Method for manufacturing piezoelectric instrumentation devices with 3D structures using additive manufacturing

US11545615B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11545615-B2
Application numberUS-202017015884-A
CountryUS
Kind codeB2
Filing dateSep 9, 2020
Priority dateSep 9, 2020
Publication dateJan 3, 2023
Grant dateJan 3, 2023

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  1. Title

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  2. Abstract

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for fabricating a piezoelectric transducer includes depositing a layer of a piezoelectric material on a base using a depositor and applying an electric field to the layer of deposited piezoelectric material in defined locations using an electrode to sinter and pole the deposited piezoelectric material at those defined locations to form a layer of the piezoelectric transducer in a selected shape and with a selected dipole direction.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for fabricating a piezoelectric transducer, the method comprising: depositing a layer of a piezoelectric material on a base using a depositor; applying an electric field to the layer of deposited piezoelectric material in defined locations using an electrode to sinter and pole the deposited piezoelectric material at those defined locations to form a layer of the piezoelectric transducer in a selected shape and with a selected dipole direction; and iterating the depositing and the applying to build up another layer of the piezoelectric material to provide the piezoelectric transducer having multiple layers of the piezoelectric material in a selected three-dimensional shape of the multiple layers. 2. The method according to claim 1 , further comprising depositing a layer of conductive material and applying the electric field wherein the defined locations to which the electric field is applied forms an electric lead, the piezoelectric transducer comprising multiple layers of the piezoelectric material and an electric lead. 3. The method according to claim 2 , further comprising securing the piezoelectric transducer in a housing or sub configured for being disposed in a borehole penetrating a subsurface formation, the housing or sub comprising a material compatible with a downhole environment. 4. The method according to claim 1 , wherein applying an electric field comprises moving the electrode to a selected distance from the layer of a piezoelectric material such that a current of a selected value flows between the electrode and the base. 5. The method according to claim 1 , wherein applying an electric field comprises applying the electric field in an atmosphere of an inert gas. 6. The method according to claim 1 , wherein depositing comprises flowing the piezoelectric material in powder form from a reservoir to a spreader configured to move across the base. 7. The method according to claim 6 , wherein the layer of a piezoelectric material has a selected thickness. 8. The method according to claim 1 , wherein the electrode has a defined cross-sectional area to produce the sintering and poling over the defined cross-sectional area.

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What does patent US11545615B2 cover?
A method for fabricating a piezoelectric transducer includes depositing a layer of a piezoelectric material on a base using a depositor and applying an electric field to the layer of deposited piezoelectric material in defined locations using an electrode to sinter and pole the deposited piezoelectric material at those defined locations to form a layer of the piezoelectric transducer in a selec…
Who is the assignee on this patent?
Yogeswaren Elan, Sakthivel Navin, Fanini Otto, and 1 more
What technology area does this patent fall under?
Primary CPC classification H01L41/257. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 03 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).