Nano-twinned copper layer with doped metal element, substrate comprising the same and method for preparing the same

Patent metadata

Field	Value
Publication number	US-11560639-B2
Application number	US-202117321717-A
Country	US
Kind code	B2
Filing date	May 17, 2021
Priority date	Mar 5, 2021
Publication date	Jan 24, 2023
Grant date	Jan 24, 2023

Abstract

A nano-twinned copper layer with a doped metal element is disclosed, wherein the nano-twinned copper is doped with at least one metal element selected from the group consisting of Ag, Ni, Al, Au, Pt, Mg, Ti, Zn, Pd, Mn and Cd in a region from a surface of the nano-twinned copper layer to a depth being 0.3 μm, and a content of the metal element in the region is ranged from 0.5 at % to 20 at %. In addition, at least 50% in volume of the nano-twinned copper layer includes plural twinned grains. Furthermore, a substrate including the aforesaid nano-twinned copper layer and a method for preparing the aforesaid nano-twinned copper layer are also disclosed.

First claim

What is claimed is:

1. A nano-twinned copper layer with a doped metal element, wherein the nano-twinned copper is doped with at least one metal element selected from the group consisting of Ag, Ni, Al, Au, Pt, Mg, Ti, Zn, Pd, Mn and Cd in a region from a surface of the nano-twinned copper layer to a depth being 0.3 μm, and a content of the metal element in the region is ranged from 0.5 at % to 20 at %; wherein at least 50% in volume of the nano-twinned copper layer comprises plural twinned grains, and a concentration of the metal element gradually decreases from the surface to the depth of 0.3 μm in the region.

2. The nano-twinned copper layer of claim 1 , wherein the metal element is Ag, Ni, Al, Pt, or Zn.

3. The nano-twinned copper layer of claim 1 , wherein at least 50% of an area of the surface of the nano-twinned copper layer expose a (111) surface of the plural twinned grains.

4. The nano-twinned copper layer of claim 1 , wherein a thickness of the nano-twinned copper layer is ranged from 0.1 μm to 500 μm.

5. The nano-twinned copper layer of claim 1 , wherein diameters of the plural twinned grains are respectively ranged from 0.1 μm to 50 μm.

6. The nano-twinned copper layer of claim 1 , wherein thicknesses of the plural twinned grains are respectively ranged from 0.1 μm to 500 μm.

7. The nano-twinned copper layer of claim 1 , wherein a metal film is further formed on the surface of the nano-twinned copper layer, and the metal film comprises the metal element.

8. The nano-twinned copper layer of claim 7 , wherein the metal film comprises Ag, Ni, Al, Pt, or Zn.

9. The nano-twinned copper layer of claim 1 , wherein the plural twinned grains are connected with each other, and each of the plural twinned grains are formed by stacking plural nano-twinned grains along a [111] crystal axis.

10. A substrate having a nano-twinned copper layer, comprising:
a substrate; and
a nano-twinned copper layer with a doped metal element disposed on the substrate or embedded into the substrate, wherein the nano-twinned copper is doped with at least one metal element selected from the group consisting of Ag, Ni, Al, Au, Pt, Mg, Ti, Zn, Pd, Mn and Cd in a region from a surface of the nano-twinned copper layer to a depth being 0.3 μm, and a content of the metal element in the region is ranged from 0.5 at % to 20 at %; wherein at least 50% in volume of the nano-twinned copper layer comprises plural twinned grains, and a concentration of the metal element gradually decreases from the surface to the depth of 0.3 μm in the region.

11. A method for preparing a nano-twinned copper layer with a doped metal element, comprising the following steps:
providing a nano-twinned copper layer, wherein 50% or more in volume of the nano-twinned copper layer comprises plural twinned grains;
forming a metal film on a surface of the nano-twinned copper layer, wherein the metal film comprises at least one metal element selected from the group consisting of Ag, Ni, Al, Au, Pt, Mg, Ti, Zn, Pd, Mn and Cd; and
annealing the nano-twinned copper layer provided with the metal film at 50° C. to 250° C. to form a nano-twinned copper layer with a doped metal element, wherein the nano-twinned copper layer is doped with the metal element in a region from a surface of the nano-twinned copper layer to a depth being 0.3 μm, and a content of the metal element in the region is ranged from 0.5 at % to 20 at %.

12. The method of claim 11 , wherein the metal element is Ag, Ni, Al, Pt, or Zn.

13. The method of claim 11 , wherein at least 50% of an area of the surface of the nano-twinned copper layer expose a (111) surface of the plural twinned grains.

14. The method of claim 11 , wherein a thickness of the nano-twinned copper layer is ranged from 0.1 μm to 500 μm.

15. The method of claim 11 , wherein diameters of the plural twinned grains are respectively ranged from 0.1 μm to 50 μm.

16. The method of claim 11 , wherein thicknesses of the plural twinned grains are respectively ranged from 0.1 μm to 500 μm.

17. The method of claim 11 , wherein the metal film is formed on the nano-twinned copper layer by vapor-deposition or sputtering.

18. The method of claim 11 , wherein a thickness of the metal film is ranged from 50 nm to 500 nm.

19. The method of claim 11 , wherein a concentration of the metal element gradually decreases from the surface to the depth of 0.3 μm in the region from the surface of the nano-twinned copper layer to the depth being 0.3 μm.

Assignees

• National Yang Ming Chiao Tung Univ

Inventors

• Chen Chih
• Lee Kang-Ping

Classifications

• C25D7/12

  Semiconductors · CPC title

• C25D3/38 Primary

  of copper · CPC title

• C25D3/46

  of silver · CPC title

• C23C28/028

  Including graded layers in composition or in physical properties, e.g. density, porosity, grain size · CPC title

• C25D5/617 Primary

  Crystalline layers · CPC title