body of the air data probe; wherein the heater wire is fully encapsulated by the dielectric material as the heater wire and the dielectric material exit the nozzle; and wherein the heater is additively manufactured onto the body of the air data probe in a single step. 2. The method of claim 1 , further comprising cutting the heater wire at a pre-determined location. 3. The method of claim 1 , further comprising feeding a dielectric material into the heating zone. 4. The method of claim 3 , wherein the dielectric material is a thermoplastic filament. 5. The method of claim 1 , further comprising running the heater wire through a dielectric pool, the dielectric pool containing the dielectric material. 6. The method of claim 1 , wherein the heater has varying watt density. 7. The method of claim 1 , wherein the heater includes cold leads. 8. A system for forming a heater onto an air data probe, the system comprising: a heating zone configured to heat a heater wire and a dielectric material; and a nozzle connected to the heating zone; wherein the heater wire and the dielectric material are coaxially co-extruded from the heating zone through the nozzle and onto a body of the air data probe to form a heater for heating the body of the air data probe, wherein the heater wire is fully encapsulated by the dielectric material as the heater wire and the dielectric material exit the nozzle; and wherein the heater is additively manufactured onto the body of the air data probe in a single step. 9. The system of claim 8 , further comprising a wire-cut mechanism connected to the heating zone, wherein the wire-cut mechanism is configured to cut the heater wire. 10. The system of claim 9 , further comprising a dielectric pool positioned between the wire-cut mechanism and the heating zone. 11. The system of claim 8 , wherein a first channel extends through the heating zone, the heater wire extending through the heating zone within the first channel and a second channel extends through the heating zone, a dielectric material entering the heating zone within the second channel. 12. The system of claim 11 , wherein the dielectric material is a thermoplastic filament. 13. The system of claim 8 , wherein the heater has varying watt density. 14. The system of claim 8 , wherein the heater includes cold leads.

Assignees

Inventors

Classifications

  • B29C64/118Primary

    using filamentary material being melted, e.g. fused deposition modelling [FDM] · CPC title

  • Manufacturing methods or apparatus for heaters · CPC title

  • Products made by additive manufacturing · CPC title

  • Processes of additive manufacturing · CPC title

  • Heaters using particular connecting means · CPC title

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Frequently asked questions

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What does patent US11565463B2 cover?
A method for forming a heater on a substrate includes feeding a heater wire into a heating zone, the heater wire being in contact with a dielectric material within the heating zone, and coaxially co-extruding the heater wire and the dielectric material from the heating zone through a nozzle and onto a substrate such that the heater wire and the dielectric material form a heater for heating the …
Who is the assignee on this patent?
Rosemount Aerospace Inc
What technology area does this patent fall under?
Primary CPC classification B29C64/118. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 31 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).