Sealing material and multilayered glass panel using same

Patent metadata

Field	Value
Publication number	US-11542192-B2
Application number	US-201816767473-A
Country	US
Kind code	B2
Filing date	Nov 1, 2018
Priority date	Nov 28, 2017
Publication date	Jan 3, 2023
Grant date	Jan 3, 2023

Abstract

The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content.

First claim

The invention claimed is:

1. A sealing material for a seal part comprising:
lead-free low melting glass particles containing vanadium oxide and tellurium oxide;
low thermal expansion filler particles; and
glass beads as a solid content,
wherein a volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%; and
a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler particles in the solid content,
and the sealing material for the seal part is interposed between a first glass substrate and a second glass substrate of a multilayered glass panel;
wherein an average diameter (D 50 ) of the glass beads is not less than 50 μm to not more than 200 μm;
wherein an average particle size of the low thermal expansion filler particle is not less than 3 μm to not more than 20 μm; and
wherein the glass beads are formed of borosilicate glass or quartz glass.

2. The sealing material according to claim 1 ,
wherein a volume fraction of the glass beads in the solid content is not less than 20% to not more than 30%.

3. The sealing material according to claim 1 ,
wherein a volume fraction of the lead-free low melting glass particles in the solid content is not less than 35%.

4. The sealing material according to claim 1 ,
wherein the lead-free low melting glass particles further contain silver oxide.

5. The sealing material according to claim 1 ,
wherein the lead-free low melting glass particles further contain at least one kind of tungsten oxide, barium oxide, potassium oxide, and phosphorus oxide.

6. The sealing material according to claim 1 ,
wherein the lead-free low melting glass particles further contain at least one kind of aluminum oxide, iron oxide, yttrium oxide, and lanthanum oxide.

7. The sealing material according to claim 1 ,
wherein the low thermal expansion filler particles include zirconium phosphate tungstate.

8. The sealing material according to claim 1 ,
further comprising a solvent and a binder resin.

9. The sealing material according to claim 8 ,
wherein the binder resin contains at least one kind of ethyl cellulose, nitrocellulose, and aliphatic polycarbonate.

10. The sealing material according to claim 8 ,
wherein the solvent contains at least one kind of butyl carbitol acetate, a terpene solvent, and propylene carbonate.

11. A multilayered glass panel comprising:
a first glass substrate;
a second glass substrate placed so as to face the first glass substrate at a predetermined distance;
spacers interposed between the first glass substrate and the second glass substrate and keeping the distance; and
a seal part interposed between the first glass substrate and the second glass substrate,
having an interior space surrounded by the first glass substrate, the second glass substrate, and the seal part,
wherein the spacers are placed in the interior space; and
the seal part contains the sealing material according to claim 1 , and the sealing material for the seal part is disposed on the seal part.

12. The multilayered glass panel according to claim 11 ,
wherein a maximum diameter of the glass beads is not larger than the distance; and
an average diameter (D 50 ) of the glass beads is not smaller than half of the distance.

13. The multilayered glass panel according to claim 11 ,
wherein a thermal expansion coefficient of the glass beads is in a range of ±15×10 −7 /° C. of a thermal expansion coefficient of the first glass substrate or the second glass substrate.

14. The multilayered glass panel according to claim 11 ,
wherein the spacers contain a resin.

15. The multilayered glass panel according to claim 14 ,
wherein the resin contains at least one kind of polyimide resin, polyamide resin, fluororesin, epoxy resin, phenoxy resin, and silicone resin.

16. The multilayered glass panel according to claim 14 ,
wherein the spacers contain glass particles or ceramic particles.

17. The multilayered glass panel according to claim 11 ,
wherein the first glass substrate or the second glass substrate includes tempered glass subjected to an air-cool tempering treatment or a chemical tempering treatment.

Assignees

• Showa Denko Materials Co Ltd

Inventors

• Naito Takashi
• Tachizono Shinichi
• Yoshimura Kei
• Hashiba Yuji
• Suzuki Hironori
• Onodera Taigo
• Miyake Tatsuya
• Konno Akitoyo

Classifications

• C03C8/08

  containing phosphorus · CPC title

• B32B17/10137

  Chemical strengthening · CPC title

• E06B3/6736

  Heat treatment (for soldering E06B3/67334) · CPC title

• E06B3/66304

  Discrete spacing elements, e.g. for evacuated glazing units · CPC title

• E06B3/6612 Primary

  Evacuated glazing units · CPC title