Flexible display panel and method of manufacturing the same
US-9553275-B2 · Jan 24, 2017 · US
US11552153B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11552153-B2 |
| Application number | US-201916513343-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 16, 2019 |
| Priority date | Jan 10, 2017 |
| Publication date | Jan 10, 2023 |
| Grant date | Jan 10, 2023 |
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An organic light emitting display device includes a display panel including a display region where a plurality of pixels are disposed, a pad region including a bending region and a pad electrode region where pad electrodes are disposed, a polarizing layer disposed in the display region, and a lower protection film disposed on a lower surface of the display panel. The lower protection film includes a first and a second lower protection film pattern. The first lower protection film pattern is disposed in the display region, and the second lower protection film pattern in the pad electrode region such that a lower surface of the display panel in the bending region is exposed. The bending protection layer has an upper surface with a height that is less than a height of the polarizing layer, and is disposed in the bending region on the display panel.
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What is claimed is: 1. An organic light emitting display (OLED) device, comprising: a display panel comprising a display region where a plurality of pixels are disposed and a pad region that is located adjacent to a first side of the display region, the pad region comprising a bending region located in a portion of the pad region that is adjacent to the display region and a pad electrode region located in a remaining portion of the pad region, pad electrodes being disposed in the pad electrode region; a polarizing layer disposed on the display panel in the display region; a touch screen electrode layer disposed on the polarizing layer; an upper adhesion layer interposed between the polarizing layer and the touch screen electrode layer; a lower protection film disposed on a lower surface of the display panel, the lower protection film comprising: a first lower protection film pattern disposed in the display region; and a second lower protection film pattern disposed in the pad electrode region of the pad region such that a lower surface of the display panel located in the bending region is exposed; and a bending protection layer, where a height of the bending protection layer is less than a height of the polarizing layer, the bending protection layer being disposed in the bending region on the display panel, wherein the display region comprises: a light emitting region configured for emission of light; a peripheral region surrounding the light emitting region; a plurality of wirings disposed on the peripheral region; and connection electrodes disposed between the bending protection layer and the display panel, the connection electrodes being electrically connected to the pixels and the pad electrodes, and wherein each of the plurality of the pixels disposed in the display region comprises: a semiconductor element disposed on the substrate; a lower electrode disposed on the semiconductor element; a light emitting layer disposed on the lower electrode; an upper electrode disposed on the light emitting layer; and a thin film encapsulation structure disposed on the upper electrode, wherein a portion of the peripheral region is interposed between the light emitting region and the bending region, wherein the bending protection layer comprises a protrusion portion in the peripheral region that is located adjacent to the bending region, wherein a height from a lower surface of the bending protection layer to the protrusion portion is greater than a height of the polarizing layer, wherein the polarizing layer is in contact with the bending protection layer in a portion where the display region and the bending region are adjacent to each other, wherein the polarizing layer and the bending protection layer are in contact with the display panel, wherein the polarizing layer is disposed in the light emitting region and a portion of the peripheral region that is located adjacent to the bending region on the display panel, wherein the bending protection layer is disposed in a portion of the peripheral region that is located adjacent to the bending region, the bending region, and a portion of the pad electrode region, wherein the bending protection layer is in contact with the polarizing layer in the peripheral region that is located adjacent to the bending region, wherein a height of the polarizing layer is in a range between about 60 micrometers and about 120 micrometers, wherein a first height of the polarizing layer is less than a second height from a lower surface of the bending protection layer to the protrusion portion, wherein a height difference between the first and second heights is in a range between about 10 micrometers and about 30 micrometers, wherein the first lower protection film pattern is disposed in the light emitting region and the peripheral region on a lower surface of the display panel, and the first lower protection film pattern and the bending protection layer are overlapped in the peripheral region in a plan view, wherein the bending region is bent on an axis with respect to a first direction corresponding to a row direction in a plan view of the OLED device, and the second lower protection film pattern is disposed on a lower surface of the first lower protection film pattern, wherein the polarizing layer is on the thin film encapsulation structure, wherein the semiconductor element comprises: an active layer disposed on the substrate; a gate insulation layer disposed on the active layer, the gate insulation layer exposing an upper surface of the substrate that is located in the bending region; a gate electrode disposed on the gate insulation layer; an insulating interlayer disposed on the gate electrode, the insulating interlayer exposing the upper surface of the substrate that is located in the bending region; and source and drain electrodes disposed on the insulating interlayer, wherein a portion of the touch screen electrode layer is overlapped with a portion of the bending protective layer in a peripheral region in a plan view, wherein an overlap distance of the bending protection layer and first lower protection film pattern is less than or equal to about 350 micrometers. 2. The OLED device of claim 1 , wherein the bending protection layer has a Young's modulus that ranges between 0.1 GPa and 0.7 Gpa. 3. The OLED device of claim 1 , wherein a height of the polarizing layer including λ/4 phase retardation film is about 100 micrometers. 4. The OLED device of claim 1 , wherein the thin film encapsulation structure comprises: a first thin film encapsulation layer; a second thin film encapsulation layer disposed on the first thin film encapsulation layer; and a third thin film encapsulation layer disposed on the second thin film encapsulation layer, wherein the first thin film encapsulation layer is disposed closest to the substrate, and wherein the third thin film encapsulation layer is disposed farthest from the substrate. 5. The OLED device of claim 4 , wherein the first thin film encapsulation layer has a shape with respect to a cross-sectional view of the OLED device such that a middle portion of the first thin film encapsulation layer is closer to the substrate than left and right portions of the first thin film encapsulation layer, and wherein second thin film encapsulation layer has a shape with respect to a cross-sectional view of the OLED device such that a top surface of the second thin film encapsulation layer is flat and wherein a bottom surface of the second thin film encapsulation layer has a shape such that a middle portion of the second thin film encapsulation layer is closer to the substrate than left and right portions of the second thin film encapsulation layer, and wherein the third thin film encapsulation layer has a shape with respect to a cross-sectional view of the OLED device such that a bottom surface of the third thin film encapsulation layer is flat and a top surface of the third thin film encapsulation layer is flat. 6. The OLED device of claim 1 , wherein the lower electrode has a relatively flat shape with respect to a cross-sectional view of the OLED device, and wherein the upper electrode has a shape with respect to a cross-sectional view of the OLED device such that a middle portion of the upper electrode is closer to the substrate than left and right portions of the upper electrode. 7. The OLED device of claim 6 , further comprising: a planarization layer disposed directly under the lower electrode, wherein a via is provided in the planarization layer to electrically connect the semiconductor element with the lower electrode. 8. The OLED device of claim 1 , wherein the protrusion portion has a sloped shape such that a widest part of the
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