Active ester resin and composition and cured product using the same

Patent metadata

Field	Value
Publication number	US-11548977-B2
Application number	US-201816623456-A
Country	US
Kind code	B2
Filing date	Apr 24, 2018
Priority date	Jun 21, 2017
Publication date	Jan 10, 2023
Grant date	Jan 10, 2023

Abstract

The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.

First claim

The invention claimed is:

1. An active ester resin that is a reaction product of:
a first aromatic compound having two or more phenolic hydroxy groups;
a second aromatic compound having only one phenolic hydroxy group; and
a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof,
wherein at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent,
wherein at least the second aromatic compound has an unsaturated bond-containing substituent, and
wherein the unsaturated bond-containing substituent is an alkenyl or alkynyl group of 2 to 30 carbon atoms.

2. The active ester resin according to claim 1 , wherein the first aromatic compound is represented by chemical formula (1):

wherein, in chemical formula (1),
each Ar 1 is independently a substituted or unsubstituted first aromatic ring group,
each Ar 2 is independently a substituted or unsubstituted second aromatic ring group,
each X is independently an oxygen atom, a sulfur atom, a substituted or unsubstituted alkylene, a substituted or unsubstituted cycloalkylene, or a substituted or unsubstituted aralkylene, and
n is 0 to 10,
wherein at least two hydrogen atoms of Ar 1 and Ar 2 are replaced with hydroxy groups.

3. The active ester resin according to claim 2 , wherein each X is a substituted or unsubstituted cycloalkylene having 3 to 20 carbon atoms or a substituted or unsubstituted aralkylene having 8 to 20 carbon atoms.

4. The active ester resin according to claim 1 , wherein the second aromatic compound is a fused ring aromatic compound.

5. A composition, comprising the active ester resin according to claim 1 and an epoxy resin.

6. A cured product obtained by curing the composition according to claim 5 .

7. A printed circuit board obtained using the composition according to claim 5 .

8. A semiconductor sealing material obtained using the composition according to claim 5 .

9. A build-up film obtained using the composition according to claim 5 .

10. A cured product obtained by curing the active ester resin according to claim 1 .

Assignees

• Dainippon Ink & Chemicals

Inventors

• Satou Yutaka
• Yamoto Kazuhisa
• Hayashi Koji

Classifications

• C08G59/4276

  Polyesters · CPC title

• C08G63/19 Primary

  Hydroxy compounds containing aromatic rings · CPC title

• C08G63/547

  Hydroxy compounds containing aromatic rings · CPC title

• C08G59/4223 Primary

  aromatic · CPC title

• C08G63/193

  containing two or more aromatic rings · CPC title