Information carrying card comprising a cross-linked polymer composition, and method of making the same

Patent metadata

Field	Value
Publication number	US-11560474-B2
Application number	US-201916444656-A
Country	US
Kind code	B2
Filing date	Jun 18, 2019
Priority date	Apr 3, 2012
Publication date	Jan 24, 2023
Grant date	Jan 24, 2023

Abstract

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. An information carrying card includes a body defining a first cavity and a second cavity. The first cavity has a first area and the second cavity has a second area. The first cavity is continuous with the second cavity and the second area is less than the first area. A circuit element is disposed within the first cavity.

First claim

What is claimed is:

1. A method of forming a credential card, comprising:
positioning a first thermoplastic layer in a stacked arrangement with a first release sheet;
applying a cross-linkable polymer composition to the first thermoplastic layer;
positioning an inlay layer in a stacked arrangement with the first thermoplastic layer and the first release sheet, wherein the inlay layer is in direct contact with the first thermoplastic layer and the cross-linkable polymer composition, and wherein the inlay layer defines at least one cavity;
positioning a first circuit element within the at least one cavity defined by the inlay layer, wherein the first circuit element comprises a printed circuit board having at least one electronic component formed on a supporting film and an antenna;
positioning a second release sheet in a stacked arrangement with the first thermoplastic layer, first release sheet, and inlay layer to form a layered structure;
applying a predetermined pressure to the layered structure; and
heating the layered structure to a temperature sufficient to at least partially cure the cross-linkable polymer composition to form a credential core.

2. The method of claim 1 , wherein the inlay layer comprises metal.

3. The method of claim 1 , comprising:
positioning a second thermoplastic layer on a first side of the credential core;
positioning a third thermoplastic layer on a second side of the credential core, wherein the second thermoplastic layer, the credential core, and the third thermoplastic layer form a card stack;
laminating the card stack under a predetermined pressure at a predetermined temperature to form a credential card.

4. The method of claim 3 , wherein at least one of the second thermoplastic layer and the third thermoplastic layer comprises a printable thermoplastic layer, a transparent thermoplastic layer, or both a printable and transparent thermoplastic layer.

5. The method of claim 1 , wherein the first thermoplastic layer comprises a polyvinyl chloride (PVC) material.

6. A credential card core, comprising:
a first thermoplastic layer;
a cross-linkable polymer composition disposed on at least a portion of the first thermoplastic layer;
an inlay layer positioned in a stacked arrangement with the first thermoplastic layer, wherein the inlay layer is in direct contact with the first thermoplastic layer and the cross-linkable polymer composition, and wherein the inlay layer defines at least one cavity; and
a first circuit element positioned within the at least one cavity defined by the inlay layer, wherein the first circuit element comprises a printed circuit board having at least one electronic component formed on a supporting film and an antenna.

7. The credential card of claim 6 , wherein the inlay layer comprises metal.

8. The credential card of claim 6 , comprising:
a second thermoplastic layer on a first side of the credential core;
a third thermoplastic layer on a second side of the credential core, wherein the second thermoplastic layer, the credential core, and the third thermoplastic layer form a card stack, and wherein the card stack is laminated under a predetermined pressure at a predetermined temperature to form a credential card.

9. The credential card of claim 8 , wherein at least one of the second thermoplastic layer and the third thermoplastic layer comprises a printable thermoplastic layer, a transparent thermoplastic layer, or both a printable and transparent thermoplastic layer.

10. The credential card of claim 6 , wherein the first thermoplastic layer comprises a polyvinyl chloride (PVC) material.

11. A method of forming a credential card, comprising:
positioning a first thermoplastic layer in a stacked arrangement with a first release sheet;
applying a cross-linkable polymer composition to the first thermoplastic layer;
positioning an inlay layer in a stacked arrangement with the first thermoplastic layer and the first release sheet, wherein the inlay layer is in direct contact with the first thermoplastic layer and the cross-linkable polymer composition, and wherein the inlay layer defines at least one cavity;
positioning a first circuit element within the at least one cavity defined by the inlay layer, wherein the first circuit element comprises a printed circuit board having at least one electronic component formed on a supporting film and an antenna;
positioning a second release sheet in a stacked arrangement with the first thermoplastic layer, first release sheet, and inlay layer to form a layered structure;
applying a predetermined pressure to the layered structure;
heating the layered structure to a temperature sufficient to at least partially cure the cross-linkable polymer composition to form a credential core; and
laminating, subsequent to heating the layered structure, a card stack under a predetermined pressure at a predetermined temperature to form a credential card, wherein the card stack comprises the credential core and at least one additional thermoplastic layer.

12. The method of claim 11 , wherein the inlay layer comprises metal.

13. The method of claim 11 , wherein the at least one additional thermoplastic layer of the card stack comprises a printable thermoplastic layer, a transparent thermoplastic layer, or both a printable and transparent thermoplastic layer.

14. The method of claim 11 , wherein the first thermoplastic layer comprises a polyvinyl chloride (PVC) material.

Assignees

• X Card Holdings Llc

Inventors

• Cox Mark A

Classifications

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• G06K19/07745 Primary

  Mounting details of integrated circuit chips · CPC title

• B32B3/18

  characterised by an internal layer formed of separate pieces of material {which are juxtaposed side-by-side (B32B5/02 takes precedence)} · CPC title

• B32B2457/00

  Electrical equipment · CPC title

• C08L2203/206

  use in coating or encapsulating of electronic parts · CPC title