Methods and Systems for Characterizing Laser Machining Properties by Measuring Keyhole Dynamics Using Interferometry
US-2016039045-A1 · Feb 11, 2016 · US
US11549798B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11549798-B2 |
| Application number | US-201916524445-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 29, 2019 |
| Priority date | Jul 31, 2018 |
| Publication date | Jan 10, 2023 |
| Grant date | Jan 10, 2023 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A measuring device determines a distance between a processing head for a laser processing system configured to process a workpiece with a laser beam and the workpiece. The measuring device includes an optical coherence tomograph to measure a distance between the processing head and workpiece. In the optical coherence tomograph, measuring light generated by a measuring light source and reflected by the workpiece interferes with measuring light reflected in a reference arm with two or more reference stages. The stages include a first reference stage configured such that the measuring light reflected therein travels a first optical path length, and a second reference stage configured such that the measuring light reflected therein travels a second optical path length different from the first length, wherein the measuring light reflected by the workpiece interferes with reflected measuring light of the first reference stage and reflected measuring light of the second reference stage.
Opening claim text (preview).
The invention claimed is: 1. A laser processing system for processing a workpiece with a laser beam, comprising: a processing head; and a measuring device for determining a distance between a laser processing head and a workpiece, the measuring device including: an optical coherence tomograph configured to determine a distance between the processing head and the workpiece, the optical coherence tomograph comprising; a measuring arm for guiding measuring light reflected from the workpiece; and a reference arm with N reference stages having different optical path lengths and being subsequently arranged, wherein N is greater than two, the reference arm having a beam splitter assembly for splitting the measuring light into the N reference stages, the beam splitter assembly configured to split the measuring light, in substantially equal parts, and to direct the measuring light onto the N reference stages, wherein the beam splitter assembly comprises a reflecting optical element at a last reference stage of the N reference stages and N- 1 semi-transmissive optical elements at the remaining reference stages, wherein each of the semi-transmissive optical elements is configured to split the measuring light such that a part of the measuring light enters the respective reference stage and the other part of the measuring light is guided to the subsequent semi-transmissive optical element of the subsequent reference stage, wherein the reference stages are illuminated equally and at the same time; and an evaluation processor unit configured to determine the distance based on a superposition of measuring light from the measuring arm and measuring light from each of the N reference stages. 2. The measuring device according to claim 1 , wherein the optical coherence tomograph is configured to superpose the measuring light reflected by the workpiece and the measuring light reflected in the N reference stages. 3. The measuring device according to claim 1 , wherein the evaluation processor unit is configured to determine the distance based on an interference between the measuring light reflected by the workpiece and the measuring light reflected in one of the N reference stages. 4. The measuring device according to claim 3 , wherein the evaluation processor unit is configured to take into account, for determining the distance, a predetermined offset corresponding to the reference stages in which the measuring light is reflected which interferes with the measuring light reflected by the workpiece. 5. The measuring device according to claim 1 , wherein the beam splitter assembly comprises at least one element which is selected from the group consisting of a reflecting optical element, a partially transmissive optical element, a reflecting mirror, a partially transmissive mirror, a prism assembly, and an optical fiber. 6. The measuring device according to claim 1 , wherein the beam splitter assembly comprises at least one fiber coupler and at least two fiber sections coupled to the fiber coupler, and wherein the measuring light for each of the N reference stages is provided by a respective fiber section. 7. The measuring device according to claim 1 , wherein a path length difference (ΔL) between optical path lengths of successive reference stages of the N reference stages is less than or equal to a measuring range of the coherence tomograph which is dependent on a coherence length of the measuring light. 8. The measuring device according to claim 1 , wherein optical path lengths of all of the N reference stages differ by the same path length difference (ΔL). 9. A method for determining a distance between a laser processing head and a workpiece, comprising: directing measuring light onto the workpiece and into N reference stages of a reference arm, wherein optical path lengths of the N reference stages are different and wherein N is greater than two, wherein the measuring light is split by a beam splitter assembly of the reference arm, in substantially equal parts, and directed onto the N reference stages, wherein the beam splitter assembly comprises a reflecting optical element at a last reference stage of the N reference stages and N- 1 semi-transmissive optical elements at the remaining reference stages, wherein each of the semi-transmissive optical elements splits the measuring light such that a part of the measuring light enters the respective reference stage and the other part of the measuring light is guided to the subsequent semi-transmissive optical element of the subsequent reference stage, wherein the reference stages are illuminated equally and at the same time; superposing the measuring light reflected by the workpiece with the measuring light reflected in each of the N reference stages; and determining a distance between the processing head and the workpiece based on the superposition. 10. The method of claim 9 , wherein the distance is determined based on an interference between the measuring light reflected by the workpiece and the measuring light reflected in one of the N reference stages which has an optical path length corresponding to the distance. 11. A laser processing system for processing a workpiece with a laser beam, comprising: a processing head; and a measuring device for determining a distance between a laser processing head and a workpiece, the measuring device including: an optical coherence tomograph configured to determine a distance between the processing head and the workpiece, the optical coherence tomograph comprising; a measuring arm for guiding measuring light reflected from the workpiece; and a reference arm with N reference stages having different optical path lengths and being subsequently arranged, wherein N is greater than two, the reference arm having a beam splitter assembly for splitting the measuring light into the N reference stages, the beam splitter assembly configured to split the measuring light, in substantially equal parts, and to direct the measuring light onto the N reference stages, wherein the beam splitter assembly comprises a plurality of successive fiber sections, wherein the measuring light for each reference stage is provided by a respective fiber section, wherein the reference stages are illuminated equally and at the same time; and an evaluation processor unit configured to determine the distance based on a superposition of measuring light from the measuring arm and measuring light from each of the N reference stages.
Two or more reference or object arms in one interferometer · CPC title
by measuring distance between sensor and object (G01B11/0608 takes precedence) · CPC title
Tomographic interferometers, e.g. based on optical coherence · CPC title
using optical means · CPC title
by welding · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.