Copper alloy wire, cable, and method of manufacturing copper alloy wire

Patent metadata

Field	Value
Publication number	US-11545277-B2
Application number	US-201916538106-A
Country	US
Kind code	B2
Filing date	Aug 12, 2019
Priority date	Aug 30, 2018
Publication date	Jan 3, 2023
Grant date	Jan 3, 2023

Abstract

Bendability of a copper alloy wire is improved without decrease in an electrical conductivity of the copper alloy wire made of copper alloy containing zirconium. A cable includes: a two-core stranded wire formed by intertwining two electrical wires made of a conductor and an insulating layer covering the conductor; a filler formed around the two-core stranded wire; and a sheath formed around the filler and the electrical wire. The conductor is a copper alloy wire in which a precipitate containing the zirconium disperses, and has a crystal gain diameter that is equal to or smaller than 1 μm, an electrical conductivity that is equal to or higher than 87% IACS, and a tensile stress that is equal to or larger than 545 MPa.

First claim

What is claimed is:

1. A method of manufacturing a copper alloy wire comprising the steps of:
(a) performing a solid-solution treatment to a copper material having a state in which zirconium is solid-solved in copper to form the copper material having a supersaturated solid solution state;
(b) after the step (a), elongating the copper material having the supersaturated solid solution state to form a first wire material;
(c) after the step (b), performing a thermal treatment to the first wire material to form a first copper alloy wire;
(d) after the step (c), elongating the first copper alloy wire to form a second wire material; and
(e) after the step (d), performing a thermal treatment to the second wire material to form a second copper alloy wire having a copper crystal grain diameter that is equal to or smaller than 1 μm,
wherein, in the step (a), water cooling is performed so that a temperature of the copper material that is 800 to 850° C. goes down to about 15 to 20° C. for 5 to 10 seconds,
wherein, in the step (c), a precipitate containing the zirconium is deposited in the first copper alloy wire,
wherein, in the step (d), the precipitate is dispersed in the second copper alloy wire,
wherein, in the step (e), a thermal treatment is performed to the second wire material at 350 to 400° C. to deposit a precipitate containing the zirconium in the second copper alloy wire,
wherein a content rate of the zirconium in the copper material is equal to or larger than 1000 ppm by weight and equal to or smaller than 2000 ppm by weight,
wherein, when a diameter of the second copper alloy wire is 0.05 mm or more and 0.20 mm or less, an electrical conductivity of the second copper alloy wire is equal to or higher than 87% IACS,
wherein, when the diameter of the second copper alloy wire is 0.05 mm or more and 0.20 mm or less, a tensile stress of the second copper alloy wire is equal to or larger than 545 MPa,
wherein the copper material does not contain chromium,
wherein the first wire material does not contain chromium,
wherein the first copper alloy wire does not contain chromium,
wherein the second wire material does not contain chromium, and
wherein the second copper alloy wire does not contain chromium.

2. The method of manufacturing the copper alloy wire according to claim 1 ,
wherein, in the step (c), the thermal treatment is performed to the first wire material at 350 to 400° C.

Assignees

• Hitachi Metals Ltd

Inventors

• Takahashi Kazuhisa
• Hata Shohei
• Kuroda Hiromitsu
• Sumi Toru
• Nishi Kazuya
• Fujito Keisuke
• Tuji Takayuki

Classifications

• H01B1/026 Primary

  Alloys based on copper · CPC title

• C22F1/08 Primary

  of copper or alloys based thereon · CPC title

• C22C9/00 Primary

  Alloys based on copper · CPC title

• B21C1/003

  Drawing materials of special alloys so far as the composition of the alloy requires or permits special drawing methods or sequences · CPC title

• H01B13/0016

  for heat treatment · CPC title