Cartridge with laminated manifold

US11565252B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11565252-B2
Application numberUS-201916706332-A
CountryUS
Kind codeB2
Filing dateDec 6, 2019
Priority dateFeb 3, 2018
Publication dateJan 31, 2023
Grant dateJan 31, 2023

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  1. Title

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  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A circuit with electrical interconnect for external electronic connection and sensor(s) on a die are combined with a laminated manifold to deliver a liquid reagent over an active surface of the sensor(s). The laminated manifold includes fluidic channel(s), an interface between the die and the fluidic channel(s) being sealed. Also disclosed is a method, the method including assembling a laminated manifold including fluidic channel(s), attaching sensor(s) on a die to a circuit, the circuit including an electrical interconnect, and attaching a planarization layer to the circuit, the planarization layer including a cut out for the die. The method further includes placing sealing adhesive at sides of the die, attaching the laminated manifold to the circuit, and sealing an interface between the die and fluidic channel(s).

First claim

Opening claim text (preview).

The invention claimed is: 1. An apparatus, comprising: a circuit and at least one sensor on a die attached to the circuit, the circuit comprising an electrical interconnect for external electrical connection; a flow cell positioned over an active surface of the at least one sensor; a manifold to deliver a reagent to the flow cell; and a sealed interface between the die and flow cell. 2. The apparatus of claim 1 , wherein the at least one sensor comprises a semiconductor. 3. The apparatus of claim 2 , wherein the at least one sensor comprises a Complementary Metal-Oxide Semiconductor (CMOS) sensor. 4. The apparatus of claim 1 , wherein the interface between the die and flow cell comprises at least one of a bridge adhesive or a structural adhesive. 5. The apparatus of claim 1 , wherein a pressure sensitive adhesive attaches the die to the circuit. 6. The apparatus of claim 1 , further comprising a reagent reservoir. 7. The apparatus of claim 1 , wherein the manifold comprises an inlet fluidic opening and an outlet fluidic opening. 8. The apparatus of claim 1 , wherein the manifold is a laminated manifold. 9. The apparatus of claim 1 , further comprising a reagent pump. 10. The apparatus of claim 1 , wherein the die comprises a portion of a silicon wafer. 11. The apparatus of claim 1 , wherein the flow cell comprises a silicate glass. 12. The apparatus of claim 1 , wherein a wire bonds the die to the circuit.

Assignees

Inventors

Classifications

  • Reagents, handling or storing thereof · CPC title

  • Sealing · CPC title

  • Sequential or parallel reactions, e.g. for the synthesis of polypeptides or polynucleotides; Apparatus and devices for combinatorial chemistry or for making molecular arrays (synthesis methods per se C40B50/00) · CPC title

  • characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces · CPC title

  • Laminated structure · CPC title

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Frequently asked questions

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What does patent US11565252B2 cover?
A circuit with electrical interconnect for external electronic connection and sensor(s) on a die are combined with a laminated manifold to deliver a liquid reagent over an active surface of the sensor(s). The laminated manifold includes fluidic channel(s), an interface between the die and the fluidic channel(s) being sealed. Also disclosed is a method, the method including assembling a laminate…
Who is the assignee on this patent?
Illumina Inc
What technology area does this patent fall under?
Primary CPC classification B01L3/502715. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 31 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).