Metal member manufacturing method

US11565301B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11565301-B2
Application numberUS-202117140178-A
CountryUS
Kind codeB2
Filing dateJan 4, 2021
Priority dateMar 5, 2020
Publication dateJan 31, 2023
Grant dateJan 31, 2023

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A metal member manufacturing method according to one form of this disclosure is a method of manufacturing a metal member that is thinner at some portions than at other portions. The method includes a formation step of pressing one surface of surfaces of a metal workpiece that are perpendicular to a thickness direction with a press-working die so as to form a raised portion in the other surface, and a cutting step of moving a cutting blade along the other surface to cut off the raised portion by shaving. In the formation step, the raised portion is formed such that the area of a cross-section of the raised portion that is parallel to a moving direction of the cutting blade and perpendicular to the other surface decreases toward an end of the raised portion on a rear side in the moving direction of the cutting blade.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a metal member that is thinner at some portions than at other portions, the method comprising: a formation step of pressing one surface of surfaces of a metal workpiece that are perpendicular to a thickness direction with a press-working die so as to form a raised portion having a first raised portion and a second raised portion in the other surface; and a cutting step of moving a cutting blade along the other surface to cut off the raised portion by shaving, wherein the first raised portion is thicker than the second raised portion and the second raised portion is arranged before the first raised portion in the moving direction of the cutting blade so that the cutting blade initially comes into contact with the second raised portion during the cutting step. 2. The metal member manufacturing method according to claim 1 , wherein in the formation step, the second raised portion is formed to decrease in thickness stepwise from the first raised portion. 3. The metal member manufacturing method according to claim 1 , wherein in the formation step, the second raised portion is formed to decrease in thickness along a curve from the first raised portion.

Assignees

Inventors

Classifications

  • B21D28/26Primary

    in sheets or flat parts · CPC title

  • Blanks having varying thickness, e.g. tailored blanks · CPC title

  • B21D22/04Primary

    for dimpling (combined with perforating B21D28/24) · CPC title

  • Making other articles · CPC title

  • Making specific metal objects by operations not covered by a single other subclass or a group in this subclass · CPC title

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Frequently asked questions

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What does patent US11565301B2 cover?
A metal member manufacturing method according to one form of this disclosure is a method of manufacturing a metal member that is thinner at some portions than at other portions. The method includes a formation step of pressing one surface of surfaces of a metal workpiece that are perpendicular to a thickness direction with a press-working die so as to form a raised portion in the other surface,…
Who is the assignee on this patent?
Toyota Motor Co Ltd
What technology area does this patent fall under?
Primary CPC classification B21D28/26. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 31 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).