Systems and methods for an enclosure that provides EMI shielding and heat sinking to an electronic assembly of a vehicle

Patent metadata

Field	Value
Publication number	US-11564340-B2
Application number	US-202016951623-A
Country	US
Kind code	B2
Filing date	Nov 18, 2020
Priority date	Nov 18, 2020
Publication date	Jan 24, 2023
Grant date	Jan 24, 2023

Abstract

Example embodiments described in this disclosure are generally directed to a plastic enclosure that provides EMI shielding and heat sinking to an electronic assembly. In one embodiment, the enclosure includes a housing portion formed of a base material that includes a polymer containing graphene nanostructures and carbon nanostructures. The graphene nanostructures provide a thermal conductivity characteristic to the base material. A set of standoff elements made of the base material is provided inside the housing for mounting the electronic assembly. Heat generated by the electronic assembly is conducted out of the enclosure by the standoff elements due to the graphene nanostructures. The carbon nanostructures provide an electrical conductivity characteristic to the base material. A lid formed of the base material may be attached to the housing portion. The carbon nanostructures in the housing portion and the lid provide EMI shielding to the electronic assembly inside the enclosure.

First claim

That which is claimed is:

1. An enclosure for an electronic assembly of a vehicle, the enclosure comprising:
a housing portion formed of a base material that is overlaid with a sheathing material, the base material comprising a first polymer that includes a first quantity of graphene nanostructures and a first quantity of carbon nano structures, the first quantity of graphene nanostructures providing a first thermal conductivity characteristic to the base material, the first quantity of carbon nanostructures providing a first electrical conductivity characteristic to the base material, the sheathing material comprising a second polymer that provides a waterproofing characteristic to the sheathing material; and
a lid that is attachable to the housing portion, the lid formed of the base material overlaid with the sheathing material.

2. The enclosure of claim 1 , further comprising:
a seal located upon an entirety of a rim of the housing portion, the seal comprising one of a third polymer or a braided metal gasket having a compressible characteristic that provides a watertight seal between the housing portion and the lid.

3. The enclosure of claim 1 , wherein the first polymer comprises polyethylene terephthalate (PET).

4. The enclosure of claim 3 , wherein the first quantity of graphene nanostructures ranges from about 0.5% to about 4% of the first polymer, and wherein the first quantity of carbon nanostructures ranges from about 1% to about 20% of the first polymer.

5. The enclosure of claim 1 , further comprising:
a standoff element formed of the base material as an integrally molded part of the housing portion.

6. The enclosure of claim 5 , further comprising:
a printed circuit board assembly (PCBA) mounted inside the housing portion of the enclosure, the PCBA having a metal plane that is in contact with the standoff element in a ground path arrangement.

7. An enclosure for an electronic module, the enclosure comprising:
a housing portion formed of a base material comprising a first polymer that includes a first quantity of carbon and a first quantity of graphite, the first quantity of carbon providing a first electrical conductivity characteristic to the base material, the first quantity of graphite providing a first thermal conductivity characteristic to the base material;
a lid that is attachable to the housing portion, the lid formed of the base material;
a sheathing material overlaid on the base material, the sheathing material comprising a second polymer that provides a waterproofing characteristic to the sheathing material,
wherein the first polymer is a polyethylene terephthalate (PET) compound, wherein the first quantity of graphite comprises at least one of a first quantity of graphene nano structures or a first quantity of exfoliated graphite, and wherein the first quantity of carbon comprises a first quantity of carbon nano structures.

8. The enclosure of claim 7 , wherein the first quantity of carbon nano structures ranges from about 0.5% to about 4% of the first polymer, and wherein the at least one of the first quantity of graphene nano structures or the first quantity of exfoliated graphite ranges from about 1% to about 20% of the first polymer.

9. The enclosure of claim 7 , further comprising:
a standoff element formed of the base material as an integrally molded part of the housing portion.

10. The enclosure of claim 9 , further comprising:
a printed circuit board assembly (PCBA) mounted inside the housing portion of the enclosure, the PCBA having a metal plane that is in contact with the standoff element in a ground path arrangement.

11. The enclosure of claim 7 , further comprising:
a seal located upon an entirety of a rim of the housing portion, the seal comprising one of a third polymer or a braided metal gasket having a compressible characteristic that provides a watertight seal between the housing portion and the lid.

Assignees

• Ford Global Tech Llc

Inventors

• Salter Stuart
• Dellock Paul Kenneth
• Hermann Thomas
• Winkel Tye

Classifications

• H05K5/0052

  characterized by joining features of the housing parts · CPC title

• H05K7/20854

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence) · CPC title

• H02G3/088

  Dustproof, splashproof, drip-proof, waterproof, or flameproof casings or inlets · CPC title

• B60R16/02

  electric {constitutive elements} · CPC title

• H05K9/0045 Primary

  being rigid plastic containers having a coating of shielding material · CPC title