Method for manufacturing a wound dressing and a wound dressing

Patent metadata

Field	Value
Publication number	US-11559441-B2
Application number	US-201816495232-A
Country	US
Kind code	B2
Filing date	Mar 21, 2018
Priority date	Mar 22, 2017
Publication date	Jan 24, 2023
Grant date	Jan 24, 2023

Abstract

A method for manufacturing a wound dressing having a substrate, and a wound dressing manufactured by such a method are described. The method has a step of providing a sacrificial layer of material to be perforated by means of a hot pin perforator, in order to remove any molten residues on the heated pins of the hot pin perforator, before the same pins are used to make holes in the substrate. The presented method is cost effective, robust and reduces the risk of contaminating substances being embedded in the substrate during the hole making process.

First claim

The invention claimed is:

1. A method for manufacturing a wound dressing having a substrate, said method comprising:
providing a hot pin perforator having an array of heated pins;
providing a sacrificial layer of material adapted to be perforated by the heated pins;
perforating the sacrificial layer with said heated pins; and
making holes in the substrate with the heated pins of said hot pin perforator,
wherein the sacrificial layer does not form a part of the wound dressing during manufacturing,
wherein the substrate comprises an absorbent material.

2. The method according to claim 1 , wherein said hot pin perforator is arranged so that the heated pins perforate the sacrificial layer before reaching a proximal surface of the substrate in order to remove residues on the heated pins before they are brought in contact with the substrate.

3. The method according to claim 1 , wherein the step of providing a sacrificial layer of material comprises positioning the sacrificial layer of material between said hot pin perforator and the substrate.

4. The method according to claim 1 , further comprising:
applying an adhesive layer onto a perforated surface of the substrate.

5. The method according to claim 1 , further comprising applying a backing layer onto a distal surface of the substrate, wherein the backing layer comprises a liquid impervious material.

6. The method according to claim 1 , wherein the sacrificial layer comprises a material selected from the group consisting of a plastic film, a thin paper material, and a nonwoven material.

7. The method according to claim 1 , wherein the heated pins have a temperature at or above the melting point temperature of the substrate.

8. The method according to claim 1 , wherein the step of making holes in the substrate, comprises making through holes in the substrate.

9. The method according to claim 1 , wherein the step of making holes in the substrate, comprises making blind holes in the substrate.

10. The method according to claim 9 , wherein the step of making blind holes in the substrate comprises making blind holes having a depth in the range of 0.2 mm-6.0 mm.

11. The method according to claim 1 , wherein the array of heated pins has a pin density in the range of 3-10 pins per cm 2 .

12. The method according to claim 1 , wherein the absorbent material comprises an absorbent foam.

13. The method according to claim 1 , wherein the absorbent material comprises an absorbent nonwoven material.

14. The method according to claim 1 , wherein the hot pin perforator includes a roller having a plurality of heated pins mounted on an outer surface thereof.

15. The method according to claim 1 , further comprising:
providing a supporting surface for the substrate on the opposite sides of the sacrificial layer and the substrate relative to the hot pin perforator, such that the hot pin perforator and the supporting surface form a gap through which the substrate and the sacrificial layer passes.

16. The method according to claim 15 , wherein the supporting surface is an outer surface of a counter roller.

17. The method according to claim 15 , wherein the sacrificial layer does not contact the substrate during manufacturing.

18. The method according to claim 1 , wherein the substrate after manufacturing has an open surface area in the range of 0.1-20%.

19. The method according to claim 1 , wherein the absorbent material is selected from the group consisting of a polymeric foam, non-woven material, fibrous material, gel forming fibres, hydrogel, a matrix containing hydrocolloids, woven fibres, and knitted fibres.

Assignees

• Moelnlycke Health Care Ab

Inventors

• Johannison Ulf
• Jörgensen Steen
• Paledzki Magnus

Classifications

• B26F1/24

  Perforating by needles or pins · CPC title

• A61L24/0026

  Sprayable compositions · CPC title

• A61F13/0289 Primary

  manufacturing of adhesive dressings · CPC title

• B26D7/10

  by heating (with Laser B23K26/00; severing by heating B26F) · CPC title

• A61L24/046

  obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds (A61L24/043 takes precedence) · CPC title