Light-emitting module and method of manufacturing light-emitting module
US-2022209079-A1 · Jun 30, 2022 · US
US11545473B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11545473-B2 |
| Application number | US-202117207481-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 19, 2021 |
| Priority date | Mar 24, 2020 |
| Publication date | Jan 3, 2023 |
| Grant date | Jan 3, 2023 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A light-emitting device according to the present invention comprises: a mounting board; a plurality of light-emitting elements that each include a supporting substrate and a semiconductor structure layer, the supporting substrate being disposed on the mounting board, and the semiconductor structure layer being formed on the supporting substrate and including a light-emitting layer, a wavelength conversion member that covers the plurality of light-emitting elements above the light-emitting elements and converts a wavelength of a light emitted from the light-emitting layer; a translucent member that covers a lower surface of the wavelength conversion member and covers the semiconductor structure layer on the supporting substrate; and a resin member filled between the plurality of light-emitting elements, the resin member being formed of a resin material containing particles having a light reflectivity. The translucent member includes a thin film portion having a constant film thickness between the wavelength conversion member and the resin member in a region between the plurality of light-emitting elements, and the constant film thickness is smaller than a distance between a top surface of the supporting substrate and a lower surface of the wavelength conversion member.
Opening claim text (preview).
What is claimed is: 1. A light-emitting device comprising: a mounting board; a plurality of light-emitting elements that each include a supporting substrate and a semiconductor structure layer, the supporting substrate being disposed on the mounting board, and the semiconductor structure layer being formed on the supporting substrate and including a light-emitting layer; a wavelength conversion member that covers the plurality of light-emitting elements above the light-emitting elements and converts a wavelength of a light emitted from the light-emitting layer; a translucent member that covers a lower surface of the wavelength conversion member and covers the semiconductor structure layer on the supporting substrate; and a resin member filled between the plurality of light-emitting elements, the resin member being formed of a resin material containing particles having a light reflectivity, wherein: the translucent member includes a thin film portion having a constant film thickness between the wavelength conversion member and the resin member in a region between the plurality of light-emitting elements, and the constant film thickness is smaller than a distance between a top surface of the supporting substrate and a lower surface of the wavelength conversion member. 2. The light-emitting device according to claim 1 , wherein the thin film portion has a thickness smaller than a distance between a top surface of the light-emitting element and the lower surface of the wavelength conversion member. 3. The light-emitting device according to claim 1 , wherein the resin member extends toward the semiconductor structure layer from an end portion of one light-emitting element and covers a part of the top surface of the supporting substrate in the top surface of the supporting substrate, and the end portion faces an adjacent light-emitting element. 4. The light-emitting device according to claim 1 , wherein in one region opposing the region between the plurality of light-emitting elements in the lower surface of the wavelength conversion member, a surface roughness is large compared with another region. 5. The light-emitting device according to claim 1 , wherein a plurality of grooves are formed in a region opposing a region between two adjacent light-emitting elements in the lower surface of the wavelength conversion member. 6. The light-emitting device according to claim 5 , wherein the plurality of grooves are formed to be parallel to a line connecting centers of the two adjacent light-emitting elements. 7. The light-emitting device according to claim 1 , wherein: in the lower surface of the wavelength conversion member, a surface area ratio is in a range of 105% or more and 150% or less, assuming that the surface area ratio is 100% when the lower surface of the wavelength conversion member is a perfect mirrored surface, and the surface area ratio is a ratio of an actual surface area of the lower surface to a mirrored surface area of the lower surface expressed as a percentage.
Package configurations · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Related publications grouped by family.
Answers are generated from the same data shown on this page.