Spatially variable wafer bias power system

Patent metadata

Field	Value
Publication number	US-11551908-B2
Application number	US-202117359498-A
Country	US
Kind code	B2
Filing date	Jun 25, 2021
Priority date	Jul 27, 2018
Publication date	Jan 10, 2023
Grant date	Jan 10, 2023

Abstract

A plasma deposition system comprising a wafer platform, a second electrode, a first electrode, a first high voltage pulser, and a second high voltage pulser. In some embodiments, the second electrode may be disposed proximate with the wafer platform. In some embodiments, the second electrode can include a disc shape with a central aperture; a central axis, an aperture diameter, and an outer diameter. In some embodiments, the first electrode may be disposed proximate with the wafer platform and within the central aperture of the second electrode. In some embodiments, the first electrode can include a disc shape, a central axis, and an outer diameter. In some embodiments, the first high voltage pulser can be electrically coupled with the first electrode. In some embodiments, the second high voltage pulser can be electrically coupled with the second electrode.

First claim

That which is claimed:

1. A power system with plasma load comprising:
a first high voltage pulser that outputs a first plurality of pulses having a first voltage greater than about 1 kV, a first pulse width less than about 1 μs, and a first pulse repletion frequency greater than about 20 kHz;
a second high voltage pulser that outputs a second plurality of pulses having a second voltage greater than about 1 kV, a second pulse width less than about 1 μs, and a second pulse repletion frequency greater than about 20 kHz;
a chamber;
a first electrode disposed within the chamber and electrically coupled with the first high voltage pulser, wherein the first electrode comprises:
a disc shape,
a central axis, and
an outer diameter; and

a second electrode disposed within the chamber adjacent with the first electrode and electrically coupled with the second high voltage pulser, wherein the second electrode comprises:
a disc shape with a central aperture, the first electrode disposed within the central aperture;
a central axis aligned with the central axis of the first electrode,
an aperture diameter, and

an outer diameter.

2. The system according to claim 1 , wherein the chamber includes either or both a wafer and a plasma that is capacitively coupled with the first electrode and the second electrode with a capacitance between 10 pF and 1 μF.

3. The system according to claim 1 , wherein an electric field across the surface of the wafer is uniform within 25%.

4. The system according to claim 1 , wherein the coupling capacitance between the first electrode and a corresponding portion of the wafer is greater than 100 pF; and the capacitance between the second electrode and a corresponding portion of the wafer is greater than 100 pF.

5. The system according to claim 1 , wherein the chamber includes a plasma of ions that are accelerated onto a wafer.

6. The system according to claim 1 , wherein the first high voltage pulser produces an electrode voltage on the first electrode that is greater than about 1 kV, and the second high voltage pulser produces an electrode voltage on the second electrode that is greater than about 1 kV.

7. The system according to claim 1 , wherein the ratio of the first voltage relative to the second voltage is less than two to one or vice versa.

8. The system according to claim 1 , wherein either or both the first electrode and the second electrode are axially symmetric.

9. The system according to claim 1 , wherein the first electrode has a first planar surface and the second electrode has a second planar surface such that the second planar surface is 25% of the total of the first planar surface and the second planar surface.

10. The system according to claim 1 , wherein both the first the first high voltage pulser and the second high voltage pulser comprise a resistive output stage.

11. The system according to claim 1 , wherein both the first high voltage pulser and the second high voltage pulser comprise an energy recovery circuit.

12. The system according to claim 1 , wherein the parameters of the first plurality of pulses are controlled independently of the parameters of the second plurality of pulses.

13. The system according to claim 1 , wherein the first pulse repletion frequency and the second pulse repetition frequency are in phase with respect of each other.

14. The system according to claim 1 , wherein the coupling capacitance between the first electrode and the second electrode is less than about 10 nF.

15. A system comprising:
a wafer platform;
a first electrode comprises:
a disc shape,
a central axis, and
an outer diameter; and

a second electrode comprises:
a disc shape with a central aperture, the first electrode disposed within the central aperture;
a central axis aligned with the central axis of the first electrode,
an aperture diameter, and
an outer diameter;

a first high voltage pulser electrically coupled with the first electrode, the first high voltage pulser producing pulses greater than 5 kV with a pulse repetition rate greater than 10 kHz; and
a second high voltage pulser electrically coupled with the second electrode, the second high voltage pulser producing pulses greater than 5 kV with a pulse repetition rate greater than 10 kHz.

16. The system according to claim 15 , wherein the wafer platform has an outer diameter that is substantially similar to the outer diameter of the second electrode.

17. The system according to claim 15 , wherein the second high voltage pulser provides pulses with an amplitude that is a fraction of the amplitude of the pulses provided by the first high voltage pulser.

18. The system according to claim 15 , wherein the second high voltage pulser provides pulses with a pulse repetition frequency that is a fraction of the pulse repetition frequency of the pulses provided by the first high voltage pulser.

19. The system according to claim 15 , further comprising: a first resistive output stage coupled with the first high voltage pulser and the first electrode; and a second resistive output stage coupled with the second high voltage pulser and the second electrode.

20. The system according to claim 15 , further comprising a bias compensation circuit coupled with the first high voltage pulser and the first electrode.

21. The system according to claim 15 , further comprising a ring of insulating material disposed between the first electrode and the second electrode.

22. The system according to claim 15 , wherein the wafer platform comprises a dielectric material or a ceramic material.

23. A method comprising:
pulsing a first high voltage pulser coupled with a first electrode in a plasma chamber, the first high voltage pulser pulsing at a first voltage greater than about 1 kV, with a first pulse repetition frequency greater than about 20 kHz, and with a first pulse width;
pulsing a second high voltage pulser coupled with a second electrode in the plasma chamber, the second high voltage pulser pulsing at a second voltage greater than about 1 kV, with a second pulse repetition frequency greater than about 20 kHz, and with a second pulse width, wherein the first electrode and the second electrode are disposed beneath a wafer;
measuring a parameter corresponding with a physical phenomenon occurring within the plasma chamber; and
adjusting at least one of the second voltage, the second pulse repetition frequency, and the second pulser width an amount based on the measured parameter.

24. The method according to claim 23 , wherein the physical phenomena occurring within the plasma chamber corresponds with the uniformity of the electric field across a surface of the wafer.

25. The method according to claim 23 , wherein the physical phenomena occurring within the plasma chamber corresponds with the uniformity of the ion current across a surface of the wafer.

26. The method according to claim 23 , wherein the parameter is the current flowing through a resistor in the first high voltage pulser.

Assignees

• Eagle Harbor Tech Inc

Inventors

• Ziemba Timothy
• Slobodov Ilia
• Carscadden John
• Miller Kenneth
• Prager James

Classifications

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H10P72/722

  Details of electrostatic chucks · CPC title

• H05K7/20272

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H01J37/32715

  Workpiece holder · CPC title

• H03K3/53

  by the use of an energy-accumulating element discharged through the load by a switching device controlled by an external signal and not incorporating positive feedback (H03K3/335 takes precedence) · CPC title