Light emitting device and production method and use thereof

Patent metadata

Field	Value
Publication number	US-11563140-B2
Application number	US-202017084223-A
Country	US
Kind code	B2
Filing date	Oct 29, 2020
Priority date	May 2, 2018
Publication date	Jan 24, 2023
Grant date	Jan 24, 2023

Abstract

A method for producing a light omitting device includes providing a substrate and forming an epitaxial structure thereon, forming first and second electrodes on a side of the epitaxial structure facing away from the substrate, and removing the substrate. The epitaxial structure includes a first-type semiconductor layer, an active layer, a second-type semiconductor layer, and an AlGaAs-based semiconductor layer formed on the substrate in a distal-to-proximal manner. The AlGaAs-based semiconductor layer has a thickness of not less than 30 μm, and is configured to support the rest of the epitaxial structure and serve as a light exiting layer. The device produced by the method is also disclosed.

First claim

What is claimed is:

1. A method for producing a light emitting device, comprising:
providing a growth substrate;
forming an epitaxial structure on the growth substrate, the epitaxial structure including a first-type semiconductor layer, an active layer, a second-type semiconductor layer, and an aluminum gallium arsenide (AlGaAs)-based semiconductor layer, the AlGaAs-based semiconductor layer being formed on the growth substrate and having a thickness of not less than 30 μm, the second-type semiconductor layer being formed on the AlGaAs-based semiconductor layer opposite to the growth substrate, the second-type semiconductor layer having a second-type cladding sublayer and a second-type window sublayer that are distal and proximal to the AlGaAs-based semiconductor layer, respectively, the second-type window sublayer being made from a material selected from the group consisting of AlGaAs, AlGaInP, and a combination thereof, the active layer being made from aluminum gallium indium phosphide (AlGaInP) and formed on the second-type semiconductor layer opposite to the AlGaAs-based semiconductor layer, the first-type semiconductor layer being formed on the active layer opposite to the second-type semiconductor layer;
forming a first electrode on an electrode placement side of the epitaxial structure facing away from the growth substrate, so that the first electrode is electrically connected with the first-type semiconductor layer;
forming a second electrode on the electrode placement side of the epitaxial structure, so that the second electrode is electrically connected with the second-type semiconductor layer, the second electrode being in ohmic contact with the second-type window sublayer; and
removing the growth substrate, so that the AlGaAs-based semiconductor layer is configured to support thereon the second-type semiconductor layer, the active layer, and the first-type semiconductor layer, and to have light emitted from the epitaxial structure exiting therefrom.

2. The method as claimed in claim 1 , wherein the AlGaAs-based semiconductor layer is formed through liquid phase epitaxy, and the second-type semiconductor layer, the active layer, and the first-type semiconductor layer are formed through metal organic chemical vapor deposition.

3. The method as claimed in claim 1 , wherein the AlGaAs-based semiconductor layer has a content of aluminum which ranges from 20 mol % to 95 mol % based on a total molar content of AlGaAs.

4. The method as claimed in claim 1 , wherein the AlGaAs-based semiconductor layer has a thickness ranging from 30 μm to 300 μm.

5. The method as claimed in claim 1 , wherein the second electrode is formed on the second-type window sublayer, a heat treatment being conducted to diffuse metallic atoms of the second electrode into the second-type window sublayer, so that the second electrode is in ohmic contact with the second-type window sublayer.

6. The method as claimed in claim 5 , wherein the second electrode is in one of a single-layered form and a multi-layered form, a contact portion of the second electrode in contact with the second-type window sublayer is made from one of gold (Au) and an Au-containing alloy.

7. The method as claimed in claim 1 , wherein the first-type semiconductor layer has a first-type cladding sublayer.

8. The method as claimed in claim 1 , wherein the second electrode is formed by partially etching the first-type semiconductor layer, the active layer, and the second-type semiconductor layer to partially expose the second-type semiconductor layer, the second electrode being formed on the second-type semiconductor layer.

9. The method as claimed in claim 1 , wherein the AlGaAs-based semiconductor layer is configured to support the growth substrate during removal of the growth substrate.

10. A light emitting device comprising:
an epitaxial structure including a first-type semiconductor layer, an active layer, a second-type semiconductor layer, and an aluminum gallium arsenide (AlGaAs)-based semiconductor layer, said AlGaAs-based semiconductor layer having a thickness of not less than 30 μm, said second-type semiconductor layer being disposed on said AlGaAs-based semiconductor layer and having a second-type cladding sublayer and a second-type window sublayer that are distal and proximal to said AlGaAs-based semiconductor layer, respectively, said second-type window sublayer being made from a material selected from the group consisting of AlGaAs, AlGaInP, and a combination thereof, said active layer being made from aluminum gallium indium phosphide (AlGaInP) and disposed on said second-type semiconductor layer opposite to said AlGaAs-based semiconductor layer, said first-type semiconductor layer being disposed on said active layer opposite to said second-type semiconductor layer, said AlGaAs-based semiconductor layer being configured to support thereon said second-type semiconductor layer, said active layer, and said first-type semiconductor layer, and to have light emitted from said epitaxial structure exiting therefrom;
a first electrode disposed on an electrode placement side of said epitaxial structure opposite to said AlGaAs-based semiconductor layer, so that said first electrode is electrically connected with said first-type semiconductor layer; and
a second electrode disposed on said electrode placement side of said epitaxial structure, so that said second electrode is electrically connected with said second-type semiconductor layer, said second electrode being in ohmic contact with said second-type window sublayer.

11. The light emitting device as claimed in claim 10 , wherein said AlGaAs-based semiconductor layer has a thickness ranging from 30 μm to 300 μm.

12. The light emitting device as claimed in claim 10 , wherein said AlGaAs-based semiconductor layer has a content of aluminum which ranges from 20 mol % to 95 mol % based on a total molar content of AlGaAs.

13. The light emitting device as claimed in claim 10 , wherein said first-type semiconductor layer is made from a material selected from the group consisting of AlGaAs, AlGalnP, aluminum indium phosphide (AllnP), gallium phosphide (GaP), and combinations thereof.

14. The light emitting device as claimed in claim 10 , wherein said second-type semiconductor layer is made from a material selected from the group consisting of AlGaAs, AlGalnP, AllnP, GaP, and combinations thereof.

15. The light emitting device as claimed in claim 10 , wherein said second electrode is in one of a single-layered form and a multi-layered form, a contact portion of said second electrode in contact with said second-type window sublayer being made from one of gold (Au) and an Au-containing alloy.

16. The light emitting device as claimed in claim 15 , wherein said contact portion of said second electrode has a thickness ranging from 5 nm to 20 nm.

17. The light emitting device as claimed in claim 10 , further comprising a first metallic layer that is disposed over and in contact with said first electrode, and a second metallic layer that is disposed over and in contact with said second electrode, said first and second metallic layers being larger in surface area than said first and second electrodes, respectively.

18. The light emitting device as claimed in claim 17 , wherein said first and second metallic layers are reflective layers.

19. A light emitting apparatus comprising at least one light emitting device as claimed in claim 10 .

20. The light emitting apparatus as claimed in claim 19 , wherein said aluminum gallium arsenide (AlGaAs)-based

Assignees

• Tianjin Sanan Optoelectronics Co Ltd
• Tiajin Sanan Optoelectornics Co Ltd

Inventors

• Tsai Chingyuan
• Wu Chun-Yi
• Li Fulong
• Wang Duxiang
• Wu Chaoyu
• Gao Wenhao
• Liu Xiaofeng
• Li Weihuan
• Shu Liming
• Liu Chao

Classifications

• H01L33/30

  Electricity · mapped topic

• H01L33/0093

  Electricity · mapped topic

• H01L2933/0016

  Electricity · mapped topic

• H01L33/0062 Primary

  Electricity · mapped topic

• H01L33/405

  Electricity · mapped topic