Light-emitting device

US11545473B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11545473-B2
Application numberUS-202117207481-A
CountryUS
Kind codeB2
Filing dateMar 19, 2021
Priority dateMar 24, 2020
Publication dateJan 3, 2023
Grant dateJan 3, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A light-emitting device according to the present invention comprises: a mounting board; a plurality of light-emitting elements that each include a supporting substrate and a semiconductor structure layer, the supporting substrate being disposed on the mounting board, and the semiconductor structure layer being formed on the supporting substrate and including a light-emitting layer, a wavelength conversion member that covers the plurality of light-emitting elements above the light-emitting elements and converts a wavelength of a light emitted from the light-emitting layer; a translucent member that covers a lower surface of the wavelength conversion member and covers the semiconductor structure layer on the supporting substrate; and a resin member filled between the plurality of light-emitting elements, the resin member being formed of a resin material containing particles having a light reflectivity. The translucent member includes a thin film portion having a constant film thickness between the wavelength conversion member and the resin member in a region between the plurality of light-emitting elements, and the constant film thickness is smaller than a distance between a top surface of the supporting substrate and a lower surface of the wavelength conversion member.

First claim

Opening claim text (preview).

What is claimed is: 1. A light-emitting device comprising: a mounting board; a plurality of light-emitting elements that each include a supporting substrate and a semiconductor structure layer, the supporting substrate being disposed on the mounting board, and the semiconductor structure layer being formed on the supporting substrate and including a light-emitting layer; a wavelength conversion member that covers the plurality of light-emitting elements above the light-emitting elements and converts a wavelength of a light emitted from the light-emitting layer; a translucent member that covers a lower surface of the wavelength conversion member and covers the semiconductor structure layer on the supporting substrate; and a resin member filled between the plurality of light-emitting elements, the resin member being formed of a resin material containing particles having a light reflectivity, wherein: the translucent member includes a thin film portion having a constant film thickness between the wavelength conversion member and the resin member in a region between the plurality of light-emitting elements, and the constant film thickness is smaller than a distance between a top surface of the supporting substrate and a lower surface of the wavelength conversion member. 2. The light-emitting device according to claim 1 , wherein the thin film portion has a thickness smaller than a distance between a top surface of the light-emitting element and the lower surface of the wavelength conversion member. 3. The light-emitting device according to claim 1 , wherein the resin member extends toward the semiconductor structure layer from an end portion of one light-emitting element and covers a part of the top surface of the supporting substrate in the top surface of the supporting substrate, and the end portion faces an adjacent light-emitting element. 4. The light-emitting device according to claim 1 , wherein in one region opposing the region between the plurality of light-emitting elements in the lower surface of the wavelength conversion member, a surface roughness is large compared with another region. 5. The light-emitting device according to claim 1 , wherein a plurality of grooves are formed in a region opposing a region between two adjacent light-emitting elements in the lower surface of the wavelength conversion member. 6. The light-emitting device according to claim 5 , wherein the plurality of grooves are formed to be parallel to a line connecting centers of the two adjacent light-emitting elements. 7. The light-emitting device according to claim 1 , wherein: in the lower surface of the wavelength conversion member, a surface area ratio is in a range of 105% or more and 150% or less, assuming that the surface area ratio is 100% when the lower surface of the wavelength conversion member is a perfect mirrored surface, and the surface area ratio is a ratio of an actual surface area of the lower surface to a mirrored surface area of the lower surface expressed as a percentage.

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What does patent US11545473B2 cover?
A light-emitting device according to the present invention comprises: a mounting board; a plurality of light-emitting elements that each include a supporting substrate and a semiconductor structure layer, the supporting substrate being disposed on the mounting board, and the semiconductor structure layer being formed on the supporting substrate and including a light-emitting layer, a wavelength…
Who is the assignee on this patent?
Stanley Electric Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 03 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).