Method for removing wire-form objects, device for removing wire-form objects, and method for processing electronic/electrical apparatus component scrap

Patent metadata

Field	Value
Publication number	US-11548032-B2
Application number	US-201916966821-A
Country	US
Kind code	B2
Filing date	Jan 30, 2019
Priority date	Jan 31, 2018
Publication date	Jan 10, 2023
Grant date	Jan 10, 2023

Abstract

Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes. The method for removing wire-form objects includes: arranging a filter in a vibrating sieve machine, the filter including a plurality of rods extending at distances in a feed direction of a raw material; and placing a raw material containing at least wire-form objects and plate-form objects onto the filter, and vibrating the filter to sieve out the wire-form objects under a sieve.

First claim

The invention claimed is:

1. A method for removing wire-form objects, the method comprising:
arranging a filter in a vibrating sieve machine, the filter comprising a plurality of rods extending at distances in a feed direction of a raw material;
placing a sheet-shaped pressing member comprising a sheet-shaped material having elasticity provided on the filter, the sheet-shaped material extending from a feed side of the raw material to a discharge side of the raw material, the sheet-shaped material suspended from the feed side of the raw material toward the discharge side of the raw material, the sheet-shaped material having a fixed end that is fixed to the vibrating sieve machine on the feed side of the raw material and the sheet-shaped material having a free end that is not fixed to the vibrating sieve machine provided on the discharge side of the raw material, the free end allowing to move according to the shape and vibration of the raw material on the filter, the sheet-shaped material configured to directly contact and press upon the wire-form objects;
placing a raw material containing at least wire-form objects and plate-form objects onto the filter; and
vibrating the filter to sieve out the wire-form objects under the filter while pressing the raw material on the filter from above from between the fixed end and the free end to the free end by the sheet-shaped material.

2. The method for removing the wire-form objects according to claim 1 , wherein a surface of each of the plurality of rods that are brought into contact with the raw material comprises a curved surface formed for sieving out the wire-form objects under the filter.

3. The method for removing the wire-form objects according to claim 1 , wherein the distances between the plurality of rods and diameters of the plurality of rods are adjusted based on sizes of the plate-form objects contained in the raw material.

4. The method for removing the wire-form objects according to claim 1 , wherein the distances between the plurality of rods are adjusted such that each of the distances is 1.2 to 6 times a characteristic particle diameter of the wire-form objects, and is narrower than a minimum short diameter of the plate-form objects.

5. The method for removing the wire-form objects according claim 1 ,
wherein the vibrating sieve machine comprises a flat plate-shaped table arranged on an upstream side of the filter, and
wherein the method further comprises:
dispersing the raw material on an upper surface of the table by vibrating the raw material fed onto the table; and
feeding the dispersed raw material from the upper surface of the table to an upper surface of the filter.

6. The method for removing the wire-form objects according to claim 1 , wherein the raw material is electronic/electrical apparatus component scrap, and wherein the plate-form objects contain substrate scrap, and the wire-form objects contain wire scrap.

7. A method for processing electronic/electric apparatus component scrap, the method comprising:
arranging a filter in a vibrating sieve machine, the filter comprising a plurality of rods extending at distances in a feed direction of a raw material;
placing a sheet-shaped pressing member comprising a sheet-shaped material having elasticity provided on the filter, the sheet-shaped material extending from a feed side of the raw material to a discharge side of the raw material, the sheet-shaped material suspended from the feed side of the raw material toward the discharge side of the raw material, the sheet-shaped material having a fixed end that is fixed to the vibrating sieve machine on the feed side of the raw material and the sheet-shaped material having a free end that is not fixed to the vibrating sieve machine on the discharge side, the free end allowing to move according to the shape and vibration of the raw material on the filter, the sheet-shaped material configured to directly contact and press upon the wire-form objects;
placing a raw material containing at least wire-form objects and plate-form objects onto the filter; and
vibrating the filter to sieve out the wire-form objects under the filter while pressing the raw material on the filter from above from between the fixed end and the free end to the free end by the sheet-shaped material.

8. The method for processing the electronic/electrical apparatus component scrap according to claim 7 , wherein the wire-form scrap contains coated wires.

9. A device for removing wire-form objects, the device comprising:
a vibrating sieve machine;
a filter comprising a plurality of rods extending at distances in a feed direction of a raw material disposed in the vibrating sieve machine;
a vibration applying unit for applying vibration to the filter; and
a sheet-shaped pressing member comprising a sheet-shaped material having elasticity provided on the filter, the sheet-shaped material extending from a feed side of the raw material to a discharge side of the raw material, the sheet-shaped material suspended from a feed side of the raw material toward a discharge side of the raw material, the sheet-shaped material having a fixed end that is fixed to the vibrating sieve machine on the feed side of the raw material and the sheet-shaped material having a free end that is not fixed to the vibrating sieve machine on the discharge side, the free end allowing to move according to the shape and vibration of the raw material on the filter, the sheet-shaped material configured to directly contact and press upon the wire-form objects,
wherein a raw material which comprises at least wire-form objects and plate-form objects is placed onto the filter, and the filter is vibrated to sieve out the wire-form objects under the filter while the raw material is pressed on the filter from between the fixed end and the free end to the free end by the pressing member.

10. The device for removing the wire-form objects according to claim 9 , wherein the fixed end is fixed to an upper portion of a feed port for feeding the raw material to an upper surface of the filter, and the pressing member is suspended from the feed side toward the discharge side of the raw material with the fixed end as a starting point, and wherein the free end of the pressing member is movable in an up-down direction while pressing the raw material against the upper surface of the filter on the discharge side of the raw material.

11. The device for removing the wire-form objects according to claim 9 , wherein the vibrating sieve machine comprises a flat plate-shaped table arranged on an upstream side of the filter, and wherein the raw material fed onto an upper surface of the table is vibrated to disperse the raw material on the upper surface of the table, and the dispersed raw material is fed from the upper surface of the table to the upper surface of the filter.

12. The device for removing the wire-form objects according to claim 9 , wherein the raw material is electronic/electrical apparatus component scrap, and wherein the plate-form objects contain substrate scrap, and the wire-form objects contain wire scrap.

13. The method for removing the wire-form objects according to claim 1 , wherein the pressing member has a size that can cover an entire surface of the filter.

14. The method for removing the wire-form objects according to claim 1 , wherein the pressing member is made from a rubber, a resin, a sponge, or a vinyl sheet and has a thickness of about 2 mm to 20 mm to cover the raw material provided on the filter.

15. The method for removing the wire-form objects according to claim 1 , wherein the pressing member presses the raw material b

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Aoki Katsushi
• Sasaoka Hidetoshi

Classifications

• B07B1/12

  Apparatus having only parallel elements · CPC title

• B07B1/4609

  constructional details of screening surfaces or meshes · CPC title

• B07B1/40 Primary

  Resonant vibration screens · CPC title

• B07B1/36 Primary

  jigging or moving to-and-fro in more than one direction · CPC title

• B07B13/003 Primary

  Separation of articles by differences in their geometrical form or by difference in their physical properties, e.g. elasticity, compressibility, hardness · CPC title