Integrally stiffened bonded panel with machined pockets and methods of manufacture

US11554561B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11554561-B2
Application numberUS-201916658738-A
CountryUS
Kind codeB2
Filing dateOct 21, 2019
Priority dateOct 21, 2019
Publication dateJan 17, 2023
Grant dateJan 17, 2023

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  1. Title

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  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Methods, systems, and apparatuses are disclosed for the manufacture of composite components having incorporated reinforcing structures machined into composite material substrates, and composite components manufactured according to disclosed methods, and assemblies and larger structures comprising the composite material components.

First claim

Opening claim text (preview).

What is claimed is: 1. A method comprising: orienting a plurality of composite material layers onto a tool to form a composite material substrate, said composite material substrate having a composite material substrate thickness, said tool comprising a tooling surface, and said composite material substrate further comprising a composite material substrate first surface and a composite material substrate second surface, said composite material substrate first surface positioned proximate to the tooling surface; orienting a separator layer onto composite material substrate; orienting a composite material top layer onto the separator layer; at least partially curing the composite material substrate and the composite material top layer; separating the composite material substrate and the composite material top layer; orienting a composite material removal device proximate to the composite material substrate second surface; and machining at least one recess into the composite material substrate and removing a predetermined amount of material from the composite material substrate to form a recess in the composite material substrate, said recess configured to extend from the composite material second surface to a predetermined distance into the composite material substrate thickness to form a machined composite material substrate, said machined composite material substrate comprising a machined composite material substrate first surface and a machined composite material substrate second surface. 2. The method of claim 1 , the separator layer comprising a caul plate. 3. The method of claim 1 , further comprising: machining a plurality of recesses into the composite material substrate. 4. The method of claim 1 , wherein the at least one recess comprises a geometric profile, said geometric profile comprising: at least one of: a rectangle; a circle; an ellipse; a triangle; a polygon; an irregular shape; or combinations thereof. 5. The method of claim 1 , wherein the predetermined distance is equal to from about 10% to about 90% of the composite material thickness. 6. The method of claim 1 , wherein the predetermined distance is equal to from about 50% to about 80% of the composite material thickness. 7. The method of claim 1 , wherein the composite material removal device is a laser. 8. The method of claim 1 , wherein the composite material removal device is a CNC machine. 9. The method of claim 1 , wherein the composite material removal device is in communication with a controller. 10. The method of claim 3 , further comprising: machining the plurality of recesses into the composite substrate material in a predetermined pattern. 11. The method of claim 1 , wherein at least one of the composite material substrate and the composite material top layer comprises a fiber-containing epoxy-based composite material. 12. The method of claim 1 , wherein at least one of the composite material substrate and the composite material top layer comprises a carbon fiber-containing epoxy-based composite material. 13. A method comprising: orienting a plurality of composite material layers onto a tool to form a composite material substrate, said composite material substrate having a composite material substrate thickness, said tool comprising a tooling surface, and said composite material substrate comprising a composite material substrate first surface and a composite material substrate second surface, said composite material substrate first surface positioned proximate to the tooling surface; orienting a separator layer onto the composite material substrate second surface; orienting a composite material top layer onto the separator layer; at least partially curing the composite material substrate and the composite material top layer to form an at least partially cured composite material substrate and an at least partially cured composite top layer; separating the composite material substrate and the composite material top layer; orienting a material removal device proximate to the composite material substrate second surface; activating the material removal device; machining at least one recess into the at least partially cured composite material substrate, said recess configured to extend from the composite material second surface to a predetermined distance into the at least partially cured composite material substrate to form a machined composite material substrate, said machined composite material substrate comprising a machined composite material substrate first surface and a machined composite material substrate second surface; applying an adhesive material to at least one of the composite material top layer or the machined composite material substrate second surface; orienting the composite material top layer onto the machined composite material substrate second surface; and bonding the composite material top layer to the machined composite material substrate second surface. 14. The method of claim 13 , further comprising: machining a plurality of recesses recess into the composite material substrate. 15. The method of claim 14 , wherein the plurality of recesses comprises a geometric profile, said geometric profile comprising: at least one of: a rectangle; a circle; an ellipse; a triangle; a polygon; an irregular shape; or combinations thereof. 16. The method of claim 14 , comprising machining the plurality of recesses into the composite substrate material in a predetermined pattern. 17. The method of claim 13 , wherein at least one of the composite material substrate and the composite material top layer comprises a fiber-containing epoxy-based composite material. 18. The method of claim 13 , wherein at least one of the composite material substrate and the composite material top layer comprises a carbon fiber-containing epoxy-based composite material. 19. The method of claim 13 , further comprising applying an adhesive material to the composite material top layer and the machined composite material substrate second surface. 20. The method of claim 13 , further comprising disposing the adhesive material between the machined composite material second surface and the composite material top layer.

Assignees

Inventors

Classifications

  • formed with structures, e.g. cores placed between two plates or sheets, e.g. partially filled (totally filled B29D99/0021) · CPC title

  • Use of {EP, i.e.} epoxy resins {or derivatives thereof}, as moulding material · CPC title

  • Weight reduction · CPC title

  • Carbon · CPC title

  • Integral or sandwich constructions · CPC title

Patent family

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Frequently asked questions

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What does patent US11554561B2 cover?
Methods, systems, and apparatuses are disclosed for the manufacture of composite components having incorporated reinforcing structures machined into composite material substrates, and composite components manufactured according to disclosed methods, and assemblies and larger structures comprising the composite material components.
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification B29C70/54. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 17 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).