Method for processing electronic and electrical device component scrap

Patent metadata

Field	Value
Publication number	US-11554388-B2
Application number	US-201916981649-A
Country	US
Kind code	B2
Filing date	Mar 18, 2019
Priority date	Mar 16, 2018
Publication date	Jan 17, 2023
Grant date	Jan 17, 2023

Abstract

Provided is a method for processing electronic and electrical device component scrap, which can accurately and efficiently sort electronic and electrical device component scrap. The method for processing electronic and electrical device component scrap includes a separation step of separating non-metal objects 1b or metal objects 1a1, 1a2 from electronic and electrical device component scrap 1 containing the metal objects 1a1, 1a2 and the non-metal objects 1b using a sorter 10 comprising a metal sensor 2, a color camera 3, an air valve 4, and a conveyor 5, wherein a fixed distance is provided between the metal objects 1a1, 1a2 adjacent to each other so as to prevent the non-metal objects 1b between the metal objects 1a1, 1a2 from being erroneously detected, when detecting the metal objects 1a1, 1a2 in the electronic and electrical device component scrap 1 by the metal sensor 2.

First claim

The invention claimed is:

1. A method for processing electronic and electrical device component scrap, the method comprising:
a separation step of separating non-metal objects or metal objects from electronic and electrical device component scrap containing the metal objects and the non-metal objects using a sorter, the sorter comprising: a metal sensor; a color camera; an air valve; and a conveyor,
wherein if a non-metal object is sandwiched between the metal objects and a distance between the metal objects sandwiching the non-metal object is less than a fixed distance, a new distance which is larger than the fixed distance is provided between the metal objects so as to prevent the non-metal objects between the metal objects from being erroneously detected, when detecting the metal objects in the electronic and electrical device component scrap by the metal sensor.

2. The method for processing electronic and electrical device component scrap according to claim 1 , wherein the fixed distance is larger than a length of a detection range for the metal sensor in a direction along a conveying direction of the electronic and electrical device component scrap.

3. A method for processing electronic and electrical device component scrap, the method comprising:
a separation step of separating non-metal objects or metal objects from electronic and electrical device component scrap containing the metal objects and the non-metal objects using a sorter, the sorter comprising: a metal sensor; a color camera; an air valve; and a conveyor,
wherein if a distance between the metal objects in which a non-metal object is at least present between the metal objects is larger than a length of a detection range for the metal sensor in a direction along a conveying direction of the electronic and electrical device component scrap, a new distance which is larger than the length of the detection range is provided between the metal objects sandwiching the non-metal object so as to prevent the non-metal objects between the metal objects from being erroneously detected, when detecting the metal objects in the electronic and electrical device component scrap by the metal sensor.

4. The method for processing electronic and electrical device component scrap according to claim 1 , wherein the length of the detection range for the metal sensor is from 4 to 200 mm.

5. The method for processing electronic and electrical device component scrap according to claim 1 , wherein an opening/closing speed of the air valve is from 0.5 to 4 ms/cycle.

6. The method for processing electronic and electrical device component scrap according to claim 1 , wherein the electronic and electrical device component scrap has a characteristic particle diameter of from 4 to 70 mm.

7. The method for processing electronic and electrical device component scrap according to claim 1 , further comprising removing powdery materials contained in the electronic and electrical device component scrap before detecting the metal objects in the electronic and electrical device component scrap by the metal sensor.

8. The method for processing electronic and electrical device component scrap according to claim 1 , wherein the method comprising carrying out a magnetic force sorting process as a pre-processing of the metal sorting step before detecting the metal objects in the electronic and electrical device component scrap by the metal sensor, and wherein the magnetic force sorting process is carried out such that a ratio of the number of the metal objects to the number of the non-metal objects to be introduced into the metal sorter is 2.0 or less.

9. The method for processing electronic and electrical device component scrap according to claim 8 , wherein the magnetic force sorting process comprises magnetic force sorting processes in at least two stages.

10. The method for processing electronic and electrical device component scrap according to claim 1 , wherein the method comprises, before the separation step, a step of sorting substrate scrap in the electronic and electrical device component scrap using a color sorter, the color sorter comprising at least two camera units capable of identifying colors of front and back sides of processing objects, such that a ratio of the number of the metal objects to the number of the non-metal objects to be introduced into the metal sensor (the metal objects/the non-metal objects) is 2.0 or less.

11. The method for processing electronic and electrical device component scrap according to claim 10 , wherein wind force sorting processes are carried out in at least two stages before the step of sorting the substrate scrap in the electronic and electrical device component scrap using the color sorter.

12. The method for processing electronic and electrical device component scrap according to claim 1 , further comprising a step of processing the electronic and electrical device component scrap after separating the non-metals in a smelting step.

Assignees

• Jx Nippon Mining & Metals Corp
• Jx Nippon Mining & Metals Copporation

Inventors

• Aoki Katsushi
• TAKEDA Tsubasa

Classifications

• C22B7/001 Primary

  Dry processes · CPC title

• B07C2501/0054

  Sorting of waste or refuse · CPC title

• Y02P10/20

  Recycling · CPC title

• C22B7/005

  Separation by a physical processing technique only, e.g. by mechanical breaking · CPC title

• C22B15/0056

  Scrap treating · CPC title