Ceramic electronic component and production method therefor

Patent metadata

Field	Value
Publication number	US-11557434-B2
Application number	US-202017116336-A
Country	US
Kind code	B2
Filing date	Dec 9, 2020
Priority date	May 22, 2018
Publication date	Jan 17, 2023
Grant date	Jan 17, 2023

Abstract

A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle α between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle β between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20° or smaller.

First claim

What is claimed is:

1. A ceramic electronic component, comprising:
external electrodes having conductive resin layers therein on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body, wherein
when an opposing direction of two faces opposed to each other in the rectangular parallelepiped ceramic component body is defined as a first direction, an opposing direction of other two faces opposed to each other is defined as a second direction, an opposing direction of the remaining other two faces opposed to each other is defined as a third direction, and dimensions along respective directions are defined as a first direction dimension, a second direction dimension, and a third direction dimension respectively,
each of the external electrodes includes:
<1> an underlying metal layer having an end face portion covering each end face in the first direction of the rectangular parallelepiped ceramic component body and a wraparound portion covering respective parts of the remaining four faces around the each end face that are continuously formed;
<2> an intermediate metal layer having an end face portion covering each of the end face portion of the underlying metal layer and a wraparound portion covering each of the wraparound portion of the underlying metal layer that are continuously formed;
<3> a conductive resin layer having an end face portion covering each of the end face portion of the intermediate metal layer and a wraparound portion covering each of the wraparound portion of the intermediate metal layer that are continuously formed; and
<4> an external metal layer having an end face portion covering each of the end face portion of the conductive resin layer and a wraparound portion covering each of the wraparound portion of the conductive resin layer that are continuously formed,

on at least a mounting side part of the wraparound portion of the underlying metal layer and on at least a mounting side part of the wraparound portion of the intermediate metal layer, a tip portion of the wraparound portion of the underlying metal layer is covered by a tip portion of the wraparound portion of the intermediate metal layer and a tip angle α between an outer face of the tip portion of the wraparound portion of the underlying metal layer and a first portion of a surface of the rectangular parallelepiped ceramic component body is smaller than a tip angle β between an outer face of the tip portion of the wraparound portion of the intermediate metal layer and a second portion of the surface of the rectangular parallelepiped ceramic component body,
the first portion of the surface is covered by the tip portion of the wraparound portion of the underlying metal layer,
the second portion of the surface is covered by the tip portion of the wraparound portion of the intermediate metal layer,
the tip angle α is 20° or smaller,
the tip angle β is 20° or smaller, and
the tip angle β is 3° or larger.

2. The ceramic electronic component according to claim 1 , wherein a value obtained by subtracting the tip angle α from the tip angle β is 10° or smaller.

3. The ceramic electronic component according to claim 1 , wherein
the underlying metal layer is formed by applying and baking a metal paste,
the intermediate metal layer is formed by a wet or dry plating method,
the conductive resin layer is formed by applying and thermally curing a conductive resin, and
the external metal layer is formed by a wet or dry plating method.

4. The ceramic electronic component according to claim 1 , wherein the ceramic electronic component is a multilayer ceramic capacitor.

5. The ceramic electronic component according to claim 1 , wherein the rectangular parallelepiped ceramic component body comprises:
a capacitance portion;
a plurality of internal electrodes stacked in the second direction;
a plurality of dielectric layers stacked in the second direction; and
a dielectric margin portion that surrounds the capacitance portion in the second direction,
wherein a component of the dielectric margin portion is different from a component of the plurality of dielectric layers.

6. The ceramic electronic component according to claim 1 , wherein the rectangular parallelepiped ceramic component body comprises:
a capacitance portion;
a plurality of internal electrodes stacked in the second direction;
a plurality of dielectric layers stacked in the second direction; and
a dielectric margin portion that surrounds the capacitance portion in the third direction perpendicular to the first direction and the second direction,
wherein a component of the dielectric margin portion is different from a component of the plurality of dielectric layers.

7. The ceramic electronic component according to claim 6 , wherein the component of the plurality of dielectric layers is calcium zirconate.

8. A ceramic electronic component, comprising:
external electrodes having conductive resin layers therein on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body, wherein
when an opposing direction of two faces opposed to each other in the rectangular parallelepiped ceramic component body is defined as a first direction,
an opposing direction of other two faces opposed to each other is defined as a second direction,
an opposing direction of the remaining other two faces opposed to each other is defined as a third direction, and dimensions along respective directions are defined as a first direction dimension, a second direction dimension, and a third direction dimension respectively,
each of the external electrodes includes:
<1> an underlying metal layer having an end face portion covering each end face in the first direction of the rectangular parallelepiped ceramic component body and a wraparound portion covering respective parts of the remaining four faces around the each end face that are continuously formed;
<2> an intermediate metal layer having an end face portion covering each of the end face portion of the underlying metal layer and a wraparound portion covering each of the wraparound portion of the underlying metal layer that are continuously formed;
<3> a conductive resin layer having an end face portion covering each of the end face portion of the intermediate metal layer and a wraparound portion covering each of the wraparound portion of the intermediate metal layer that are continuously formed; and
<4> an external metal layer having an end face portion covering each of the end face portion of the conductive resin layer and a wraparound portion covering each of the wraparound portion of the conductive resin layer that are continuously formed,

on at least a mounting side part of the wraparound portion of the underlying metal layer and on at least a mounting side part of the wraparound portion of the intermediate metal layer, a tip portion of the wraparound portion of the underlying metal layer is covered by a tip portion of the wraparound portion of the intermediate metal layer and a tip angle α between an outer face of the tip portion of the wraparound portion of the underlying metal layer and a surface of the rectangular parallelepiped ceramic component body is smaller than a tip angle β between an outer face of the tip portion of the wraparound portion of the intermediate metal layer and the surface of the rectangular parallelepiped ceramic component body, and
a value obtained by subtracting the tip angle α from the tip angle β is 10° or smaller.

9. The ceramic electronic component according to claim 8 , wherein
the underlying metal layer is formed by applying and baking a metal paste,
the intermediate metal layer is formed by a wet or dry plating method,
the conductiv

Assignees

• Taiyo Yuden Kk

Inventors

• Kobayashi Satoshi
• Fukuda Takahisa
• Nakamura Tomoaki
• Tahara Mikio
• Saito Naoki
• Yatagawa Kiyoshiro

Classifications

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/2325 Primary

  characterised by the material of the terminals · CPC title